公开(公告)号：US20080144288A1

公开(公告)日：2008-06-19

申请号：US12037067

申请日：2008-02-25

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  A01H5/02 ,  A01H6/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的固体导热层。 固体导热层是与电子设备接触的平面。 该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中 多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大， 导电层。

公开(公告)号：US07268292B2

公开(公告)日：2007-09-11

申请号：US10944979

申请日：2004-09-20

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: H05K5/00 ,  H05K7/20

CPC classification number: G06F1/20 ,  H01L23/36 ,  H01L23/367 ,  H01L2924/0002 ,  Y10T29/52 ,  H01L2924/00

Abstract: A cooling structure for an electronic device comprises a plate including a thermally conducting material disposed over the electronic device. The cooling structure includes a first support and a second support. One of the first support and the second support provides compliance in the x-y directions, and the other support provides compliance in the z direction. In another embodiment of the present invention, the plate comprises a material having high thermal conductivity.

Abstract translation: 电子设备的冷却结构包括一个板，该板包括布置在该电子设备上的导热材料。 冷却结构包括第一支撑件和第二支撑件。 第一个支持和第二个支持之一是在x-y方向上提供合规性，而另一个支持在z方向提供合规性。 在本发明的另一个实施例中，该板包括具有高导热性的材料。

公开(公告)号：US06611395B1

公开(公告)日：2003-08-26

申请号：US09432950

申请日：1999-11-03

Applicant: Timothy J. Chainer ,  Edward J. Yarmchuk ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： Timothy J. Chainer ,  Edward J. Yarmchuk ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: G11B2102

CPC classification number: G11B5/59633

Abstract: A method for writing tracks on a rotating disk media data storage device comprising the steps of: receiving a set of component parameters; and adjusting track pitch for each of the tracks to be written in each disk according to the component parameters. According to another embodiment a disk drive includes at least one disk comprising a two or more of tracks in which the track pitch between each pair of adjacent tracks is set based on component parameters such as the recording head widths. According to another embodiment a servowriter is adapted to perform the method discussed above.

Abstract translation: 一种用于在旋转盘介质数据存储设备上写入轨迹的方法，包括以下步骤：接收一组分量参数; 以及根据组件参数调整要写入每个磁盘的每个磁道的磁道间距。 根据另一实施例，盘驱动器包括至少一个盘，其包括两个或更多个轨道，其中基于诸如记录头宽度的分量参数设置每对相邻轨道之间的轨道间距。 根据另一实施例，伺服驱动器适于执行上述方法。

公开(公告)号：US06429989B1

公开(公告)日：2002-08-06

申请号：US09592740

申请日：2000-06-13

Applicant: Mark D. Schultz ,  Bucknell C. Webb

Inventor： Mark D. Schultz ,  Bucknell C. Webb

IPC: G11B509

CPC classification number: G11B27/30 ,  G11B5/59633 ,  G11B2220/20

Abstract: A method for writing timing marks on a rotatable storage medium, such as on a disk in a disk drive, includes the steps of: 1) during a rotation of the disk, detecting the passage of at least a portion of a first timing mark located at a radial trajectory at a first radius of the disk, and 2) during the same rotation of the disk, writing a second timing mark at a second radius of the disk. The second timing mark is located at least one of a) where at least a portion of the second timing mark overlaps at least a portion of the radial trajectory of the first timing mark, and b) where the second timing mark is in close proximity to the radial trajectory of the first timing mark. The second timing mark is written based on different parameters such as a measured time interval, a calculated time interval, and a predetermined delay.

Abstract translation: 在诸如盘驱动器中的盘上的可旋转存储介质上写入定时标记的方法包括以下步骤：1）在盘的旋转期间，检测位于第一定时标记的至少一部分的通过 在盘的第一半径处的径向轨迹处，以及2）在盘的相同旋转期间，在盘的第二半径处写入第二定时标记。 第二定时标记位于以下中的至少一个中：a）第二定时标记的至少一部分与第一定时标记的径向轨迹的至少一部分重叠，以及b）第二定时标记紧邻 第一定时标记的径向轨迹。 基于不同的参数（例如测量的时间间隔，计算的时间间隔和预定的延迟）写入第二定时标记。

公开(公告)号：US08736048B2

公开(公告)日：2014-05-27

申请号：US13398534

申请日：2012-02-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: H01L23/36

CPC classification number: H01L23/46 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

Abstract: A multi-chip module (MCM) structure comprises more than one semiconductor chip lying in a horizontal plane, the MCM having individual chip contact patches on the chips and a flexible heat sink having lateral compliance and extending in a plane in the MCM and secured in a heat exchange relation to the chips through the contact patches. The MCM has a mismatch between the coefficient of thermal expansion of the heat sink and the MCM and also has chip tilt and chip height mismatches. The flexible heat sink with lateral compliance minimizes or eliminates shear stress and shear strain developed in the horizontal direction at the interface between the heat sink and the chip contact patches by allowing for horizontal expansion and contraction of the heat sink relative to the MCM without moving the individual chip contact patches in a horizontal direction.

