公开(公告)号：US07545647B2

公开(公告)日：2009-06-09

申请号：US12037067

申请日：2008-02-25

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20 ,  H01L23/36

CPC classification number: H01L23/433 ,  A01H5/02 ,  A01H6/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的固体导热层。 固体导热层是与电子设备接触的平面。 该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中 多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大， 导电层。

公开(公告)号：US20080298016A1

公开(公告)日：2008-12-04

申请号：US12180711

申请日：2008-07-28

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin portion has a narrowed tip; coupling the spring structure with a planar heat-conducting material to form a first heat-conducting layer; positioning the first heat-conducting layer such that the planar heat-conducting material is on top; and placing the first heat-conducting layer over the electronic device such that the fin portion is oriented at an angle toward the electronic device, and such that the narrowed tip of the fin portion is in contact with the top surface of the electronic device.

Abstract translation: 一种用于冷却电子设备的方法包括：通过将多个弹簧元件与一个以一定角度取向的翅片部分联接来形成弹簧结构，其中，翅片部分的第一端具有变窄的尖端; 将弹簧结构与平面导热材料联接以形成第一导热层; 将第一导热层定位成使得平面导热材料位于顶部; 并且将第一导热层放置在电子设备上，使得翅片部分朝向电子设备成一定角度，并且使得翅片部分的变窄的尖端与电子设备的顶表面接触。

公开(公告)号：US07355855B2

公开(公告)日：2008-04-08

申请号：US11151830

申请日：2005-06-14

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  A01H5/02 ,  A01H6/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements provide mechanical compliance. In one alternative, the structure further includes a solid heat-conducting layer disposed over the electronic device, wherein the plurality of spring elements are coupled to the solid heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的顶层。 该结构还包括设置在顶层和电子设备之间的多个弹簧元件，用于从电子设备提供热路径，并且其中多个弹簧元件提供机械顺应性。 在一个替代方案中，该结构还包括设置在电子设备上的固体导热层，其中多个弹簧元件联接到固体导热层。

公开(公告)号：US07136243B2

公开(公告)日：2006-11-14

申请号：US11015130

申请日：2004-12-17

Applicant: Timothy J. Chainer ,  Anthony P. Praino ,  Mark D. Schultz ,  Bucknell C. Webb ,  Edward J. Yarmchuk

Inventor： Timothy J. Chainer ,  Anthony P. Praino ,  Mark D. Schultz ,  Bucknell C. Webb ,  Edward J. Yarmchuk

IPC: G11B5/09 ,  G11B21/02

CPC classification number: G11B5/59633 ,  G11B5/5565 ,  G11B21/106

Abstract: Improvements in placement of timing patterns in self-servowriting include correcting for systematic errors due to geometric effects. A correction is made for varying systematic errors, such as when the recording head has spatially separate read and write elements. Further, servopattern rotation due to residual or unmeasured systematic errors is reduced by using a once per revolution clock index derived from the motor drive current waveform or any other sensor. In one aspect of correcting for systematic errors in the writing of timing patterns on a storage medium of a storage device, a time interval between a trigger pattern written at a first radial position of the storage medium and a rotational index is measured. The rotational index is related to the rotational orientation of the storage medium with respect to a fixed frame of the storage device. The location of another trigger pattern to be written is shifted, using the measured time interval to determine the shift in location for the another trigger pattern.

Abstract translation: 自我维护中定时模式布局的改进包括纠正由于几何效应引起的系统误差。 对变化的系统误差进行校正，例如当记录头具有空间上分离的读和写元件时。 此外，通过使用从电动机驱动电流波形或任何其他传感器导出的每转一次的时钟指数来减少由于残余或未测量的系统误差引起的伺服模式旋转。 在对存储装置的存储介质上的定时模式的写入进行校正系统错误的一个方面，测量在存储介质的第一径向位置上写入的触发模式与旋转指标之间的时间间隔。 旋转指数与存储介质相对于存储装置的固定框架的旋转取向有关。 使用测量的时间间隔来移动要写入的另一个触发模式的位置，以确定另一个触发模式的位置偏移。

公开(公告)号：US06735031B2

公开(公告)日：2004-05-11

申请号：US09774914

申请日：2001-01-31

Applicant: Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb ,  Edward J. Yarmchuk

Inventor： Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb ,  Edward J. Yarmchuk

IPC: G11B502

CPC classification number: G11B5/59633 ,  G11B5/012

Abstract: A method for writing timing marks on a rotatable storage medium, such as on a disk in a disk drive, includes the steps of: 1) during a rotation of the disk, detecting the passage of at least a portion of a first timing mark located at a first radius of the disk, and 2) writing a second timing mark at a second radius of the disk, the location of the second timing mark being based at least in part on a stored calculation of a delay from the time of passage of the first timing mark during a rotation of the rotatable storage medium. The location of the second timing mark is calculated based on alternative time intervals between detected timing marks and on various functions of the time intervals.

