摘要:
An apparatus having improved hard bias properties of layers of a magnetoresistance sensor is disclosed. Properties of the hard bias layer are improved using a seedlayer structure that includes at least a layer of silicon and a layer comprising chromium or chromium molybdenum. Further, benefits are achieved when the seedlayer structure includes a layer of tantalum.
摘要:
An isotropic deposition method for trench narrowing of thin film magnetic write head features to be created by reactive ion etching. According to the method, a photolithographically defined photoresist trench is formed over a hardmask and underlying polymer layer as part of tri-layer resist process. Instead of performing the usual hardmask and polymer etching steps using the photoresist mask pattern, a spacer layer is deposited isotropically or directionally at an angle to cover the vertical side walls of the trench. The spacer layer is etchable by the hardmask etch process but resistant to the polymer etch process. When the hardmask etch process is performed, the spacer layer material applied to the trench side walls remains intact, thereby defining a narrowed trench that is extended by the subsequent base layer etch process.
摘要:
A magnetic head system, and method for manufacturing a magnetic head are provided. Included is at least one layer and a heating element positioned adjacent the at least one layer. The at least one layer includes a plurality of sub-layers for providing an optimal thermal barrier.
摘要:
A method of making a magnetic head assembly wherein the magnetic head assembly has a write head with a pole tip includes the steps of forming a shaping layer on an underlying layer wherein the shaping layer has a side surface and a top surface, ion beam sputter depositing a ferromagnetic material layer on the underlying layer and on the side and top surfaces of the shaping layer and removing first and second portions of the ferromagnetic material layer from the underlying layer and the top surface of the shaping layer, respectively, leaving a remaining portion of the ferromagnetic material layer on the side surface of the shaping layer which is the aforementioned pole tip.
摘要:
A magnetic head has highly thermally conductive insulator materials containing cobalt-oxide so that heat can more effectively dissipate from the magnetic head. In one illustrative example, the magnetic head has first and second gap layers and a read sensor disposed between the first and the second gap layers. The first and the second gap layers are advantageously made of cobalt-oxide (CoOx) (e.g. CoO or Co2O3), which may exhibit a thermal conductivity of between 5-8 watts/meter-Kelvin or greater. In another illustrative example, a magnetic head is made of a substrate; first and second shield layers; an undercoat layer formed between the substrate and the first shield layer; first and second gap layers formed between the first and the second shield layers; and a read sensor formed between the first and the second gap layers. The undercoat layer is also made of CoOx. The improved dissipation of heat from the magnetic head improves the read sensor performance and reduces the likelihood of other problems, such as head-to-disk interface problems.
摘要:
A method for fabricating a magnetic head with a trapezoidal shaped pole piece tip is described. The body of the main pole piece is deposited; then one or more layers for the pole piece tip are deposited. A bed material is deposited over the pole piece tip material. A void is formed in the bed material over the area for the pole piece tip. The void is filled with an ion-milling resistant material such as alumina preferably using atomic layer deposition or atomic layer chemical vapor deposition. The excess ion-milling resistant material and the bed material are removed. The result is an ion-milling mask formed over the area for the pole piece tip. Ion milling is then used to remove the unmasked material in the pole piece tip layer and to form a beveled pole piece tip and preferably a beveled face on the main pole piece.
摘要:
A current-perpendicular-to-the-plane (CPP) magnetoresistive (MR) read head structure has the MR read head located between first and second shields (S1, S2) on a substrate with a shunt resistor R1 connecting S1 to the substrate and a shunt resistor R2 connecting S2 to the substrate, with R1 and R2 being approximately equal. Because R1 and R2 are close enough in value there is no significant interference pickup in the low frequency region. The shunt resistors can be formed from high-resistivity metal nitrides or cermets. The spacing between the substrate and S1 may be selected to make the capacitance between S1 and the substrate approximately equal to the capacitance between S2 and the substrate to substantially reduce interference pickup in the high frequency region. Equalization conductors (EC1, EC2) may be connected to the substrate and spaced from S2 and S1, respectively, by electrically insulating material to create additional capacitances with values selected to substantially equalize the total parasitic capacitance on S2 with the total parasitic capacitance on S1.
摘要:
A first magnetic shield layer of the read head sensor is deposited upon a slider substrate surface. A patterned photoresist is then photolithographically fabricated upon the first magnetic shield layer with openings that are formed alongside the location at which the read sensor will be fabricated. An ion milling step is performed to create pockets within the surface of the magnetic shield layer at the location of the openings in the photoresist layer. The photoresist layer is then removed, and a fill layer is deposited across the surface of the magnetic shield layer in a depth greater than the depth of the pocket. Thereafter, a polishing step is conducted to remove portions of the fill layer down to the surface of the magnetic shield layer. A G1 insulation layer is deposited and a magnetic head sensor element is then fabricated upon the insulation layer.
摘要:
A process for planarizing a patterned metal structure for a magnetic thin film head includes the steps of applying an encapsulation/planarizing material on a substrate, spinning the substrate in a photoresist spinner or similar machine, curing the encapsulation/planarizing layer by energetic particles such as an electron beam. The planarizing process further comprises the step of polishing the entire structure using a conventional chemical-mechanical polishing step. The curing step takes place at the substrate temperature less than 200° C., which prevents the damages of the thin film head structures such as MR and GMR sensors. This process is cheap, efficient and easy to apply.
摘要:
A write element for use in perpendicular magnetic recording. The write element including a write pole and a self aligned wrap around shield that can have a trailing shield gap thickness that is different from its side shield gap thickness. The materials making up the trailing shield gap and the side shield gaps can be different materials or can be the same material deposited in two different steps. The side or wrap around portions of the trailing shield can extend down to the level of the leading edge of the write pole or can terminate at some point between the levels of the leading and trailing edge to form a partial wrap around trailing shield.