Abstract translation: 多芯片模块（MCM）结构包括位于水平面中的多于一个的半导体芯片，MCM在芯片上具有单独的芯片接触贴片，并且柔性散热器具有侧向顺应性并且在MCM中的平面中延伸并固定在 通过接触片与芯片的热交换关系。 MCM具有散热器的热膨胀系数与MCM之间的不匹配，并且还具有芯片倾斜和芯片高度失配。 具有横向顺从性的柔性散热器通过允许相对于MCM的散热器的水平膨胀和收缩，最小化或消除了在散热器和芯片接触片之间的界面处在水平方向上产生的剪切应力和剪切应变，而不移动 单个芯片接触片在水平方向。

公开(公告)号：US20140020884A1

公开(公告)日：2014-01-23

申请号：US13551858

申请日：2012-07-18

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G05D23/00

CPC classification number: H05K7/20836 ,  G05D23/00 ,  H05K7/20281

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools air utilized by the rack of information technology equipment to cool the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat generated by the rack of information technology equipment.

Abstract translation: 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的架构利用的空气以冷却信息技术设备的机架。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 由信息技术设备架构产生。

公开(公告)号：US20140020418A1

公开(公告)日：2014-01-23

申请号：US13588260

申请日：2012-08-17

Applicant: Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

Inventor： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

IPC: F25B49/00 ,  F25D17/02 ,  F25D31/00

CPC classification number: H05K7/20836 ,  G06F1/206

Abstract: A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.

Abstract translation: 数据中心冷却系统可以包括用于冷却没有蒸气压缩制冷的液体冷却剂的传热设备，并且液体冷却剂被用在容纳在数据中心中的液冷信息技术设备机架上。 该系统还可以包括控制器装置，其通过基于信息技术设备温度阈值的一系列液体冷却剂流量值来调节流向液体冷却的信息技术设备机架的液体冷却剂流。

公开(公告)号：US08493738B2

公开(公告)日：2013-07-23

申请号：US13102211

申请日：2011-05-06

Applicant: Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

Inventor： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Abstract translation: 提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内或从插座中取出卡。 液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

公开(公告)号：US20130014926A1

公开(公告)日：2013-01-17

申请号：US13184239

申请日：2011-07-15

Applicant: Madhusudan K. Iyengar ,  Pritish R. Parida ,  Mark D. Schultz

Inventor： Madhusudan K. Iyengar ,  Pritish R. Parida ,  Mark D. Schultz

IPC: F28F27/00

CPC classification number: H05K7/20836 ,  F28D15/00 ,  H05K7/2079

Abstract: A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid. It has a second heat transfer fluid freezing point lower than the first heat transfer fluid freezing point, and the second heat transfer fluid freezing point is sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

Abstract translation: 数据中心冷却系统以第一模式运行; 其具有室内部分，其中热量从数据中心的部件吸收;以及室外热交换器部分，其中外部空气被用于冷却至少在室外热交换器部分中存在的第一传热流体（例如，水） 第一模式下的冷却系统。 第一传热流体是相对高性能的传热流体（与第二流体相比），并且具有第一传热流体凝固点。 确定已经达到适当的时间以从第一模式切换到第二模式。 基于该判定，与第一传热流体相比，数据冷却系统的室外热交换器部分切换为相对低性能的传热流体的第二传热流体。 其具有比第一传热流体凝固点低的第二传热流体凝固点，并且当室外空气温度下降到与第一传热的第一预定关系时，第二传热流体凝固点足够低以在不冻结的情况下运行 流体凝固点。

公开(公告)号：US20100252225A1

公开(公告)日：2010-10-07

申请号：US12814746

申请日：2010-06-14

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: B22D17/00

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H01L2224/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the platform.

Abstract translation: 停车位置界面的模板包括：用于保持焊料的模板; 具有用于在模板上分配焊料凸块的O形环的填充头; 用于定位填充头的停车位置; 以及在模板和停车位置之间的平台，用于将填充头从第一位置相对移动到第二位置，使得O形环在穿过平台时减压。