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公开(公告)号：US20190027641A1
公开(公告)日：2019-01-24
申请号：US16041081
申请日：2018-07-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , June O SONG , Ki Seok KIM , Young Shin KIM , Chang Man LIM
Abstract: A light emitting device package includes a first frame and a second frame disposed to be spaced apart from each other; a body disposed between the first and second frames and comprising a recess; a first adhesive on the recess; a light emitting device on the first adhesive; a second adhesive disposed between the first and second frames and the light emitting device; and a resin portion disposed to surround the second adhesive and a partial region of the light emitting device.
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公开(公告)号：US20210210665A1
公开(公告)日：2021-07-08
申请号：US17059132
申请日：2019-05-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Ki Seok KIM , Chang Man LIM , Won Jung KIM
Abstract: A light-emitting device package according to one embodiment comprises: a body including a through-hole formed in an upper surface and a lower surface; a light-emitting device arranged on the upper surface of the body and including first and second bonding units spaced apart from each other; and first and second metal units arranged so as to be spaced apart from each other on the rear surface of the body, wherein a partial area of each of the first and second bonding units overlaps with the through-hole in a vertical direction, the first and second metal units respectively includes first and second extension portions extending to the through-hole; the first and second extension portions is electrically connected to the first and second bonding units, respectively; and the first and second extension portions face each other within the through-hole.
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公开(公告)号：US20210193890A1
公开(公告)日：2021-06-24
申请号：US16768304
申请日：2018-11-30
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , June O SONG , Ki Seok KIM
Abstract: A light emitting device package according to an embodiment may include first and second frames, a body, a light emitting device, first and second conductive parts, and first and second conductors. According to the embodiment, first and second frames may be spaced apart from each other and include first and second openings, respectively. The body may be disposed between the first and second frames. The light emitting device may be disposed on the body and include first and second bonding parts. The first and second conductive parts may be disposed under the first and second bonding parts. The first and second conductors may be disposed in the first and second openings, respectively. According to the embodiment, the first and second conductive parts may extend into the first and second openings from the first and second bonding parts, respectively, and the first and second conductors may be disposed between the first and second conductive parts and the first and second frames, respectively.
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公开(公告)号：US20210175392A1
公开(公告)日：2021-06-10
申请号：US16770910
申请日：2018-12-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Min KONG , Ki Seok KIM , Young Shin KIM
Abstract: The light emitting device package disclosed in an embodiment of the invention includes first and second frames; a body disposed between the first and second frames; and a light emitting device disposed on the first and second frames, wherein the first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and facing the first end portion, wherein the first end portion includes a first protruding portion protruding toward the second frame, and the second end portion includes a second protruding portion protruding toward the first frame. The light emitting device may include a first bonding portion disposed on the first protruding portion and a second bonding portion disposed on the second protruding portion.
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公开(公告)号：US20200335675A1
公开(公告)日：2020-10-22
申请号：US16760702
申请日：2018-10-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Won Jung KIM , Ki Seok KIM , June O SONG , Chang Man LIM
Abstract: The light emitting device package disclosed in the embodiment includes a package body including first and second frames, and a first body disposed between the first and second frames; a second body disposed on the package body and including a cavity and a sub-cavity spaced apart from the cavity; a light emitting device disposed in the cavity and including first and second bonding portions; and a protection device disposed in the sub-cavity, wherein the package body and the second body may be coupled to an adhesive member.
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Patent Agency Ranking
公开(公告)号：US20200335673A1
公开(公告)日：2020-10-22
申请号：US16759907
申请日：2018-10-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Ki Seok KIM , Jung Hwa JUNG , Na Young KIM , Won Jung KIM , Suk Kyung PARK , Sang Jun LEE , Nak Hun KIM , Chang Man LIM
Abstract: A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.
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公开(公告)号：US20200279982A1
公开(公告)日：2020-09-03
申请号：US16646660
申请日：2018-09-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , June O SONG , Sung Min KONG , Ki Seok KIM
Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device disposed on the first and second frames; a first resin disposed between the body and the light emitting device, wherein each of the first and second frames includes a through hole, the through hole overlaps the light emitting device in a vertical direction, and the body includes a recess recessed toward a lower surface of the body between the first and second frames, and the recess overlaps the light emitting device in the vertical direction, the first resin is disposed in the recess, and a length of the recess is smaller than a width of the light emitting device.
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公开(公告)号：US20200227373A1
公开(公告)日：2020-07-16
申请号：US16646623
申请日：2018-09-14
Applicant: LG INNOTEK CO., LTD.
Inventor： June O SONG , Ki Seok KIM , Chang Man LIM
Abstract: A light emitting device package according to an embodiment may include a first package body including first and second openings passing through the upper surface and lower surface thereof; a second package body disposed on the first package body and including a third opening passing through the upper surface and lower surface thereof; a light emitting device disposed in the third opening; a first resin disposed between the upper surface of the first package body and the light emitting device; and a second resin disposed in the third opening. According to the embodiment, the upper surface of the first package body may be coupled to the lower surface of the second package body, the first package body may include a recess recessed from the upper surface of the first package body to the lower surface of the first package body, the first resin may be disposed in the recess, the first resin and the second resin include materials different from each other, and the first resin may be in contact with the light emitting device and the second resin.
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公开(公告)号：US20210193877A1
公开(公告)日：2021-06-24
申请号：US16756952
申请日：2018-10-16
Applicant: LG INNOTEK CO., LTD.
Inventor： June O SONG , Ki Seok KIM , Won Jung KIM
Abstract: A light emitting device package according to an embodiment may include: a first frame including a first opening passing through upper and lower surfaces, and a second frame spaced apart from the first frame and including a second opening; first and second conductive layers disposed in the first and second openings, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on the first resin. According to an embodiment, the light emitting device may include a first bonding part electrically connected with the first frame and a second bonding part spaced apart from the first bonding part and electrically connected with the second frame, and the first and second bonding parts may be disposed on the first and second openings, respectively. According to an embodiment, the first and second frames may include first and second metal layers having third and fourth openings passing through upper and lower surfaces around the first and second openings, respectively, and widths of the first and second bonding parts in a horizontal direction may be greater than widths of upper surfaces of the first and second openings in the horizontal direction.
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公开(公告)号：US20190334066A1
公开(公告)日：2019-10-31
申请号：US16068042
申请日：2017-09-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , Ki Seok KIM , June O SONG
Abstract: A light emitting device package including a first frame having first and second through holes; a light emitting device including first and second electrode pads; a first resin disposed between the first frame and the light emitting device; and a conductive material disposed in the first through hole and the second through hole. Further, the first electrode pad of the light emitting device overlaps with the first through hole and the second electrode pad of the light emitting device overlaps with the second through hole; the first electrode pad and the second electrode pad are spaced apart from each other; and the conductive material in the first and second through holes respectively contacts the first and second electrode pads, and a first side surface of the first electrode pad and a second side surface of the second electrode pad facing the first side surface contact the first resin.
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