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    SYSTEMS AND METHODS FOR PARAMETER DEPENDENT RICCATI EQUATION APPROACHES TO ADAPTIVE CONTROL
    11.
    发明申请
    SYSTEMS AND METHODS FOR PARAMETER DEPENDENT RICCATI EQUATION APPROACHES TO ADAPTIVE CONTROL 有权
    自适应控制参数相关方程式的系统和方法

    公开(公告)号：US20120277888A1

    公开(公告)日：2012-11-01

    申请号：US13460663

    申请日：2012-04-30

    Applicant: Kilsoo Kim ,  Tansel Yucelen ,  Anthony Calise

    Inventor： Kilsoo Kim ,  Tansel Yucelen ,  Anthony Calise

    IPC: G05B13/02

    CPC classification number: G05B13/0205

    Abstract: Systems and methods for adaptive control are disclosed. The systems and methods can control uncertain dynamic systems. The control system can comprise a controller that employs a parameter dependent Riccati equation. The controller can produce a response that causes the state of the system to remain bounded. The control system can control both minimum phase and non-minimum phase systems. The control system can augment an existing, non-adaptive control design without modifying the gains employed in that design. The control system can also avoid the use of high gains in both the observer design and the adaptive control law.

    Abstract translation: 公开了用于自适应控制的系统和方法。 系统和方法可以控制不确定的动态系统。 控制系统可以包括采用参数依赖Riccati方程的控制器。 控制器可以产生使系统状态保持有界的响应。 控制系统可以控制最小相位和非最小相位系统。 控制系统可以增加现有的非自适应控制设计，而无需修改该设计中采用的增益。 控制系统还可以避免在观察者设计和自适应控制规律中使用高增益。

    STACKED PACKAGE OF SEMICONDUCTOR DEVICE
    12.
    发明申请
    STACKED PACKAGE OF SEMICONDUCTOR DEVICE 有权
    堆叠的半导体器件封装

    公开(公告)号：US20110180937A1

    公开(公告)日：2011-07-28

    申请号：US12941640

    申请日：2010-11-08

    Applicant: Jun-Young Choi ,  Kilsoo Kim

    Inventor： Jun-Young Choi ,  Kilsoo Kim

    IPC: H01L23/538

    CPC classification number: H01L23/3107 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/32245 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: Provided is a stacked package of a semiconductor device and a method of manufacturing the same. The stacked package of a semiconductor device may include at least one first semiconductor chip, at least one second semiconductor chip, at least one interposer between the at least one first semiconductor chip and the at least one second semiconductor chip, and a third semiconductor chip on the at least one first semiconductor chip. The at least one first semiconductor chip and the at least one second semiconductor chip may be configured to perform a first function and a second function and each may include a plurality of bonding pads. The third semiconductor chip may be configured to perform a third function which is different from the first and the second functions. The package may further include external connection leads may be configured to electrically connect the third semiconductor chip to the outside.

    Abstract translation: 提供半导体器件的堆叠封装及其制造方法。 半导体器件的堆叠封装可以包括至少一个第一半导体芯片，至少一个第二半导体芯片，至少一个第一半导体芯片和至少一个第二半导体芯片之间的至少一个插入件，以及第三半导体芯片 所述至少一个第一半导体芯片。 所述至少一个第一半导体芯片和所述至少一个第二半导体芯片可以被配置为执行第一功能和第二功能，并且每个可以包括多个键合焊盘。 第三半导体芯片可以被配置为执行与第一和第二功能不同的第三功能。 封装还可以包括外部连接引线可以被配置为将第三半导体芯片电连接到外部。

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