公开(公告)号：US10476556B2

公开(公告)日：2019-11-12

申请号：US16162294

申请日：2018-10-16

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Mostafa Naguib Abdulla

IPC: H04B7/00 ,  H04B5/02 ,  H04B5/00 ,  H01Q7/00 ,  H01L25/065 ,  H01L23/66 ,  H01L23/00 ,  H01Q23/00 ,  G11C5/04

Abstract: A memory device may include an array of closely spaced memory integrated circuits that communicate wirelessly over at least two frequencies using near field coupling.

公开(公告)号：US09384134B2

公开(公告)日：2016-07-05

申请号：US14791030

申请日：2015-07-02

Applicant: MICRON TECHNOLOGY, INC.

Inventor： John Rudelic ,  August Camber ,  Mostafa Naguib Abdulla

IPC: G06F12/08 ,  G06F12/10 ,  G06F13/16 ,  G11C11/00

CPC classification number: G06F12/084 ,  G06F12/0811 ,  G06F12/0895 ,  G06F12/1027 ,  G06F13/1694 ,  G06F2212/2022 ,  G06F2212/283 ,  G06F2212/314 ,  G06F2212/682 ,  G11C11/005

Abstract: Subject matter disclosed herein relates to a system of one or more processors that includes persistent memory.

公开(公告)号：US09075725B2

公开(公告)日：2015-07-07

申请号：US14245916

申请日：2014-04-04

Applicant: MICRON TECHNOLOGY, INC.

Inventor： John Rudelic ,  August Camber ,  Mostafa Naguib Abdulla

IPC: G06F12/08 ,  G06F13/16 ,  G11C11/00

CPC classification number: G06F12/084 ,  G06F12/0811 ,  G06F12/0895 ,  G06F12/1027 ,  G06F13/1694 ,  G06F2212/2022 ,  G06F2212/283 ,  G06F2212/314 ,  G06F2212/682 ,  G11C11/005

Abstract: Subject matter disclosed herein relates to a system of one or more processors that includes persistent memory.

Abstract translation: 本文公开的主题涉及包括持久存储器的一个或多个处理器的系统。

公开(公告)号：US08829693B2

公开(公告)日：2014-09-09

申请号：US14027515

申请日：2013-09-16

Applicant: Micron Technology, Inc.

Inventor： Mostafa Naguib Abdulla ,  Steven Eskildsen

IPC: H01L23/48 ,  H01L21/44 ,  H01L23/498 ,  H01L23/50

CPC classification number: H01L23/49816 ,  H01L21/44 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond fingers may be connected together via one or more electrically conductive interconnects.

Abstract translation: 本文公开的实施例可以涉及用于集成电路器件的电源电压或接地连接。 作为一个示例，两个或更多个电源电压键合指可以经由一个或多个导电互连件连接在一起。

公开(公告)号：US10651965B2

公开(公告)日：2020-05-12

申请号：US15090264

申请日：2016-04-04

Applicant: Micron Technology, Inc.

Inventor： Mostafa Naguib Abdulla

IPC: G06F13/38 ,  H04L1/00 ,  G11C5/02 ,  G11C7/10 ,  G11C5/04 ,  G11C29/28 ,  G11C29/00

Abstract: In various embodiments, a memory module houses memory devices and, in some embodiments, a memory controller. Each of the devices has a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on, for example, a memory device substrate or molded into a plastic mold to create near-field magnetic coupling between the stacked memory devices and, in certain embodiments, the memory controller. Other embodiments are disclosed.

公开(公告)号：US20160285584A1

公开(公告)日：2016-09-29

申请号：US15090264

申请日：2016-04-04

Applicant: Micron Technology, Inc.

Inventor： Mostafa Naguib Abdulla

IPC: H04L1/00 ,  G11C29/00 ,  G11C29/28 ,  G11C5/04 ,  G11C7/10

CPC classification number: H04L1/0002 ,  G11C5/02 ,  G11C5/04 ,  G11C7/1075 ,  G11C29/28 ,  G11C29/783 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: In various embodiments, a memory module houses memory devices and, in some embodiments, a memory controller. Each of the devices has a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on, for example, a memory device substrate or molded into a plastic mold to create near-field magnetic coupling between the stacked memory devices and, in certain embodiments, the memory controller. Other embodiments are disclosed.

