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公开(公告)号：US20080015326A1
公开(公告)日：2008-01-17
申请号：US11777345
申请日：2007-07-13
申请人： Kinya Kodama , Tsutomu Kashiwagi
发明人： Kinya Kodama , Tsutomu Kashiwagi
IPC分类号： C08G77/06
摘要： Provided is a curable silicone rubber composition, including: (A) an organopolysiloxane containing two or more silicon atom-bonded aliphatic unsaturated groups within each molecule, and containing a phenyl group and/or cyclohexyl group, (B) an organopolysiloxane resin with a three dimensional network structure consisting essentially of Q units and M units, and containing one or more phenyl groups and/or cyclohexyl groups, (C) an organohydrogenpolysiloxane, and (D) a platinum group metal-based catalyst, in which the component (B) exists in a quantity that represents from 20 to 80% by mass of the combination of the component (A) and the component (B), and in the component B, the quantity of low molecular weight substances, for which the weight average molecular weight measured by GPC and calculated against polystyrene standards is not greater than 500, is not greater than 5%. The composition is capable of forming a cured product with improved hardness, no surface tackiness, a high refractive index, and excellent resistance to thermal shock, without any loss in rubber-like properties such as elongation.
摘要翻译： 提供一种可固化硅橡胶组合物，其包括：（A）在每个分子内含有两个或更多个硅原子键合的脂肪族不饱和基团并含有苯基和/或环己基的有机聚硅氧烷，（B）具有三 基本上由Q单元和M单元组成并且含有一个或多个苯基和/或环己基的三维网络结构，（C）有机氢聚硅氧烷和（D）铂族金属基催化剂，其中组分（B） 以组分（A）和组分（B）的组合为20至80质量％的量存在，在组分B中，重均分子量 通过GPC测量并按聚苯乙烯标准计算不大于500，不大于5％。 该组合物能够形成具有改善的硬度，无表面粘性，高折射率和优异的耐热冲击性的固化产品，而不会像橡胶状的性能如伸长率那样损失。
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公开(公告)号：US07283715B2
公开(公告)日：2007-10-16
申请号：US10911686
申请日：2004-08-05
申请人： Kinya Kodama , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Kinya Kodama , Tsutomu Kashiwagi , Toshio Shiobara
摘要： An optical waveguide comprising a substrate, a lower clad layer on the substrate, a core layer and an upper clad layer, at least one of the lower clad layer, the core layer and the upper clad layer is formed of a cured product of a photo-curable organopolysiloxane composition comprising(A) a (meth)acryloyloxy group-containing organopolysiloxane of the following average compositional formula (1): (CH2═CR1COO(CH2)n)a(Ph)bR2c(R3O)dSiO(4-a-b-c-d)/2 (1) wherein R1 is hydrogen or methyl, R2 is an C1–C8 alkyl or C2–C8 alkenyl group, Ph is phenyl, R3 is hydrogen or an unsubstituted or alkoxy-substituted C1–C4 alkyl group, subscripts a, b, c and d are numbers satisfying: 0.05≦a≦0.9, 0.1≦b≦0.9, 0≦c≦0.2, 0
摘要翻译： 一种光波导，包括基板，基底上的下覆盖层，芯层和上覆盖层，下包层，芯层和上覆层中的至少一个由照相的固化产物形成 可固化的有机基聚硅氧烷组合物，其包含（A）具有以下平均组成式（1）的（甲基）丙烯酰氧基的有机聚硅氧烷：<？在线式描述=“在线式”末端=“铅” CH 2 CO 2（CH 2）n（CH 2）n（CH 2）n（CH 2） ） （4-abcd）/ 2（1）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中R 1是氢或甲基 R 2是C 1 -C 8烷基或C 2 -C 8烷基或C 2 -C 8烷基， SUB>烯基，Ph是苯基，R 3是氢或未取代或烷氧基取代的C 1 -C 4烷基，下标 a，b，c和d是麻木的 满足：0.05 <= a <= 0.9,0.1 <= b <= 0.9,0 <= c <= 0.2,0
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公开(公告)号：US20060205237A1
公开(公告)日：2006-09-14
申请号：US11360413
申请日：2006-02-24
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： C09D183/06 , H01L23/24 , H01L23/3142 , H01L24/45 , H01L24/48 , H01L24/49 , H01L33/52 , H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2924/01019 , H01L2924/10253 , H01L2924/12041 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In the preparation of a semiconductor device comprising a semiconductor member, the semiconductor member is subjected to plasma treatment and then primer treatment, prior to the encapsulation thereof with an encapsulant. The semiconductor device, typically LED package, is highly reliable in that a firm bond is established between the semiconductor member and the encapsulant resin.
摘要翻译： 在制备包括半导体部件的半导体器件时，在用封装剂封装半导体部件之前对半导体部件进行等离子体处理，然后进行底漆处理。 半导体器件（通常为LED封装）是高度可靠的，因为在半导体部件和密封树脂之间建立牢固的结合。
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