Surface-mount thin-profile capacitor and method of producing the same
    11.
    发明授权
    Surface-mount thin-profile capacitor and method of producing the same 有权
    表面贴装薄型电容器及其制造方法

    公开(公告)号:US07113390B2

    公开(公告)日:2006-09-26

    申请号:US11037509

    申请日:2005-01-18

    IPC分类号: H01G9/00

    CPC分类号: H01G9/055 Y10T29/417

    摘要: In a surface-mount thin-profile capacitor including an aluminum foil as a base member composed of an aluminum core and a pair of etched layers covering opposite surfaces of the aluminum core, a resist resin is formed at a boundary between an anode as each of opposite end portions of the aluminum foil and a cathode formed at a center area of each of opposite surfaces of the aluminum foil. The resist resin separates and isolates the etched layer on the side of the anode and a conductive polymer layer from each other. If a part of the conductive polymer layer climbs up onto the resist resin, the climbing part of the conductive polymer layer is covered with an additional resist resin.

    摘要翻译: 在包括由铝芯构成的铝箔和覆盖铝芯的相对表面的一对蚀刻层的表面安装薄型电容器中,在阳极之间的边界处形成抗蚀剂树脂, 铝箔的相对端部和形成在铝箔的每个相对表面的中心区域的阴极。 抗蚀树脂将阳极侧的蚀刻层与导电性聚合物层分离并分离。 如果导电聚合物层的一部分上升到抗蚀剂树脂上,则导电聚合物层的攀登部分被另外的抗蚀剂树脂覆盖。

    Surface-mount thin-profile capacitor and method of producing the same
    12.
    发明申请
    Surface-mount thin-profile capacitor and method of producing the same 有权
    表面贴装薄型电容器及其制造方法

    公开(公告)号:US20050162814A1

    公开(公告)日:2005-07-28

    申请号:US11037509

    申请日:2005-01-18

    CPC分类号: H01G9/055 Y10T29/417

    摘要: In a surface-mount thin-profile capacitor including an aluminum foil as a base member composed of an aluminum core and a pair of etched layers covering opposite surfaces of the aluminum core, a resist resin is formed at a boundary between an anode as each of opposite end portions of the aluminum foil and a cathode formed at a center area of each of opposite surfaces of the aluminum foil. The resist resin separates and isolates the etched layer on the side of the anode and a conductive polymer layer from each other. If a part of the conductive polymer layer climbs up onto the resist resin, the climbing part of the conductive polymer layer is covered with an additional resist resin.

    摘要翻译: 在包括由铝芯构成的铝箔和覆盖铝芯的相对表面的一对蚀刻层的表面安装薄型电容器中,在阳极之间的边界处形成抗蚀剂树脂, 铝箔的相对端部和形成在铝箔的每个相对表面的中心区域的阴极。 抗蚀树脂将阳极侧的蚀刻层与导电性聚合物层分离并分离。 如果导电聚合物层的一部分上升到抗蚀剂树脂上,则导电聚合物层的攀登部分被另外的抗蚀剂树脂覆盖。

    Thin-type surface-mount capacitor
    13.
    发明申请
    Thin-type surface-mount capacitor 失效
    薄型表面贴装电容器

    公开(公告)号:US20050013093A1

    公开(公告)日:2005-01-20

    申请号:US10891203

    申请日:2004-07-13

    摘要: A thin-type surface-mount capacitor is a solid electrolytic capacitor. The capacitor includes a capacitor element having an anode body in the form of a plate-like or foil-like valve-action metal that is area-increased, and a conductive functional polymer film used as a solid electrolyte. The capacitor further includes thermal adhesive insulating resin impregnated tapes that are stuck to the capacitor element on upper and lower sides thereof, and an element reinforcing metal plate and a solderable cathode terminal metal plate 67 that are stuck to the tapes, respectively. The capacitor is finally formed by applying a curing treatment under high temperature and pressure. Each of the metal plates is applied with a stepping process that provides a difference in level corresponding to a predetermined thickness.