Abstract translation: 在诸如盘驱动器中的盘上的可旋转存储介质上写入定时标记的方法包括以下步骤：1）在盘的旋转期间，检测位于第一定时标记的至少一部分的通过 在所述盘的第一半径处，以及2）在所述盘的第二半径处写入第二定时标记，所述第二定时标记的位置至少部分地基于存储的从所述盘的通过时间开始的延迟的计算 在可旋转存储介质旋转期间的第一定时标记。 基于检测到的定时标记之间的替代时间间隔和时间间隔的各种功能来计算第二定时标记的位置。

公开(公告)号：US5612833A

公开(公告)日：1997-03-18

申请号：US349028

申请日：1994-12-02

Applicant: Edward J. Yarmchuk ,  Mark D. Schultz ,  Bucknell C. Webb ,  Timothy J. Chainer

Inventor： Edward J. Yarmchuk ,  Mark D. Schultz ,  Bucknell C. Webb ,  Timothy J. Chainer

IPC: G11B5/012 ,  G11B5/55 ,  G11B5/596 ,  G11B21/10

CPC classification number: G11B5/5534 ,  G11B21/10 ,  G11B21/106 ,  G11B5/59633 ,  G11B5/59644

Abstract: During a write revolution of a storage medium, a transition is written on the storage medium while servoing on another transition previously recorded on the storage medium. During that write revolution, a position error signal corresponding to the position error of the transducer relative to the previously recorded transition is determined. That position error signal is then stored, during the write revolution, to be used in computing a reference track value associated with the transition being written to correct for the position error. Additionally, a product servo-pattern is written, which includes an embodying of the position error therein.

Abstract translation: 在存储介质的写入转动期间，在先前记录在存储介质上的另一个转换上进行伺服处理，在存储介质上写入转换。 在该写入旋转期间，确定对应于换能器相对于先前记录的转变的位置误差的位置误差信号。 然后在写入旋转期间存储该位置误差信号，以用于计算与被写入的转换相关联的参考轨迹值，以校正位置误差。 此外，写入产品伺服图案，其中包括其中的位置误差。

公开(公告)号：US07980445B2

公开(公告)日：2011-07-19

申请号：US12018421

申请日：2008-01-23

Applicant: Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

Inventor： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

IPC: B23K1/00 ,  B23K37/06 ,  B23K37/00 ,  B23K35/12

CPC classification number: H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

Abstract: A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

公开(公告)号：US07505224B2

公开(公告)日：2009-03-17

申请号：US11374504

申请日：2006-03-13

Applicant: German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

Inventor： German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

IPC: G11B15/68 ,  G11B15/00

CPC classification number: G11B15/682 ,  G11B15/689 ,  G11B17/22 ,  G11B17/225 ,  G11B17/228

Abstract: In an automated library, data cartridges, such as magnetic tape cartridges, are stored in storage cells and accessed by data storage drives. An accessor with a gripper transports cartridges between storage cells and storage drives. Cartridges are prioritized according to their relative importance. A processor manages the placement of the cartridges in cells by having higher priority cartridges stored closer to the front of multi-cartridge cells than cartridges with a lower priority. Cartridges with a higher priority may also be stored closer to a storage drive than cartridges with a lower priority. A pusher may be used to push cartridges towards the front of multi-cartridge cells with an empty position to enable the gripper to reach the front cartridge.

Abstract translation: 在自动化库中，数据盒式磁带（如磁带盒）存储在存储单元中，并由数据存储驱动器访问。 具有夹持器的存取器在存储单元和存储驱动器之间传送墨盒。 墨盒根据其相对重要性进行优先排序。 处理器通过将较高优先级的存储盒存储在比多盒单元的前面更靠近具有较低优先级的盒，来管理盒中的盒的放置。 具有较高优先级的墨盒也可以比具有较低优先级的墨盒更靠近存储驱动器。 可以使用推动器将空盒朝向多盒单元的前部推送，以使夹具能够到达前盒。

公开(公告)号：US07304849B2

公开(公告)日：2007-12-04

申请号：US10919180

申请日：2004-08-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: H05K7/20

CPC classification number: H01L23/04 ,  H01L23/3675 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling structure for an electronic device comprises a compliant cap preloaded over the electronic device. The compliant cap comprises a horizontal top surface and at least one vertical support for the surface, the vertical support comprising a compliant portion and wherein the compliant cap comprises a thermally conducting material.

Abstract translation: 电子设备的冷却结构包括预先装载在电子设备上的柔性盖。 顺应性盖包括水平顶表面和用于表面的至少一个垂直支撑件，垂直支撑件包括柔顺部分，并​​且其中柔性帽包括导热材料。

公开(公告)号：US09107327B2

公开(公告)日：2015-08-11

申请号：US13551929

申请日：2012-07-18

Applicant: Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

Inventor： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

IPC: G05D23/00 ,  H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20836 ,  G06F1/206

Abstract: A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center.

Abstract translation: 从数据中心去除热量的方法方面可以使用液体冷却剂冷却而不进行蒸气压缩制冷在液冷信息技术设备机架上。 该方法还可以包括通过使用基于数据中心的信息技术设备温度阈值的控制器装置通过一定范围的液体冷却剂流量来调节流向数据中心的液体冷却剂流。