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公开(公告)号：US20190044039A1
公开(公告)日：2019-02-07
申请号：US16052247
申请日：2018-08-01
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , Won Jung KIM , June O SONG , Chang Man LIM
CPC classification number: H01L33/62 , H01L33/32 , H01L33/36 , H01L33/486 , H01L33/50 , H01L33/60 , H01L33/64
Abstract: A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.
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公开(公告)号：US20190088837A1
公开(公告)日：2019-03-21
申请号：US15766444
申请日：2017-09-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , June O SONG , Chang Man LIM
CPC classification number: H01L33/56 , F21V23/007 , H01L24/16 , H01L33/40 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/16257 , H01L2224/26175 , H01L2224/73204
Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion between the first and second frames; a light emitting device including first and second electrode pads; first and second through holes in the first and second frames, respectively; a first resin between the body portion and the light emitting device; and a conductive material in the first and second through holes, in which the first and second electrode pads of the light emitting device respectively overlap with the first and second through holes, the first and second electrode pads are spaced apart from each other, and the conductive material in the first and second through holes respectively contacts the first and second electrode pads, and a first side surface of the first electrode pad and a second side surface of the second electrode pad facing the first side surface both contact the first resin.
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公开(公告)号：US20190302573A1
公开(公告)日：2019-10-03
申请号：US16302308
申请日：2017-05-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Beom CHOI , Tae Sung LEE , Min Ji JIN
Abstract: An embodiment may have a substrate (110) including a predetermined cavity (C); a plurality of light emitting chips (120) spaced apart from the cavity (C) of the substrate (110); a frame (130), disposed on the substrate (110) including a support portion (132) and a guide portion (134) including a predetermined through hole (H1); and a lens unit (140) disposed in the through hole (H1) of the guide portion (134).
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公开(公告)号：US20190027641A1
公开(公告)日：2019-01-24
申请号：US16041081
申请日：2018-07-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , June O SONG , Ki Seok KIM , Young Shin KIM , Chang Man LIM
Abstract: A light emitting device package includes a first frame and a second frame disposed to be spaced apart from each other; a body disposed between the first and second frames and comprising a recess; a first adhesive on the recess; a light emitting device on the first adhesive; a second adhesive disposed between the first and second frames and the light emitting device; and a resin portion disposed to surround the second adhesive and a partial region of the light emitting device.
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Patent Agency Ranking
公开(公告)号：US20190019929A1
公开(公告)日：2019-01-17
申请号：US16035306
申请日：2018-07-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , Ki Seok KIM , Young Shin KIM , June O SONG , Ju Hyeon OH , Chang Hyeong LEE , Tae Sung LEE , Se Yeon JUNG , Byung Yeon CHOI , Sung Min HWANG
CPC classification number: H01L33/62 , H01L33/382 , H01L33/44 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.
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公开(公告)号：US20160268237A1
公开(公告)日：2016-09-15
申请号：US15064946
申请日：2016-03-09
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , Young Min RYU , Jae Hwan JUNG , Jong Beom CHOI
CPC classification number: H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/505 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: A light emitting device is provided. The light emitting device may include a body, first and second lead frames coupled to the body, a first light emitting chip on the first lead frame, a second light emitting chip on the second lead frame, and a reflective frame on the body and the first and second lead frames. The reflective frame may include a first opening provided therein with the first light emitting chip and a second opening provided therein with the second light emitting chip.
Abstract translation: 提供了一种发光器件。 发光装置可以包括主体，耦合到主体的第一和第二引线框架，第一引线框架上的第一发光芯片，第二引线框架上的第二发光芯片，以及主体上的反射框架， 第一和第二引线框架。 反射框架可以包括其中设置有第一发光芯片的第一开口和设置有第二发光芯片的第二开口。
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公开(公告)号：US20200274042A1
公开(公告)日：2020-08-27
申请号：US16067484
申请日：2017-09-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , June O SONG , Chang Man LIM
Abstract: A light emitting device package can include a package body; a light emitting device disposed on the package body and including first and second electrode pads on a bottom surface of the light emitting device; a first through hole in the package body; a second through hole in the package body, in which the first through hole is separated from the second through hole, the first electrode pad of the light emitting device directly overlaps with the first through hole in the package body, and the second electrode pad of the light emitting device directly overlaps with the second through hole in the package body.
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公开(公告)号：US20190019926A1
公开(公告)日：2019-01-17
申请号：US16031657
申请日：2018-07-10
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , Chang Man LIM , June O SONG
Abstract: A light emitting device package according to an embodiment includes: a body including first and second openings passing through an upper surface of the body and a lower surface of the body; a light emitting device disposed on the body and including first and second bonding parts; and first and second conductive layers disposed under the body and electrically connected to the first and second bonding parts, respectively, wherein each of the first and second bonding parts includes a protrusion portion protruding and extending in a downwards direction within the first and second openings, respectively.
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公开(公告)号：US20180019386A1
公开(公告)日：2018-01-18
申请号：US15544495
申请日：2016-01-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , Sung Min KONG , Young Min RYU , Jae Hwan JUNG , Jong Beom CHOI
CPC classification number: H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2933/0033 , H01L2924/00014
Abstract: A light-emitting element disclosed in an embodiment comprises: a body having a cavity; first and second lead frames arranged in the cavity; a third lead frame arranged between the first and second lead frames in the cavity; a fourth lead frame arranged between the first and second lead frames and distanced from the third frame in the cavity; a first light-emitting chip arranged on the first lead frame; and a second light-emitting chip arranged on the second lead frame, wherein the body comprises: first and second sides arranged on opposing sides from each other; and third and fourth sides arranged on opposing sides from each other, the first lead frame comprises first and second lead parts protruding toward the first and second sides, the second lead frame comprises third and forth lead parts protruding toward the first and second sides, the third frame comprises a fifth lead part protruding toward the first side, and the fourth lead frame comprises a sixth lead part protruding toward the second side.
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