公开(公告)号：US10109428B2

公开(公告)日：2018-10-23

申请号：US15672000

申请日：2017-08-08

Applicant: KEMET Electronics Corporation

Inventor： Yaru Shi ,  Antony P. Chacko ,  Hong Zhang ,  Qingping Chen ,  Lei Xu ,  Yang Jin ,  Zhen Wu

IPC: H01G9/042 ,  H01G9/15 ,  C09D5/24 ,  H01G9/00 ,  H01G9/012 ,  H01G9/07 ,  H01G9/025 ,  H01G9/028 ,  H01G9/052

Abstract: A method for forming a capacitor, a capacitor formed thereby and an improved composition for a conductive coating are described. The method includes providing an anode, forming a dielectric on the anode and forming a cathode layer over the dielectric by applying a monoamine, a weak acid and a conductive polymer.

公开(公告)号：US20180211788A1

公开(公告)日：2018-07-26

申请号：US15897276

申请日：2018-02-15

Applicant: KEMET Electronics Corporation

Inventor： Yang Jin ,  Qingping Chen

IPC: H01G9/00 ,  C25B3/00 ,  C08G75/06 ,  C23C28/00 ,  C07D409/14 ,  H01G4/00 ,  H01G11/00

CPC classification number: C23C28/00 ,  C07D409/14 ,  C08G75/06 ,  C25B3/00 ,  H01G9/0425 ,  H01G9/15

Abstract: An improved process for forming a conjugated thiophene precursor is described as in the formation of an improved polymer prepared from the conjugated thiophene and an improved capacitor formed from the improved polymer. The improved process includes forming a thiophene mixture comprising thiophene monomer, unconjugated thiophene oligomer, optionally a solvent and heating the thiophene mixture at a temperature of at least 100° C. to no more than the lower of 250° C. or the boiling point of a component of said thiophene mixture with the lowest boiling point temperature.

公开(公告)号：US20170338047A1

公开(公告)日：2017-11-23

申请号：US15595137

申请日：2017-05-15

Applicant: KEMET Electronics Corporation

Inventor： Ajaykumar Bunha ,  Antony P. Chacko ,  Yaru Shi ,  Qingping Chen ,  Philip M. Lessner

IPC: H01G9/042 ,  H01G9/15 ,  H01M4/137 ,  H01G9/00 ,  H01G9/04 ,  H01M4/136

CPC classification number: H01G9/042 ,  H01G9/0036 ,  H01G9/04 ,  H01G9/15 ,  H01G2009/0014 ,  H01G2009/0404 ,  H01M4/136 ,  H01M4/137

Abstract: A capacitor and a method of making a capacitor, is provided with improved reliability performance. The capacitor comprises an anode; a dielectric on the anode; and a cathode on the dielectric wherein the cathode comprises a conductive polymer and a polyanion wherein the polyanion is a copolymer comprising groups A, B and C represented by Formula AxByCz as described herein.

公开(公告)号：US20140061284A1

公开(公告)日：2014-03-06

申请号：US14018001

申请日：2013-09-04

Applicant: Kemet Electronics Corporation

Inventor： Steven C. Hussey ,  Yuri Freeman ,  Philip M. Lessner ,  Qingping Chen ,  Javaid Qazi

IPC: H01G13/00

CPC classification number: H01G13/00 ,  B23K2101/38 ,  H01G9/012 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/06 ,  H01G9/08 ,  H01G9/15

Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.

Abstract translation: 一种用于提供改进的密封电容器的方法，包括以下步骤：将焊料和助焊剂施加到壳体的内表面; 将焊料流到内表面上; 去除焊剂，从而形成焊剂耗尽的焊料; 将电容元件插入壳体中; 回流焊剂消耗的焊料，从而在外壳和可焊层之间形成焊接接头; 并密封外壳。

公开(公告)号：US10658121B2

公开(公告)日：2020-05-19

申请号：US15787126

申请日：2017-10-18

Applicant: KEMET Electronics Corporation

Inventor： Ajaykumar Bunha ,  Antony P. Chacko ,  Qingping Chen ,  Yaru Shi ,  Philip M. Lessner

IPC: H01G9/00 ,  H01G9/042 ,  C09D5/24 ,  C09D165/00 ,  C09D4/06 ,  C09D125/18 ,  C09D7/65 ,  H01G9/15 ,  H01G9/025

Abstract: A capacitor and process for forming the capacitor, is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.

公开(公告)号：US20200152393A1

公开(公告)日：2020-05-14

申请号：US16741105

申请日：2020-01-13

Applicant: KEMET Electronics Corporation

Inventor： Yaru Shi ,  Antony P. Chacko ,  Ajaykumar Bunha ,  Qingping Chen ,  Elisabeth Crittendon Key

IPC: H01G9/15 ,  H01G9/042 ,  H01G9/00 ,  H01G9/08 ,  H01G11/48 ,  H01G9/028

Abstract: Provided is an improved capacitor formed by a process comprising: providing an anode comprising a dielectric thereon wherein the anode comprises a sintered powder wherein the powder has a powder charge of at least 45,000 μFV/g; and forming a first conductive polymer layer encasing at least a portion of the dielectric by applying a first slurry wherein the first slurry comprises a polyanion and a conductive polymer and wherein the polyanion and conductive polymer are in a weight ratio of greater than 3 wherein the conductive polymer and polyanion forms conductive particles with an average particle size of no more than 20 nm.