Abstract translation: 在各种实施例中，存储器模块容纳存储器件，并且在一些实施例中容纳存储器控制器。 每个设备具有耦合到环形天线的近场接口以通信空中数据。 线圈形成在例如存储器件基板上或模制成塑料模具中以在堆叠的存储器件之间以及在某些实施例中产生存储器控制器的近场磁耦合。 公开了其他实施例。

公开(公告)号：US20140009218A1

公开(公告)日：2014-01-09

申请号：US14021268

申请日：2013-09-09

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Mostafa Naguib Abdulla ,  Steven Eskildsen

IPC: H01L27/02

CPC classification number: H01L27/0214 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399

Abstract: Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond pads on an integrated circuit die may be connected together via one or more electrically conductive interconnects.

Abstract translation: 本文公开的实施例可以涉及用于集成电路器件的电源电压或接地连接。 作为一个示例，集成电路管芯上的两个或更多个电源电压接合焊盘可以经由一个或多个导电互连件连接在一起。

公开(公告)号：US09575662B2

公开(公告)日：2017-02-21

申请号：US14670978

申请日：2015-03-27

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Mostafa Naguib Abdulla ,  August Camber

IPC: G06F3/06 ,  G06F13/16

CPC classification number: G06F3/0608 ,  G06F3/0656 ,  G06F3/0665 ,  G06F3/0688 ,  G06F3/0689 ,  G06F13/16 ,  G06F13/1684 ,  G06F2003/0691 ,  G06F2003/0692

Abstract: Subject matter disclosed herein relates to memory devices comprising a memory array, a first port to interface with a memory controller directly or indirectly via another memory device, a second port to interface with yet another memory device, and a switch to selectively electrically connect the memory controller to a circuit path leading to the second port or to the memory array, wherein the switch may be responsive to a signal generated by the memory controller.

Abstract translation: 本文公开的主题涉及包括存储器阵列，通过另一存储器件直接或间接地与存储器控制器接口的第一端口，与另一个存储器件接口的第二端口以及用于选择性地电连接存储器 控制器连接到通向第二端口或存储器阵列的电路路径，其中开关可以响应于存储器控制器产生的信号。

公开(公告)号：US20150199133A1

公开(公告)日：2015-07-16

申请号：US14670978

申请日：2015-03-27

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Mostafa Naguib Abdulla ,  August Camber

IPC: G06F3/06

CPC classification number: G06F3/0608 ,  G06F3/0656 ,  G06F3/0665 ,  G06F3/0688 ,  G06F3/0689 ,  G06F13/16 ,  G06F13/1684 ,  G06F2003/0691 ,  G06F2003/0692

Abstract: Subject matter disclosed herein relates to memory devices comprising a memory array, a first port to interface with a memory controller directly or indirectly via another memory device, a second port to interface with yet another memory device, and a switch to selectively electrically connect the memory controller to a circuit path leading to the second port or to the memory array, wherein the switch may be responsive to a signal generated by the memory controller.

Abstract translation: 本文公开的主题涉及包括存储器阵列，通过另一存储器件直接或间接地与存储器控制器接口的第一端口，与另一存储器件接口的第二端口以及用于选择性地电连接存储器 控制器连接到通向第二端口或存储器阵列的电路路径，其中开关可以响应于存储器控制器产生的信号。

公开(公告)号：US20140015133A1

公开(公告)日：2014-01-16

申请号：US14027515

申请日：2013-09-16

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Mostafa Naguib Abdulla ,  Steven Eskildsen

IPC: H01L23/498

CPC classification number: H01L23/49816 ,  H01L21/44 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond fingers may be connected together via one or more electrically conductive interconnects.

Abstract translation: 本文公开的实施例可以涉及用于集成电路器件的电源电压或接地连接。 作为一个示例，两个或更多个电源电压键合指可以经由一个或多个导电互连件连接在一起。