公开(公告)号：US20190052316A1

公开(公告)日：2019-02-14

申请号：US16162294

申请日：2018-10-16

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Mostafa Naguib Abdulla

IPC: H04B5/02 ,  H04B5/00 ,  H01L23/66 ,  H01L23/00 ,  H01L25/065 ,  H01Q7/00 ,  H01Q23/00 ,  G11C5/04

Abstract: A memory device may include an array of closely spaced memory integrated circuits that communicate wirelessly over at least two frequencies using near field coupling.

公开(公告)号：US10128916B2

公开(公告)日：2018-11-13

申请号：US15069813

申请日：2016-03-14

Applicant: Micron Technology, Inc.

Inventor： Mostafa Naguib Abdulla

IPC: H04B5/00 ,  H04B5/02 ,  H01Q7/00 ,  H01L25/065 ,  H01L23/66 ,  H01L23/00 ,  H01Q23/00 ,  G11C5/04

Abstract: A memory device may include an array of closely spaced memory integrated circuits that communicate wirelessly over at least two frequencies using near field coupling.

公开(公告)号：US20160197653A1

公开(公告)日：2016-07-07

申请号：US15069813

申请日：2016-03-14

Applicant: Micron Technology, Inc.

Inventor： Mostafa Naguib Abdulla

IPC: H04B5/00 ,  H01L23/00 ,  H01L25/065 ,  H01L23/66 ,  H01Q7/00 ,  H01Q1/38

CPC classification number: H04B5/02 ,  G11C5/04 ,  H01L23/66 ,  H01L24/48 ,  H01L25/0655 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01Q7/00 ,  H01Q7/005 ,  H01Q23/00 ,  H04B5/00 ,  H04B5/0031 ,  H04B5/0081 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A memory device may include an array of closely spaced memory integrated circuits that communicate wirelessly over at least two frequencies using near field coupling.

Abstract translation: 存储器件可以包括紧密间隔的存储器集成电路的阵列，其通过使用近场耦合的至少两个频率进行无线通信。

公开(公告)号：US08860496B2

公开(公告)日：2014-10-14

申请号：US14021268

申请日：2013-09-09

Applicant: Micron Technology, Inc.

Inventor： Mostafa Naguib Abdulla ,  Steven Eskildsen

IPC: G11C5/14 ,  H01L23/50 ,  H01L27/02 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L27/0214 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399

Abstract: Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond pads on an integrated circuit die may be connected together via one or more electrically conductive interconnects.

Abstract translation: 本文公开的实施例可以涉及用于集成电路器件的电源电压或接地连接。 作为一个示例，集成电路管芯上的两个或更多个电源电压接合焊盘可以经由一个或多个导电互连件连接在一起。