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10 条记录 (耗时 0.054 秒)

    Directly connected heat exchanger tube section and coolant-cooled structure
    4.
    发明授权
    Directly connected heat exchanger tube section and coolant-cooled structure 有权
    直接连接热交换器管段和冷却剂冷却结构

    公开(公告)号：US08687364B2

    公开(公告)日：2014-04-01

    申请号：US13283933

    申请日：2011-10-28

    申请人： Timothy J. Chainer ,  Patrick A. Coico ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

    发明人： Timothy J. Chainer ,  Patrick A. Coico ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

    IPC分类号： H05K7/20

    CPC分类号： B23P15/26 ,  H05K7/20781 ,  H05K7/20827 ,  Y10T29/4935 ,  Y10T29/49826

    摘要： A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

    摘要翻译： 提供了一种用于电子机架的冷却装置，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。 与电子机架相关联并设置成冷却通过齿条的空气的热交换器包括多个不同的冷却剂承载管部分，每个管部分具有冷却剂入口和冷却剂出口，其中一个耦合 与冷却剂回路流体连通以便于冷却剂流过管段。 冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。 该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

    Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
    7.
    发明授权
    Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) 有权
    将电子卡耦合到冷却剂冷却结构的热转印结构

    公开(公告)号：US08913384B2

    公开(公告)日：2014-12-16

    申请号：US13527947

    申请日：2012-06-20

    申请人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

    发明人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

    IPC分类号： H05K7/20 ,  H05K13/00

    CPC分类号： H05K7/20745 ,  H05K7/2079 ,  H05K13/00

    摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

    摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

    HEAT SINK WITH HEAT BUS AND FIN STRUCTURE
    10.
    发明申请
    HEAT SINK WITH HEAT BUS AND FIN STRUCTURE 审中-公开
    散热与散热和熔体结构

    公开(公告)号：US20130133859A1

    公开(公告)日：2013-05-30

    申请号：US13307562

    申请日：2011-11-30

    申请人： Troy W. Glover ,  Michael S. June ,  Bejoy J. Kochuparambil ,  Chunjian Ni ,  Pradeep Ramineni ,  Whitcomb R. Scott, III

    发明人： Troy W. Glover ,  Michael S. June ,  Bejoy J. Kochuparambil ,  Chunjian Ni ,  Pradeep Ramineni ,  Whitcomb R. Scott, III

    IPC分类号： F28F13/00 ,  F28F7/00

    CPC分类号： H01L23/367 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink to remove heat from a processor within a chassis to air moving through a fin structure on the heat sink. An embodiment of the heat sink comprises a heat bus engaging the processor to conduct heat from the processor to a fin structure having interconnected, repeating cellular air channels. A U-shaped heat bus comprises a base and first and second legs extending therefrom connected to opposite sides of the fin structure. An embodiment of the heat bus has a solid conductive core to conductively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. Alternately, an embodiment of the heat bus has a hollow core containing a fluid to evaporatively transfer heat from the processor through the base and the first and second legs to sides of the fin structure.

    摘要翻译： 散热器，用于从机箱内的处理器移除热量，使空气流过散热片上的翅片结构。 散热器的实施例包括接合处理器的热母线，以将热量从处理器传导到具有相互连接的重复蜂窝空气通道的翅片结构。 U形热母线包括底座以及从翅片结构的相对侧延伸的第一和第二腿部。 热量总线的一个实施例具有固体导电芯，以将热量从处理器传导通过基座，第一和第二支腿传导到翅片结构的侧面。 或者，热量总线的一个实施例具有一个中空的芯，该中空芯含有一种流体，用于将来自处理器的热量从底部以及第一和第二支腿蒸发地传递到翅片结构的侧面。