公开(公告)号：US20170256353A1

公开(公告)日：2017-09-07

申请号：US15509852

申请日：2015-04-27

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： In Kil PARK ,  Gyeong Tae KIM ,  Seung Hun CHO ,  Jun Ho JUNG ,  Ki Joung NAM ,  Jung Gyu LEE

IPC: H01F27/29 ,  H01F27/255 ,  H01F41/04 ,  H01F41/02 ,  H01F41/10 ,  H05K1/18 ,  H01F27/34 ,  C09K5/14 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K3/04 ,  B22F1/00 ,  B22F1/02 ,  C23C18/16 ,  C25D7/12 ,  B22F3/02 ,  B29C43/02 ,  B29C65/00 ,  H01F27/28

CPC classification number: C08K3/28 ,  B22F1/0062 ,  B22F1/02 ,  B22F3/02 ,  B22F2301/35 ,  B22F2302/25 ,  B22F2302/45 ,  B29C43/02 ,  B29C65/002 ,  B29L2031/34 ,  C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K2003/0856 ,  C08K2003/222 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/01 ,  C09K5/14 ,  C23C18/1637 ,  C23C18/1653 ,  C25D7/123 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/008 ,  H01F27/22 ,  H01F27/292 ,  H01F27/34 ,  H01F41/0233 ,  H01F41/041 ,  H01F41/10 ,  H01F2017/048 ,  H01F2027/2809 ,  H05K1/181 ,  H05K2201/1003

Abstract: Provided are a power inductor including a body, a base disposed in the body, a coil disposed on the base, a first external electrode connected to the coil, the first external electrode being disposed on a side surface of the body, and a second external electrode connected to the first external electrode, the second external electrode being disposed on a bottom surface of the body and a method for manufacturing the same.

公开(公告)号：US20170221622A1

公开(公告)日：2017-08-03

申请号：US15502500

申请日：2015-04-27

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： In Kil PARK ,  Tae Hyung NOH ,  Gyeong Tae KIM ,  Seung Hun CHO ,  Jun Ho JUNG ,  Ki Joung NAM ,  Jung Gyu LEE

IPC: H01F27/22 ,  H01F27/29 ,  H01F27/28

Abstract: In accordance with an exemplary embodiment, a power inductor includes a body, a base disposed in the body, and a coil pattern disposed on at least one surface of the base, in which the body includes metal powder, a polymer, and a thermal conductive filler and the base is formed by bonding a copper foil to both surfaces of a metal plate comprising iron.

公开(公告)号：US20220392690A1

公开(公告)日：2022-12-08

申请号：US17770287

申请日：2021-08-20

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： Gyeong Tae KIM ,  Tae Geun SEO ,  Sang Hoon SHIN ,  Jin Su JEONG

IPC: H01F27/28 ,  H01F27/02 ,  H01F41/04 ,  H01F27/29

Abstract: The present disclosure relates to an electronic component and a method for manufacturing the same, and more particularly, to a surface mounting type electronic component provided on an electronic device and a method for manufacturing the same.
An electronic component in accordance with an exemplary embodiment includes a main body part having a polyhedral shape and including a recessed portion formed as at least a portion of a plurality of edges at which two mutually adjacent surfaces meet is recessed, an insulation part provided on a surface of the main body part to cover the recessed portion, and an electrode part separately provided on the surface of the main body part except for an area on which the insulation part is provided.

公开(公告)号：US20210104355A1

公开(公告)日：2021-04-08

申请号：US16608180

申请日：2018-05-10

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： Gyeong Tae KIM ,  Sang Hyun KIM

IPC: H01F27/28 ,  H01F17/04 ,  H01F27/29

Abstract: The present disclosure provides a choke coil including a core, a flange provided on each of both end portions of the core in one direction, a terminal electrode coupled to the flange, and a wire wound around the core and having end portions each led out onto the terminal electrodes, wherein the wire is led out onto the terminal electrode on a side surface of the flange.

