公开(公告)号：US20090218386A1

公开(公告)日：2009-09-03

申请号：US12087195

申请日：2006-12-27

申请人： Masahiko Kimbara ,  Akiko Kumano ,  Hidehito Kubo ,  Keiji Toh ,  Masao Shiraki ,  Shigekazu Higashimoto

发明人： Masahiko Kimbara ,  Akiko Kumano ,  Hidehito Kubo ,  Keiji Toh ,  Masao Shiraki ,  Shigekazu Higashimoto

IPC分类号： B23K31/12 ,  B23K31/02 ,  B23K3/00

CPC分类号： B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K3/0475 ,  B23K2101/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/75266 ,  H01L2224/83801 ,  H01L2224/85096 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/19042 ,  H05K1/0306 ,  H05K3/3494 ,  H05K2201/10674 ,  H05K2203/0278 ,  H05K2203/074 ,  H05K2203/087 ,  H05K2203/159 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/3512

摘要： An object-to-be-soldered (92) is accommodated in a sealable chamber (17). An internal pressure (P) of the chamber (17) is raised to a normal pressure (Po) or higher by feeding a reducing gas to the chamber (17). A soldering of a semiconductor element (12) with respect to a circuit board (11) is carried out in the pressurized state. The pressurized state indicating a set pressure (P1) (for example, 0.13 MPa) is maintained in a solder melting period (t3 to t7) until the molten solder (33) is solidified (t7) after the solder (33) starts melting (t3). Accordingly, voids are inhibited from being generated in the solder after being solidified.

摘要翻译： 待焊接的物体（92）容纳在可密封的室（17）中。 通过向室（17）供给还原气体，室（17）的内压（P）升高到常压（Po）以上。 半导体元件（12）相对于电路板（11）的焊接在加压状态下进行。 表示设定压力（P1）（例如0.13MPa）的加压状态在焊料（33）开始熔融后，在熔融焊料（33）固化（t7）之前保持在焊料熔融时间（t3〜t7） t3）。 因此，在凝固后，阻止在焊料中产生空隙。

公开(公告)号：US20050051294A1

公开(公告)日：2005-03-10

申请号：US10713134

申请日：2003-11-14

申请人： Katsuyoshi Fujita ,  Hidehito Kubo ,  Keiji Toh ,  Akiko Kumano ,  Daigoro Mori

发明人： Katsuyoshi Fujita ,  Hidehito Kubo ,  Keiji Toh ,  Akiko Kumano ,  Daigoro Mori

IPC分类号： C01B3/00 ,  F17C11/00 ,  F28D20/00 ,  F28F1/32 ,  F28D19/00

CPC分类号： F28D7/06 ,  C01B3/0005 ,  F17C11/005 ,  F28D2021/0047 ,  F28F1/32 ,  Y02E60/321 ,  Y02E60/327

摘要： In a hydrogen storing tank (solid filling tank) in which a hydrogen absorbing alloy (solid) is filled, a heat exchanger for executing heat exchange with the hydrogen absorbing alloy is constructed by laminating alternately a first heat-transferring fins formed in corrugated plate shape and a second heat-transferring fins formed in flat plate shape. Partitioned portions that are partitioned by the first heat-transferring fins and the second heat-transferring fins restrict movement of hydrogen absorbing alloy powders (MH powders) in a subsiding direction. Therefore, movement of the MH powders can surely be prevented by not using members that has no concern with the heat exchange and reduces an amount of filled MH powders and a volume in which the heat exchanger is provided.

摘要翻译： 在填充有吸氢合金（固体）的储氢罐（固体填充槽）中，与吸氢合金进行热交换的热交换器通过交替层叠形成波纹板状的第一传热翅片而构成 以及形成为平板状的第二传热翅片。 由第一传热翅片和第二传热翅片隔开的分隔部分限制吸氢合金粉末（MH粉末）沿下沉方向的运动。 因此，通过不使用不关心热交换的部件，减少MH粉末的填充量和设置热交换器的体积，可以确实地防止MH粉末的移动。

公开(公告)号：US07115159B2

公开(公告)日：2006-10-03

申请号：US10713134

申请日：2003-11-14

申请人： Katsuyoshi Fujita ,  Hidehito Kubo ,  Keiji Toh ,  Akiko Kumano ,  Daigoro Mori

发明人： Katsuyoshi Fujita ,  Hidehito Kubo ,  Keiji Toh ,  Akiko Kumano ,  Daigoro Mori

IPC分类号： B01D53/04 ,  F28D19/00 ,  F28F7/00

CPC分类号： F28D7/06 ,  C01B3/0005 ,  F17C11/005 ,  F28D2021/0047 ,  F28F1/32 ,  Y02E60/321 ,  Y02E60/327

摘要： In a hydrogen storing tank (solid filling tank) in which a hydrogen absorbing alloy (solid) is filled, a heat exchanger for executing heat exchange with the hydrogen absorbing alloy is constructed by laminating alternately first heat-transferring fins formed in corrugated plate shape and second heat-transferring fins formed in flat plate shape. Partitioned portions that are partitioned by the first heat-transferring fins and the second heat-transferring fins restrict movement of hydrogen absorbing alloy powders (MH powders) in a subsiding direction. Therefore, movement of the MH powders can surely be prevented by not using members that has no concern with the heat exchange and reduces an amount of filled MH powders and a volume in which the heat exchanger is provided.

