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公开(公告)号：US20200350474A1
公开(公告)日：2020-11-05
申请号：US16643099
申请日：2018-08-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Young Shin KIM , June O SONG , Chang Man LIM , Won Jung KIM , Ki Seok KIM
Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device including a first bonding portion and a second bonding portion on a lower portion thereof; and a first resin disposed between the body and the light emitting device, wherein the first frame includes a first protruding portion facing the first bonding portion of the light emitting device, and the second frame includes a second protruding portion facing the second bonding portion of the light emitting device, and including a first conductive layer between the first bonding portion and the first protruding portion and a second conductive layer between the second bonding portion and the second protruding portion.
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公开(公告)号：US20200303596A1
公开(公告)日：2020-09-24
申请号：US16649452
申请日：2018-09-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , June O SONG , Won Jung KIM , Hyoung Jin KIM , Hwan Hee JEONG
Abstract: The light-emitting device package disclosed in the embodiment includes first and second frames; a body supporting the first and second frames; and a light emitting device on the second frame, and the body may include a lower surface, a first side, and a second side facing the first side. The first frame includes a first recess that is concave in a second side direction from a first side portion adjacent to the first side, and the second frame includes a second recess that is concave in a first side direction from a second side portion adjacent to the second side. The first side portion of the first frame includes plurality of protrusions exposed to the first side of the body, the first recess is disposed between the protrusions of the first side portion, the second side portion of the second frame includes plurality of protrusions exposed to the second side of the body, and the second recess is disposed between the protrusions of the second side portion. A first length in the second direction of the first and second recesses is longer than a width in the first direction, and the first length may be larger than the second length in the second direction, which is an interval between the protrusions disposed in each of the first and second frames.
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公开(公告)号：US20200287107A1
公开(公告)日：2020-09-10
申请号：US16649553
申请日：2018-09-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , June O SONG , Won Jung KIM
Abstract: A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.
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公开(公告)号：US20200212276A1
公开(公告)日：2020-07-02
申请号：US16643279
申请日：2018-08-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , Ki Seok KIM , Won Jung KIM , June O SONG
IPC: H01L33/60 , H01L25/075 , H01L25/16 , H01L29/866 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/62
Abstract: A light emitting device package according to an embodiment has a first frame and a second frame arranged to be spaced apart from each other, a third frame arranged between the first frame and the second frame and spaced apart from the first frame and the second frame, a body supporting the first to third frames, a first light emitting device arranged on the body and electrically connected to the first frame and the third frame, and a second light emitting device arranged on the body and electrically connected to the second frame and the third frame. The body has a first recess in an upper area between the first frame and the third frame, and a second recess in an upper area between the third frame and the second frame. An embodiment may have a first resin part arranged in the first recess, and a second resin part arranged in the second recess. The first light emitting device has a first bonding portion and a second bonding portion, and may be arranged on the first resin part and electrically connected to the first frame and the third frame. The second light emitting device has a third bonding portion and a fourth bonding portion, and may be arranged on the second resin part and electrically connected to the second frame and the third frame.
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公开(公告)号：US20190027641A1
公开(公告)日：2019-01-24
申请号：US16041081
申请日：2018-07-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , June O SONG , Ki Seok KIM , Young Shin KIM , Chang Man LIM
Abstract: A light emitting device package includes a first frame and a second frame disposed to be spaced apart from each other; a body disposed between the first and second frames and comprising a recess; a first adhesive on the recess; a light emitting device on the first adhesive; a second adhesive disposed between the first and second frames and the light emitting device; and a resin portion disposed to surround the second adhesive and a partial region of the light emitting device.
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Patent Agency Ranking
公开(公告)号：US20200274042A1
公开(公告)日：2020-08-27
申请号：US16067484
申请日：2017-09-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , June O SONG , Chang Man LIM
Abstract: A light emitting device package can include a package body; a light emitting device disposed on the package body and including first and second electrode pads on a bottom surface of the light emitting device; a first through hole in the package body; a second through hole in the package body, in which the first through hole is separated from the second through hole, the first electrode pad of the light emitting device directly overlaps with the first through hole in the package body, and the second electrode pad of the light emitting device directly overlaps with the second through hole in the package body.
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公开(公告)号：US20200176654A1
公开(公告)日：2020-06-04
申请号：US16636457
申请日：2018-07-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Ki Seok KIM , Hee Jeong PARK , June O SONG , Chang Man LIM
Abstract: A semiconductor device package provided in an embodiment comprises: first and second frames spaced apart from each other; a body disposed between the first and second frames; and a semiconductor device disposed on the first and the second frame and comprising a semiconductor layer and a first and a second electrode on the semiconductor layer, wherein the first and the second frame comprise a first metal layer having a plurality of pores, and the first metal layer of the first and the second frame may comprise coupling portions in regions where the first metal layer overlaps the first and the second electrode, respectively.
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公开(公告)号：US20190333896A1
公开(公告)日：2019-10-31
申请号：US16068305
申请日：2017-11-02
Applicant: LG INNOTEK CO., LTD.
Inventor： June O SONG , Ki Seok KIM , Chang Man LIM
IPC: H01L25/075 , H01L23/00
Abstract: A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a third frame having a third through hole; a fourth frame having a fourth through hole; a body including the first through fourth frames; a connecting frame diagonally extending in the light emitting device package from the second frame to the third frame; a first light emitting device including a first electrode pad and a second electrode pad, the first electrode pad being disposed on the first through hole of the first frame and the second electrode pad being disposed on the second through hole of the second frame; a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the third through hole of the third frame and the fourth electrode pad being disposed on the fourth through hole of the fourth frame; and a plurality of recesses on the body, and interposed between the first frame and the second frame, the plurality of recesses being spaced apart from each other.
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公开(公告)号：US20190088824A1
公开(公告)日：2019-03-21
申请号：US15759113
申请日：2017-09-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Ki Seok KIM , Won Jung KIM , June O SONG , Chang Man LIM
Abstract: The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus.According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.
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公开(公告)号：US20190019926A1
公开(公告)日：2019-01-17
申请号：US16031657
申请日：2018-07-10
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , Chang Man LIM , June O SONG
Abstract: A light emitting device package according to an embodiment includes: a body including first and second openings passing through an upper surface of the body and a lower surface of the body; a light emitting device disposed on the body and including first and second bonding parts; and first and second conductive layers disposed under the body and electrically connected to the first and second bonding parts, respectively, wherein each of the first and second bonding parts includes a protrusion portion protruding and extending in a downwards direction within the first and second openings, respectively.
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