公开(公告)号：US20200335254A1

公开(公告)日：2020-10-22

申请号：US16077725

申请日：2017-03-13

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： In Kil PARK ,  Seung Hun CHO ,  Gyeong Tae KIM ,  Jun Ho JUNG ,  Sang Jun PARK

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01L23/64

Abstract: Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.

公开(公告)号：US20190318854A1

公开(公告)日：2019-10-17

申请号：US16314659

申请日：2017-07-17

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： In Kil PARK ,  Gyeong Tae KIM ,  Ki Joung NAM

IPC: H01F1/06 ,  H01F1/26 ,  H01F27/29

Abstract: Provided is a power inductor. The power inductor includes a body including metal powder and a polymer, at least one base provided in the body, and at least one coil pattern disposed on at least one surface of the base. The metal powder includes at least three metal powder of which middle values of grain-size distribution are different from each other.

公开(公告)号：US20180366246A1

公开(公告)日：2018-12-20

申请号：US15778223

申请日：2016-11-22

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： In Kil PARK ,  Gyeong Tae KIM ,  Jun Ho JUNG ,  Seung Hun CHO ,  Ki Joung NAM

IPC: H01F1/057 ,  H01F17/04 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F27/255

Abstract: Provided is a power inductor. The power inductor includes a body, at least one base material disposed within the body, at least one coil pattern disposed on at least one surface of the base material, an insulation layer disposed between the coil pattern and the body, and an external electrode disposed outside the body and connected to the coil pattern. The body includes a magnetic pulverized material and an insulation material.

公开(公告)号：US20180308612A1

公开(公告)日：2018-10-25

申请号：US15768830

申请日：2016-10-13

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： In Kil PARK ,  Gyeong Tae KIM ,  Jun Ho JUNG ,  Seung Hun CHO ,  Ki Joung NAM

IPC: H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F5/04 ,  H01F1/147 ,  H01F27/255

CPC classification number: H01F17/0013 ,  H01F1/147 ,  H01F5/04 ,  H01F17/00 ,  H01F27/255 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/046 ,  H01F2017/0066

Abstract: Provided is a power inductor. The power inductor includes a body, at least one base material disposed within the body, at least one coil pattern disposed on at least one surface of the base material, an insulation film disposed between the coil pattern and the body, and an external electrode disposed outside the body and connected to the coil pattern. The body includes a plurality of magnetic layers and insulation layers, which are alternately laminated.

公开(公告)号：US20170263367A1

公开(公告)日：2017-09-14

申请号：US15509850

申请日：2015-04-27

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： In Kil PARK ,  Gyeong Tae KIM ,  Seung Hun CHO ,  Jun Ho JUNG ,  Ki Joung NAM ,  Jung Gyu LEE

IPC: H01F27/00 ,  H01F27/29 ,  H01F27/255 ,  H01F27/28

CPC classification number: C08K3/28 ,  B22F1/0062 ,  B22F1/02 ,  B22F3/02 ,  B22F2301/35 ,  B22F2302/25 ,  B22F2302/45 ,  B29C43/02 ,  B29C65/002 ,  B29L2031/34 ,  C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K2003/0856 ,  C08K2003/222 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/01 ,  C09K5/14 ,  C23C18/1637 ,  C23C18/1653 ,  C25D7/123 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/008 ,  H01F27/22 ,  H01F27/292 ,  H01F27/34 ,  H01F41/0233 ,  H01F41/041 ,  H01F41/10 ,  H01F2017/048 ,  H01F2027/2809 ,  H05K1/181 ,  H05K2201/1003

Abstract: In accordance with an exemplary embodiment, a power inductor includes a body, at least two bases disposed in the body, at least two coil patterns disposed on the at least two bases, respectively, and a connection electrode disposed on an outer portion of the body and connecting the at least two coils to each other.