摘要:
The semiconductor memory device includes a first memory cell array including at least one first memory cell and at least one second memory cell corresponding to the at least one first memory cell, a first low bit line connected to the at least one first memory cell, a first low complementary bit line connected to the at least one second memory cell, a first switch unit having a first terminal connected to the first low bit line, a second switch unit having a first terminal connected to the first low complementary bit line, a first global bit line connected to a second terminal of the first switch unit, a first global complementary bit line connected to a second terminal of the second switch unit, and a plurality of sensing amplifying units connected to the first global bit line and the first global complementary bit line.
摘要:
A nonvolatile semiconductor memory device includes a plurality of pillars protruding upward from a semiconductor substrate and having respective top surfaces and opposing sidewalls, a bit line on the top surfaces of the pillars and connecting a row of the pillars along a first direction, a pair of word lines on the opposing sidewalls of one of the plurality of pillars and crossing beneath the bit line, and a pair of memory layers interposed between respective ones of the pair of word lines and the one of the plurality of pillars. Methods of fabricating a nonvolatile semiconductor memory device include selectively etching a semiconductor substrate to form pluralities of stripes having opposing sidewalls and being arranged along a direction, forming memory layers and word lines along the sidewalls of the stripes selectively etching the stripes to form a plurality of pillars, and forming a bit line connecting the pillars and crossing above the word lines.
摘要:
A multi-level dynamic memory device includes a bit line pair that is divided into a main bit line pair and a sub-bit line pair, first and second sense amplifiers that are connected between the main bit line pair and between the sub-bit line pair, first and second coupling capacitors that are cross-coupled between the main bit pair and the sub-bit pair, respectively; and first and second correction capacitors that are connected in parallel to the first and second coupling capacitors, respectively, and whose capacitance is adjusted by a control voltage signal.
摘要:
A nonvolatile semiconductor memory device includes a plurality of pillars protruding upward from a semiconductor substrate and having respective top surfaces and opposing sidewalls, a bit line on the top surfaces of the pillars and connecting a row of the pillars along a first direction, a pair of word lines on the opposing sidewalls of one of the plurality of pillars and crossing beneath the bit line, and a pair of memory layers interposed between respective ones of the pair of word lines and the one of the plurality of pillars. Methods of fabricating a nonvolatile semiconductor memory device include selectively etching a semiconductor substrate to form pluralities of stripes having opposing sidewalls and being arranged along a direction, forming memory layers and word lines along the sidewalls of the stripes selectively etching the stripes to form a plurality of pillars, and forming a bit line connecting the pillars and crossing above the word lines.
摘要:
A multi-level dynamic memory device includes a bit line pair that is divided into a main bit line pair and a sub-bit line pair, first and second sense amplifiers that are connected between the main bit line pair and between the sub-bit line pair, first and second coupling capacitors that are cross-coupled between the main bit pair and the sub-bit pair, respectively; and first and second correction capacitors that are connected in parallel to the first and second coupling capacitors, respectively, and whose capacitance is adjusted by a control voltage signal.
摘要:
A ball grid array package semiconductor device having improved power line routing. The BGA package semiconductor device includes a semiconductor chip having a plurality of pads along its center, a substrate having a slot of a predetermined size along its center, and a signal line plane including a signal line pattern and a plurality of ball mounts on its one side, with the semiconductor chip being mounted on the other side. A bonding material is inserted between the semiconductor chip and the substrate to fix the semiconductor chip to the substrate. A plurality of balls are mounted on the plurality of ball mounts to be connected to an external circuit. The signal line plane is divided into two or more signal line planes including a first line plane and a second line plane. Lines for the first power are formed only on the first signal line plane, and lines for the second power are formed only on the second signal line plane.
摘要:
Integrated circuit devices having metastability protection circuits therein include a main active circuit and a metastability detection/prevention circuit. The main active circuit may comprise a comparator, a sense amplifier, a differential amplifier or a voltage generating circuit, for example. The metastability detection/prevention circuit performs the function of detecting whether an output of the main active circuit has been disposed in a metastable state for a duration in excess of a transition duration. The output of the main active circuit may be considered as being in a metastable state if a potential of the output signal equals VMS, where VMS is in a range between VIL, and VIH. If the output signal has been in a metastable state for a duration in excess of the transition duration, then the metastability detection/prevention circuit will generate a control signal at a designated logic level. This control signal is provided as an input to the main active circuit and causes the output of the main active circuit to be driven out of the metastable state (i.e., to a logic 1 or 0 level). In this manner, prolonged metastability can be prevented even if the values of the input signals to the main active circuit would otherwise dispose the output in a metastable state.
摘要:
A method reduces a threshold voltage distribution in transistors of a semiconductor memory device, where each transistor includes a nitride liner. The method includes injecting electrons into a charge trap inside and outside the nitride liner of the transistors, and partially removing the electrons injected into the charge trap inside and outside the nitride liner to equalize trapped charges in the transistors.
摘要:
A first channel in the substrate underlying a trap gate is biased to cause trapping of holes or electrons in the trap gate and thereby program the memory device to a programmed state. A second channel in the substrate underlying the trap gate and transverse to the first channel is biased to sense the programmed state. For example, biasing a first channel in the substrate underlying the trap gate to cause trapping of holes or electrons in the trap gate and thereby program the memory device to a programmed state may include applying voltages to a first source/drain region and first gate on a first side of the trap gate and to a second source/drain region and a second gate on a second side of the trap gate, and biasing a second channel in the substrate underlying the trap gate and transverse to the first channel to sense the programmed state may include applying voltages to a third source/drain region on a third side of the trap gate and to a fourth source/drain region on a fourth side of the trap gate.
摘要:
The semiconductor memory device includes a first memory cell array including at least one first memory cell and at least one second memory cell corresponding to the at least one first memory cell, a first low bit line connected to the at least one first memory cell, a first low complementary bit line connected to the at least one second memory cell, a first switch unit having a first terminal connected to the first low bit line, a second switch unit having a first terminal connected to the first low complementary bit line, a first global bit line connected to a second terminal of the first switch unit, a first global complementary bit line connected to a second terminal of the second switch unit, and a plurality of sensing amplifying units connected to the first global bit line and the first global complementary bit line.