摘要翻译： 在填充有吸氢合金（固体）的储氢罐（固体填充槽）中，与吸氢合金进行热交换的热交换器通过层叠交替形成第一第一传热翅片形成波纹板状和 形成为平板状的第二传热翅片。 由第一传热翅片和第二传热翅片分隔开的分隔部分限制吸氢合金粉末（MH粉末）沿下沉方向的移动。 因此，通过不使用不关心热交换的部件，减少MH粉末的填充量和设置热交换器的体积，可以确实地防止MH粉末的移动。

公开(公告)号：US08657920B2

公开(公告)日：2014-02-25

申请号：US12756718

申请日：2010-04-08

申请人： Haruyuki Nakanishi ,  Norihiko Nakamura ,  Hidekazu Arikawa ,  Hirofumi Fujiwara ,  Hidehito Kubo ,  Keiji Toh ,  Akiko Kumano ,  Shohei Matsumoto

发明人： Haruyuki Nakanishi ,  Norihiko Nakamura ,  Hidekazu Arikawa ,  Hirofumi Fujiwara ,  Hidehito Kubo ,  Keiji Toh ,  Akiko Kumano ,  Shohei Matsumoto

IPC分类号： B01D53/22 ,  B01D19/00 ,  C01B3/04

CPC分类号： B01D53/22 ,  B01D63/06 ,  B01D63/08 ,  B01D2256/16 ,  B01D2257/104 ,  B01D2257/80 ,  B01D2319/06 ,  C01B3/501 ,  C01B13/0251

摘要： An apparatus and method purify hydrogen from a mixed fluid containing gaseous hydrogen, gaseous oxygen, and liquid water. The apparatus has a mixed fluid channel through which the mixed fluid flows; a first gas channel through which a mixed gas containing gaseous hydrogen and gaseous oxygen flows; a second gas channel through which gaseous hydrogen or oxygen flows; a gas-liquid separating membrane forming a wall between the mixed fluid channel and the first gas channel, separating the mixed gas from the mixed fluid of the mixed fluid channel, and providing the separated mixed gas to the first gas channel; and a hydrogen or oxygen separating membrane forming a wall between the first gas channel and the second gas channel, separating gaseous hydrogen or oxygen from the mixed gas of the first gas channel, and providing the separated gaseous hydrogen or oxygen to the second gas channel.

摘要翻译： 一种从含有气态氢气，氧气和液态水的混合流体中净化氢气的装置和方法。 该装置具有混合流体通道，混合流体通过该混合流体流动; 第一气体通道，含有气态氢气和气态氧气的混合气体通过该通道流动; 气体氢气或氧气流过的第二气体通道; 形成所述混合流体流路和所述第一气体流路之间的壁的气液分离膜，从所述混合流体流路的混合流体分离混合气体，将所述分离的混合气体提供给所述第一气体流路; 以及在所述第一气体通道和所述第二气体通道之间形成壁的氢或氧分离膜，从所述第一气体通道的混合气体中分离出气态氢或氧，并将所分离的气态氢或氧提供给所述第二气体通道。

公开(公告)号：US20110297531A1

公开(公告)日：2011-12-08

申请号：US12756771

申请日：2010-04-08

申请人： Haruyuki NAKANISHI ,  Norihiko NAKAMURA ,  Hidekazu ARIKAWA ,  Hirofumi FUJIWARA ,  Hidehito KUBO ,  Keiji TOH ,  Akiko Kumano ,  Shohei Matsumoto

发明人： Haruyuki NAKANISHI ,  Norihiko NAKAMURA ,  Hidekazu ARIKAWA ,  Hirofumi FUJIWARA ,  Hidehito KUBO ,  Keiji TOH ,  Akiko Kumano ,  Shohei Matsumoto

IPC分类号： C01B3/32 ,  B01J8/00

CPC分类号： B01J19/127 ,  B01J19/2475 ,  B01J2219/0875 ,  B01J2219/0877 ,  B01J2219/0892 ,  C01B3/042 ,  C01B2203/0405 ,  Y02E60/364

摘要： The present invention provides a hydrogen generation device using a photocatalyst to generate hydrogen from liquid water or water vapor and a method of using the same. The hydrogen generation device of the present invention has a water channel through which liquid water or water vapor flows, and which has an outer circumferential wall made at least in part of a transparent material; a hydrogen channel through which hydrogen flows and which is located at the inner circumference side of the water channel; a hydrogen separating membrane forming at least part of a wall between the water channel and hydrogen channel, separating hydrogen from the liquid water or water vapor in the water channel, and providing the hydrogen to the hydrogen channel; and a photocatalyst layer arranged on least at part of the water channel-side surface of the hydrogen separating membrane.