公开(公告)号：US20190311857A1

公开(公告)日：2019-10-10

申请号：US16435762

申请日：2019-06-10

Applicant: KEMET Electronics Corporation

Inventor： Ajaykumar Bunha ,  Antony P. Chacko ,  Yaru Shi ,  Qingping Chen ,  Philip M. Lessner

IPC: H01G9/00 ,  H01G9/042 ,  C09D125/18 ,  C09D5/24 ,  C09D4/06 ,  C09D165/00 ,  C08F212/14 ,  C08F12/30 ,  C09D133/14 ,  C09D7/65 ,  H01G9/15 ,  H01G9/025

Abstract: An improved capacitor is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.

公开(公告)号：US20190267194A1

公开(公告)日：2019-08-29

申请号：US16411915

申请日：2019-05-14

Applicant: KEMET Electronics Corporation

Inventor： Ajaykumar Bunha ,  Antony P. Chacko ,  Yaru Shi ,  Qingping Chen ,  Philip M. Lessner

IPC: H01G9/042 ,  H01M4/137 ,  H01G9/15 ,  H01G9/04 ,  H01M4/136 ,  H01G9/00

Abstract: A capacitor and a method of making a capacitor, is provided with improved reliability performance. The capacitor comprises an anode; a dielectric on the anode; and a cathode on the dielectric wherein the cathode comprises a conductive polymer and a polyanion wherein the polyanion is a copolymer comprising groups A, B and C represented by Formula AxByCz as described herein.

公开(公告)号：US09343239B2

公开(公告)日：2016-05-17

申请号：US13896672

申请日：2013-05-17

Applicant: Kemet Electronics Corporation

Inventor： Hong Zhang ,  Qingping Chen ,  Randolph S. Hahn

IPC: H01G9/00 ,  H01G9/028 ,  H01G9/012 ,  H01G9/15

CPC classification number: H01G9/0032 ,  H01G9/0036 ,  H01G9/012 ,  H01G9/028 ,  H01G9/15 ,  Y10T29/417

Abstract: An improved process for forming a capacitor, and improved capacitor formed thereby is described. The process includes: providing an anode comprising a dielectric thereon; applying a first layer of an intrinsically conducting polymer on the dielectric to form a capacitor precursor; applying at least one subsequent layer of an intrinsically conducting polymer on the first layer from a dispersion; and treating the capacitor precursor at a temperature of at least 50° C. no more than 200° C. at a relative humidity of at least 25% up to 100%, or fusing the layered structure by swelling the layered structure with a liquid and at least partially removing the liquid.

Abstract translation: 描述了一种用于形成电容器的改进方法以及由此形成的改进的电容器。 该方法包括：在其上提供包含电介质的阳极; 将第一层本征导电聚合物施加在电介质上以形成电容器前体; 从分散体在第一层上施加至少一个本征导电聚合物的后续层; 并且在至少50℃至不超过200℃的温度下处理电容器前体，相对湿度至少为25％至100％，或者通过用液体使层状结构溶胀而使层状结构熔融， 至少部分地去除液体。

公开(公告)号：US20150124374A1

公开(公告)日：2015-05-07

申请号：US14595502

申请日：2015-01-13

Applicant: Kemet Electronics Corporation

Inventor： Hong Zhang ,  Qingping Chen ,  Randolph S. Hahn

IPC: H01G9/00 ,  H01G9/012 ,  H01G9/15

CPC classification number: H01G9/0032 ,  H01G9/0036 ,  H01G9/012 ,  H01G9/028 ,  H01G9/15 ,  Y10T29/417

Abstract: An improved process for forming a capacitor, and improved capacitor formed thereby is described. The process includes: providing an anode comprising a dielectric thereon; applying a first layer of an intrinsically conducting polymer on the dielectric to form a capacitor precursor; applying at least one subsequent layer of an intrinsically conducting polymer on the first layer from a dispersion; and treating the capacitor precursor at a temperature of at least 50° C. no more than 200° C. at a relative humidity of at least 25% up to 100%, or fusing the layered structure by swelling the layered structure with a liquid and at least partially removing the liquid.

Abstract translation: 描述了一种用于形成电容器的改进方法以及由此形成的改进的电容器。 该方法包括：在其上提供包含电介质的阳极; 将第一层本征导电聚合物施加在电介质上以形成电容器前体; 从分散体在第一层上施加至少一个本征导电聚合物的后续层; 并且在至少50℃至不超过200℃的温度下处理电容器前体，相对湿度至少为25％至100％，或者通过用液体使分层结构溶胀来使层状结构熔融， 至少部分地去除液体。