摘要:
A process for producing high-quality .alpha.-olefin polymers with a higher yield in a long lasting stabilized manner even in the case of gas phase polymerization is provided. In the production process of .alpha.-olefin polymers which comprises reacting a trivalent metal halide with a divalent metal compound to obtain a solid product (I); reacting this product with at least one electron donor (ED) and at least one electron acceptor (EA), once to 10 times, and at that time, using TiCl.sub.4 at least once as the (EA) to obtain a solid product (II); combining this product with an organoaluminum compound (OAl) and an (ED) (these three being referred to as catalyst components), the improvement which comprises subjecting a part or the whole of the catalyst components to polymerization treatment with a small amount of an .alpha.-olefin, at least in the coexistence of the solid product (II) and (OAl), in the combination of the catalyst components to obtain a preactivated catalyst, and subjecting .alpha.-olefin(s) to gas phase polymerization or bulk or slurry polymerization followed by gas phase polymerization, using the catalyst.
摘要:
A process for producing .alpha.-olefin polymers is provided which comprises:reacting an organoaluminum compound (A.sub.1) with an electron donor (B.sub.1) to obtain a reaction product (I);reacting (I) with TiCl.sub.4 to obtain a solid product (II);reacting (II) with an electron donor (B.sub.2) and an electron acceptor to obtain a solid product (III);combining (III) with an organoaluminum compound (A.sub.2) and a reaction product (G) of an organoaluminum (A.sub.3) with an electron donor (B.sub.3) ((III), (A.sub.2) and (G) being referred to as catalyst components), and in this combination, subjecting a part or the whole of the catalyst components to polymerization treatment with an .alpha.-olefin at least in the presence of (III) and said (A.sub.2) to obtain a preliminarily activated catalyst;andpolymerizing an .alpha.-olefin in the presence of the catalyst. According to this process, even in the case of gas phase polymerization, the resulting polymer has a uniform particle size; the catalyst employed has not only a high stability but also a high activity whereby the advantages of gas phase polymerization can be fully exhibited; and further it is possible to easily control the stereoregularity of polymer.
摘要:
A method for producing circuit boards with a film having improved printing properties, adhesion, flexibility and heat resistance which comprises applying a liquid printing ink composition comprising an admixture of a solvent, a polyamide-acid and a partially imidized polyamide-acid, then heat to effect drying and curing.
摘要:
The present invention provides a flexible metal-clad laminate obtained by directly applying a polyimide precursor to a metallic conductive foil, and then drying, heating and curing the precursor to form a polyimide film, this flexible metal-clad laminate being characterized in that the polyimide film is composed of two or more polyimide layers, the linear thermal expansion coefficient of at least one of the second and later polyimide layers is larger than that of the first layer brought into contact with the metallic conductive foil, and the requirements of the following formulae are met:3.0 t.sub.n and ##EQU1## wherein t.sub.n is the thickness (.mu.m) of the outermost layer (the nth layer) of the polyimide layers, t.sub.n-1 is the thickness (.mu.m) of the film comprising the first layer to the (n-1)th layer of the polyimide layers, and Q.sub.n-1 is a double value (cm) of the curvature radius of the curl of the film comprising the first layer to the (n-1)th layer of the polyimide layers and Rz is the average surface roughness (.mu.m) of the metallic conductive foil. This board does not curl immediately after curing, and the curl does not occur even after the formation of a circuit by etching.
摘要:
A flexible copper-applied substrate comprises a copper foil and a resin layer comprising a composite material of a polyimide and a polyimide silicone, the resin layer being directly formed on the surface of the copper foil, said substrate being producible by applying a polyamide acid composite composed of a mixed solution of a polyamide acid and a polyamide acid alkylsilane to a copper foil and heating.
摘要:
In a process for producing a flexible printed base by directly coating a copper foil with a polyimide precursor, followed by heating, drying and curing, a process affording a flexible printed base having a superior folding endurance and a good heat resistance at a cheap cost is provided, which process comprises carrying out the curing in an inert gas under a tension of 0.02 to 0.2 Kg/cm and at 200.degree. and 450.degree. C.
摘要:
A silicon-modified, adhesive polyimide film composed mainly of the repetition units of the formula (I) and a process for producing a polyimide film composite product using the above film are provided, the formula (I) being ##STR1## the above process for producing a polyimide film composite product comprising subjecting the above-silicon-modified polyimide film to contact-bonding on heating to a material to be adhered, at an ultimate curing temperature of 130.degree.-230.degree. C.The above polyimide film is highly adhesive and heat-resistant in spite of heating at a relatively low temperature.
摘要:
A polyimide having a low elastic modulus and also superior heat resistance and mechanical characteristics and soluble in solvents and a process for producing the same are provided,which polyimide comprises as main components, 60 to 99% by mol of repetition units of the formula (I) and 1 to 40% by mol of repetition units of the formula (II) ##STR1## wherein Ar is a tetravalent aromatic group; X and Y are at least one group bonded to phenyl group at o-position relative to N atom and selected from 1-4C alkyl, CO group or OH group; R.sup.1 is a 3-5C divalent alkyl or phenylene; R.sup.2 is 4 or less C alkyl or phenyl; l and m are each 1 to 4; and n is 20 to 300, andwhich polyimide is produced by reacting diamino compounds consisting of 60 to 99% by mol of an aromatic diamine of the formula (V) and 1 to 40% by mol of a silicone diamine of the formula (VI), with an aromatic tetracarboxylic acid dianhydride of the formula (IV) in an organic polar solvent at 20.degree.-250.degree. C., ##STR2## wherein Ar, X, Y, R.sup.1, l, m and n are each as defined above.
摘要:
The present invention provides a process for producing molded articles of a polyimide precursor by a use of a usual extrusion technique, and physical properties of polyimide products prepared by the heat treatment of the molded articles of the polyimide precursor at 400.degree. C. are excellent. This process is characterized by drying a solid obtained by pouring a dilute solution of a polyimide precursor including an aromatic tetracarboxylic acid component and an aromatic diamine component 1 into a liquid in which the precursor is only poorly soluble to obtain a dry solid having a polyimide precursor concentration of 50-70% by weight, and then extruding this dry solid at 80.degree.-130.degree. C.
摘要:
A flexible double-sided copper-clad printed-circuit base board is provided with a core resin layer of a composite material essentially composed of a specific rigid-structured polyimide and a specific flexible-structured crosslinked polyimide silicone in a state of being inseparable from each other, wherein the core resin layer is formed directly between two copper foils. This base board is produced by coating a surface of a copper foil with a polyamic acid solution mixture of a specific polyamic acid and a specific polyamic acid - alkylsilane, heat-treating the resulting coated copper foil, and contact-bonding another copper foil to the resulting copper-foil/polyimide laminate.