    摘要翻译: 薄型表面贴装电容器是固体电解电容器。 电容器包括电容器元件,其具有面积增加的板状或箔状阀作用金属形式的阳极体和用作固体电解质的导电功能聚合物膜。 电容器还包括粘附到电容器元件的上侧和下侧的热粘合绝缘树脂浸渍带,以及分别粘附在带上的元件加强金属板和可焊接阴极端子金属板67。 最后通过在高温高压下进行固化处理形成电容器。 每个金属板被施加有提供对应于预定厚度的水平差的步进过程。

    Solid electrolytic capacitor
    14.
    发明授权
    Solid electrolytic capacitor 有权
    固体电解电容器

    公开(公告)号:US09007743B2

    公开(公告)日:2015-04-14

    申请号:US13446265

    申请日:2012-04-13

    摘要: Provided is a solid electrolytic capacitor that is excellent in productivity, has improved volumetric efficiency aiming for capacity increase, a stable fillet shape when mounted, and has excellent ESL characteristics. Included is a capacitor stack element composed of a stack of capacitor elements. The capacitor element includes one anode part of an anode body made of linear, foil-like, or plate-like valve metal and a cathode part composed of dielectric, solid electrolyte, graphite, and silver paste layers, which are sequentially formed to another surface of the anode body separated by insulating resin. A fillet formation part with a recessed part is provided to an end surface of anode and cathode terminals of a mounting electrode side of a first direction end surface of the electrode substrate to which the capacitor stack element is mounted. Further, the anode and cathode terminals for element connection reach the end surface of the first direction.

    摘要翻译: 提供一种生产率优异的固体电解电容器,具有提高容量增加的体积效率,安装时的稳定的圆角形状,并且具有优异的ESL特性。 包括由电容器元件的堆叠组成的电容器堆叠元件。 电容器元件包括由直线状,箔状或板状阀金属制成的阳极体的一个阳极部分和由电介质,固体电解质,石墨和银浆层构成的阴极部分,其顺序地形成于另一表面 的绝缘树脂隔开的阳极体。 在安装有电容器叠层元件的电极基板的第一方向端面的安装电极侧的阳极和阴极端子的端面设置有具有凹部的圆角形状部。 此外,用于元件连接的阳极和阴极端子到达第一方向的端面。

    Electronic component mounting apparatus
    15.
    发明授权
    Electronic component mounting apparatus 有权
    电子元件安装装置

    公开(公告)号:US08336195B2

    公开(公告)日:2012-12-25

    申请号:US12727349

    申请日:2010-03-19

    IPC分类号: B23P19/00

    摘要: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

    摘要翻译: 本发明涉及即使使用连接带连接的存储带的接缝处的部件存储部分中的电子部件的可靠的拾取操作,并且防止电子部件的拾取速率的降低。 CPU向组件供给单元发送进给命令以执行部件供给操作等。 然后,当CPU判断连接带到达拾取位置时,CPU驱动X轴驱动电动机和Y轴驱动电动机将板识别摄像机移动到馈送单元的拾取位置,摄像机拍摄图像 存储带的存储部分,以及识别处理装置执行识别处理。 将基于该识别处理的结果的校正值存储在RAM中,并且考虑到该校正值移动吸嘴并降低拾取电子部件。

    Electronic component mounting method
    17.
    发明授权
    Electronic component mounting method 有权
    电子元件安装方法

    公开(公告)号:US08181337B2

    公开(公告)日:2012-05-22

    申请号:US12349249

    申请日:2009-01-06

    IPC分类号: H01R43/00

    摘要: A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.

    摘要翻译: 将电子部件安装在印刷电路板上的方法包括提供包括第一部分和第二部分的存储带,所述第一部分和第二部分通过连接带连接并包含存储在其中的电子部件,使存储带前进,使得电子部件前进到 部件拾取位置,其中电子部件由吸嘴吸取,通过吸嘴从部件拾取位置拾起高级电子部件,并将拾取的电子部件安装在印刷电路板上。 重复存储带的推进,电子部件的拾取和电子部件的安装,并且当存储带的第二部分前进到部件拾取位置时,调整部件拾取位置。

