公开(公告)号：US11764475B2

公开(公告)日：2023-09-19

申请号：US17411038

申请日：2021-08-24

Applicant: MEDIATEK INC.

Inventor： Debapratim Dhara ,  Shih-Chia Chiu ,  Yen-Ju Lu ,  Sheng-Mou Lin

IPC: H01Q1/48 ,  H01Q9/04

CPC classification number: H01Q9/045 ,  H01Q1/48

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.

公开(公告)号：US20220302574A1

公开(公告)日：2022-09-22

申请号：US17713105

申请日：2022-04-04

Applicant: MediaTek Inc.

Inventor： Shih-Chia Chiu ,  Yen-Ju Lu ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01Q21/06 ,  H01L23/14 ,  H01Q15/00 ,  H01Q19/06 ,  H01Q15/10

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

公开(公告)号：US20220102859A1

公开(公告)日：2022-03-31

申请号：US17411038

申请日：2021-08-24

Applicant: MEDIATEK INC.

Inventor： Debapratim Dhara ,  Shih-Chia Chiu ,  Yen-Ju Lu ,  Sheng-Mou Lin

IPC: H01Q9/04 ,  H01Q1/48

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.

公开(公告)号：US20200287271A1

公开(公告)日：2020-09-10

申请号：US16884064

申请日：2020-05-27

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Wen-Chou Wu

IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q21/12 ,  H01Q9/26 ,  H01Q21/06 ,  H01L23/28 ,  H01L23/528 ,  H01L23/64 ,  H01L23/66

Abstract: An Antenna-in-Package (AiP) includes an interface layer having at least an antenna layer and an insulating layer disposed under the antenna layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. An integrated circuit die is disposed on the interface layer. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region includes a first antenna element, a second antenna element extending along a first direction, and a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die. The feeding network, the first antenna element, and the second antenna element are coplanar. A plurality of solder balls is disposed on a surface of the interface layer.

公开(公告)号：US10680727B2

公开(公告)日：2020-06-09

申请号：US16056549

申请日：2018-08-07

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H04B1/38 ,  H04B17/16 ,  G01R31/28 ,  G01R31/302 ,  G01R1/24 ,  G01R29/08 ,  G01R1/04

Abstract: An over-the-air (OTA) wireless test system includes a container, a machine plate disposed on the container, a supporter disposed on the machine plate, a load board disposed on the supporter, a socket disposed on the load board, a device under test (DUT) installed in the socket, and a wave-guiding feature in the socket and the load board configured to pass and guide electromagnetic waves to and/or from an antenna structure of the DUT. The wave-guiding feature comprises a wave-guiding channel in the socket defined by a plurality of pogo pins surrounding the antenna structure of the DUT. The wave-guiding feature may further comprise a radiation passage in the load board defined by rows of via fence extending through an entire thickness of the load board.

公开(公告)号：US20190305428A1

公开(公告)日：2019-10-03

申请号：US16293661

申请日：2019-03-06

Applicant: MEDIATEK INC.

Inventor： Jiunn-Nan Hwang ,  Yi-Chieh Lin ,  Yen-Ju Lu ,  Shih-Chia Chiu ,  Wen-Chou Wu

IPC: H01Q9/04 ,  H01Q1/48 ,  H01Q19/10 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H01Q21/06 ,  H01Q1/22 ,  H01L23/66 ,  H01L23/498

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.

公开(公告)号：US20190115646A1

公开(公告)日：2019-04-18

申请号：US16120446

申请日：2018-09-03

Applicant: MEDIATEK INC.

Inventor： Shih-Chia Chiu ,  Yen-Ju Lu ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01L23/14 ,  H01Q21/06

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

公开(公告)号：US20190068300A1

公开(公告)日：2019-02-28

申请号：US16056549

申请日：2018-08-07

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H04B17/16

Abstract: An over-the-air (OTA) wireless test system includes a container, a machine plate disposed on the container, a supporter disposed on the machine plate, a load board disposed on the supporter, a socket disposed on the load board, a device under test (DUT) installed in the socket, and a wave-guiding feature in the socket and the load board configured to pass and guide electromagnetic waves to and/or from an antenna structure of the DUT. The wave-guiding feature comprises a wave-guiding channel in the socket defined by a plurality of pogo pins surrounding the antenna structure of the DUT. The wave-guiding feature may further comprise a radiation passage in the load board defined by rows of via fence extending through an entire thickness of the load board.

公开(公告)号：US20170148558A1

公开(公告)日：2017-05-25

申请号：US15135558

申请日：2016-04-22

Applicant: MEDIATEK INC.

Inventor： Huan-Sheng Chen ,  Yen-Ju Lu ,  Chung-Shi Lin ,  Chien-Hua Wu ,  Yan-Bin Luo

IPC: H01F27/28 ,  H01F27/29

CPC classification number: H01F27/28 ,  H01F27/2804 ,  H01F27/29 ,  H01F38/14

Abstract: An inductor module comprising: a first inductor, comprising a first inductor area; and a second inductor, comprising a second inductor area. A first overlapped area of the first inductor area and a second overlapped area of the second inductor area are overlapped. The second overlapped area comprises at least one first magnetic direction area and at least one second magnetic direction area. A ratio between a size of the first magnetic direction area and a size of the second magnetic direction area is a predetermined ratio such that a coupling effect between the first inductor and the second inductor is lower or equals to a predetermined value.

公开(公告)号：US20240038690A1

公开(公告)日：2024-02-01

申请号：US18211551

申请日：2023-06-19

Applicant: MEDIATEK INC.

Inventor： Po-Jui Li ,  Ruey-Bo Sun ,  Yen-Ju Lu ,  Chun-Yuan Yeh ,  Sheng-Mou Lin

IPC: H01L23/64 ,  H01L23/522

CPC classification number: H01L23/645 ,  H01L23/5227 ,  H01L23/5221 ,  H01L28/10

Abstract: A semiconductor device includes an electronic device, a guard trace and a first trace. The guard trace is connecting to a ground layer through a first ground via. The first trace is disposed adjacent to the electronic device and the guard trace and includes a first segment. A phase or a direction of a first current signal conducted on the first trace is changed in the first segment. The electronic device and the first trace are disposed at different sides of the guard trace and the first ground via is beside the first segment.