摘要翻译： 本发明提供一种使用光催化剂从液态水或水蒸汽中生成氢的氢生成装置及其使用方法。 本发明的氢生成装置具有液体水或水蒸汽流过的水通道，具有至少部分由透明材料制成的外周壁; 氢气通过氢通道，位于水通道的内周侧; 氢分离膜，其形成水通道和氢通道之间的壁的至少一部分，从水通道中的液态水或水蒸汽中分离出氢气，并向氢气通道提供氢气; 以及设置在氢分离膜的至少一部分水通道侧表面上的光催化剂层。

公开(公告)号：US08475722B2

公开(公告)日：2013-07-02

申请号：US12756771

申请日：2010-04-08

申请人： Haruyuki Nakanishi ,  Norihiko Nakamura ,  Hidekazu Arikawa ,  Hirofumi Fujiwara ,  Hidehito Kubo ,  Keiji Toh ,  Akiko Kumano ,  Shohei Matsumoto

发明人： Haruyuki Nakanishi ,  Norihiko Nakamura ,  Hidekazu Arikawa ,  Hirofumi Fujiwara ,  Hidehito Kubo ,  Keiji Toh ,  Akiko Kumano ,  Shohei Matsumoto

IPC分类号： B01J19/08 ,  B01J19/12 ,  C01B3/04

CPC分类号： B01J19/127 ,  B01J19/2475 ,  B01J2219/0875 ,  B01J2219/0877 ,  B01J2219/0892 ,  C01B3/042 ,  C01B2203/0405 ,  Y02E60/364

摘要： The present invention provides a hydrogen generation device using a photocatalyst to generate hydrogen from liquid water or water vapor and a method of using the same. The hydrogen generation device of the present invention has a water channel through which liquid water or water vapor flows, and which has an outer circumferential wall made at least in part of a transparent material; a hydrogen channel through which hydrogen flows and which is located at the inner circumference side of the water channel; a hydrogen separating membrane forming at least part of a wall between the water channel and hydrogen channel, separating hydrogen from the liquid water or water vapor in the water channel, and providing the hydrogen to the hydrogen channel; and a photocatalyst layer arranged on least at part of the water channel-side surface of the hydrogen separating membrane.

摘要翻译： 本发明提供一种使用光催化剂从液态水或水蒸汽中生成氢的氢生成装置及其使用方法。 本发明的氢生成装置具有液体水或水蒸汽流过的水通道，具有至少部分由透明材料制成的外周壁; 氢气通过氢通道，位于水通道的内周侧; 氢分离膜，其形成水通道和氢通道之间的壁的至少一部分，从水通道中的液态水或水蒸汽中分离出氢气，并向氢气通道提供氢气; 以及设置在氢分离膜的至少一部分水通道侧表面上的光催化剂层。

公开(公告)号：US20080291636A1

公开(公告)日：2008-11-27

申请号：US12154592

申请日：2008-05-23

申请人： Shogo Mori ,  Akiko Kumano

发明人： Shogo Mori ,  Akiko Kumano

IPC分类号： H05K7/20 ,  H01L21/50

CPC分类号： H01L23/473 ,  H01L23/3735 ,  H01L23/5386 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0338 ,  H01L2924/00

摘要： The semiconductor device includes a circuit board. The circuit board has an insulating substrate, a metal circuit fixed on a first side of the insulating substrate, and a metal plate fixed on a second side of the insulating substrate. The semiconductor device further has a semiconductor element mounted on the metal circuit, a stress reducing member fixed on the metal plate, and a heat sink fixed on the stress reducing member. The stress reducing member is plate-shaped and has round-shaped corners.

摘要翻译： 半导体器件包括电路板。 电路板具有绝缘基板，固定在绝缘基板的第一面上的金属电路和固定在绝缘基板的第二面上的金属板。 半导体器件还具有安装在金属电路上的半导体元件，固定在金属板上的应力消除部件和固定在减压部件上的散热片。 减压构件是板形的并且具有圆形的角部。

公开(公告)号：US07813135B2

公开(公告)日：2010-10-12

申请号：US12154592

申请日：2008-05-23

申请人： Shogo Mori ,  Akiko Kumano

发明人： Shogo Mori ,  Akiko Kumano

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： H01L23/473 ,  H01L23/3735 ,  H01L23/5386 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0338 ,  H01L2924/00

摘要： The semiconductor device includes a circuit board. The circuit board has an insulating substrate, a metal circuit fixed on a first side of the insulating substrate, and a metal plate fixed on a second side of the insulating substrate. The semiconductor device further has a semiconductor element mounted on the metal circuit, a stress reducing member fixed on the metal plate, and a heat sink fixed on the stress reducing member. The stress reducing member is plate-shaped and has round-shaped corners.

摘要翻译： 半导体器件包括电路板。 电路板具有绝缘基板，固定在绝缘基板的第一面上的金属电路和固定在绝缘基板的第二面上的金属板。 半导体器件还具有安装在金属电路上的半导体元件，固定在金属板上的应力消除部件和固定在减压部件上的散热片。 减压构件是板形的并且具有圆形的角部。