    ELECTRONIC COMPONENT MOUNTING APPARATUS
    18.
    发明申请
    ELECTRONIC COMPONENT MOUNTING APPARATUS 有权
    电子元件安装设备

    公开(公告)号:US20090119912A1

    公开(公告)日:2009-05-14

    申请号:US12349249

    申请日:2009-01-06

    IPC分类号: H05K3/30

    摘要: This invention is directed to prevention of reduction of a pickup rate of an electronic component when a component feeding unit is dismounted from a feeder base and mounted back thereon. A CPU sends a feeding command to a component feeding unit feeding an electronic component belonging to a first step number, and drives a servomotor and a drive motor of the feeding unit to perform a component feeding operation and so on. After then, when the CPU judges that the feeding unit is dismounted from the feeder base and mounted back thereon, the CPU drives a X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing to the image. A correction value based on this recognition result is stored in a RAM, the X axis drive motor and the Y axis drive motor are driven taking this correction value into account, a vertical axis drive motor is driven, and a suction nozzle lowers and picks up the electronic component.

    摘要翻译: 本发明涉及防止当将元件供给单元从供料器基座上拆下并安装在其上时降低电子元件的拾取速度。 CPU向馈送属于第一步骤的电子部件的部件供给部发送进给命令,驱动供给部的伺服马达和驱动马达进行部件供给动作等。 然后,当CPU判断进给单元从进料器基座上卸下并安装在其上时,CPU驱动X轴驱动电机和Y轴驱动电机将板识别摄像机移动到进给单元的拾取位置 相机拍摄存储带的存储部分的图像,并且识别处理装置对图像执行识别处理。 基于该识别结果的校正值存储在RAM中,考虑到该修正值来驱动X轴驱动电动机和Y轴驱动电动机,驱动垂直轴驱动电动机,吸嘴降低并取出 电子元件。

    Thin-type surface-mount capacitor
    19.
    发明授权

    公开(公告)号:US06920035B2

    公开(公告)日:2005-07-19

    申请号:US10891203

    申请日:2004-07-13

    IPC分类号: H01G9/012 H01G9/00 H01G9/15

    摘要: A thin-type surface-mount capacitor is a solid electrolytic capacitor. The capacitor includes a capacitor element having an anode body in the form of a plate-like or foil-like valve-action metal that is area-increased, and a conductive functional polymer film used as a solid electrolyte. The capacitor further includes thermal adhesive insulating resin impregnated tapes that are stuck to the capacitor element on upper and lower sides thereof, and an element reinforcing metal plate and a solderable cathode terminal metal plate 67 that are stuck to the tapes, respectively. The capacitor is finally formed by applying a curing treatment under high temperature and pressure. Each of the metal plates is applied with a stepping process that provides a difference in level corresponding to a predetermined thickness.

    Apparatus for mounting electronic components
    20.
    发明授权
    Apparatus for mounting electronic components 失效
    用于安装电子部件的装置

    公开(公告)号:US06792674B2

    公开(公告)日:2004-09-21

    申请号:US09968717

    申请日:2001-10-02

    IPC分类号: B23P1900

    摘要: A recognition camera images an electronic component, and a recognition processing unit performs recognition processing of the electronic component based on the result of the imaging. The recognition processing is performed using the component data of group 1 data, group 2 data, group 3 data, and group 4 data that are stored for the images taken in a random access memory (RAM). The group 1 data is used for lead inspection (for inspecting positioning error and bending of the lead), the group 2 data and the group 3 data are used for calculating amounts of adjustment in the X and Y directions, and the group 4 data is used for calculating the amount of adjustment in the &thgr; direction. This makes it possible to mount accurately components with pins and extrusions extruded from the molding, such as connectors, such that the pins and extrusions are accurately engaged with the holes formed in a print board.

    摘要翻译: 识别摄像机对电子部件进行成像,识别处理部根据成像结果进行电子部件的识别处理。 使用为在随机存取存储器(RAM)中拍摄的图像存储的组1数据,组2数据,组3数据和组4数据的分量数据来执行识别处理。 组1数据用于铅检(用于检查定位误差和引线弯曲),组2数据和组3数据用于计算X和Y方向的调整量,组4数据为 用于计算θ方向的调整量。 这使得可以通过诸如连接器的模制件挤出的销和挤出物准确地安装部件,使得销和挤出件与形成在印刷板上的孔精确地接合。