利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

95 条记录 (耗时 0.034 秒)

    Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
    11.
    发明申请
    Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management 有权
    具有用于热管理的热超导传热介质的发光芯片装置

    公开(公告)号：US20060005947A1

    公开(公告)日：2006-01-12

    申请号：US10887601

    申请日：2004-07-09

    申请人： Mehmet Arik ,  Stanton Weaver

    发明人： Mehmet Arik ,  Stanton Weaver

    IPC分类号： F28D15/00

    CPC分类号： H01L33/648 ,  F21K9/00 ,  F21W2131/103 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48464 ,  H05K1/0203 ,  H05K1/05 ,  H01L2924/00014

    摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips are attached and a second side opposite the first side. A thermally superconducting heat transfer medium (22, 122, 222, 322, 422) is disposed in an interior volume of the support and thermally connects the first and second sides of the support. The thermally superconducting heat transfer medium has a thermal conductivity at least 1500 times greater than the thermal conductivity of copper.

    摘要翻译： 发光装置（10,110,210,310,410）包括一个或多个发光芯片（12,112,212,312,412）和支撑件（13,14,144,214,314,414），所述支撑件 发光芯片设置在其上。 支撑件包括附接有发光芯片的第一侧和与第一侧相对的第二侧。 热超导传热介质（22,122,222,322,422）设置在支撑件的内部容积中并且热连接支撑件的第一和第二侧。 热超导传热介质具有比铜的热导率至少大1500倍的导热系数。

    Light emitting diode apparatuses with heat pipes for thermal management
    12.
    发明授权
    Light emitting diode apparatuses with heat pipes for thermal management 有权
    具有用于热管理的热管的发光二极管装置

    公开(公告)号：US07095110B2

    公开(公告)日：2006-08-22

    申请号：US10851273

    申请日：2004-05-21

    申请人： Mehmet Arik ,  Stanton Earl Weaver, Jr. ,  Charles Becker

    发明人： Mehmet Arik ,  Stanton Earl Weaver, Jr. ,  Charles Becker

    IPC分类号： H01L23/10

    CPC分类号： F21V29/51 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/648 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

    摘要翻译： 发光设备（10,110,210,310,410）包括设置在芯片支撑壁（16,116,216）上的一个或多个发光二极管芯片（12,112,212,312,412），其包括印刷电路 （34,134,234,360,362,460,462），与发光二极管芯片连接。 热管（24,124,224,324,424）具有由包括芯片支撑壁和至少一个附加壁（18,20,28）的壁限定的密封体积（22,122,222,322,422） 120,218）。 热管还包括设置在密封体积中的传热流体（26,226,326,426）。

    Flow controlled effective LED based lighting system
    13.
    发明授权
    Flow controlled effective LED based lighting system 有权
    流量控制有效的LED照明系统

    公开(公告)号：US09464802B2

    公开(公告)日：2016-10-11

    申请号：US14183931

    申请日：2014-02-19

    申请人： Muhammed Nasir Inan ,  Mehmet Arik

    发明人： Muhammed Nasir Inan ,  Mehmet Arik

    IPC分类号： F21V29/00 ,  F21V29/83 ,  F21K99/00 ,  F21V23/00 ,  F21V29/503 ,  F21V9/16 ,  F21V29/77 ,  F21Y101/02 ,  F21Y101/00

    CPC分类号： F21V29/83 ,  F21K9/232 ,  F21K9/64 ,  F21V9/30 ,  F21V23/006 ,  F21V23/009 ,  F21V29/503 ,  F21V29/77 ,  F21Y2101/00 ,  F21Y2107/40 ,  F21Y2115/10

    摘要： A lighting system has a heat sink for removing the heat released by LED chips by means of natural convection and thermal radiation. A center opening formed between air and heat sink fins enables the transfer of heat generated by LEDs, electronic driver circuit and phosphor on said heat sink fins to the flowing air inside and removing from the system, and increases the contact surface of heat sink fins with the air that enables to transfer the heat effectively from heat sink fins to flowing air and also with effective radiative heat transfer. The heat sink has a chimney inlet where air enters into said center opening, on which the PCB and said LED package are positioned, and which interconnects LED package and heat sink, which has an optimized structure and base angle, that maximize the heat removal by natural convection and thermal radiation.

    摘要翻译： 照明系统具有用于通过自然对流和热辐射去除由LED芯片释放的热量的散热器。 形成在空气和散热鳍片之间的中心开口使得能够将LED，电子驱动器电路和所述散热片上的荧光体产生的热量传递到内部的流动空气并从系统中移除，并且增加散热鳍片的接触表面 能够有效地将热量从散热片转移到流动的空气中并且还具有有效的辐射热传递的空气。 散热器具有烟道入口，空气进入所述中心开口，PCB和所述LED封装定位在所述中心开口上，并且其互连LED封装和散热器，其具有优化的结构和底角，从而最大限度地减少热量 自然对流和热辐射。

    SYSTEM AND METHOD FOR MOUNTING SYNTHETIC JETS
    17.
    发明申请
    SYSTEM AND METHOD FOR MOUNTING SYNTHETIC JETS 有权
    用于安装合成喷嘴的系统和方法

    公开(公告)号：US20120018537A1

    公开(公告)日：2012-01-26

    申请号：US13253356

    申请日：2011-10-05

    申请人： Mehmet Arik ,  William Edward Burdick, JR.

    发明人： Mehmet Arik ,  William Edward Burdick, JR.

    IPC分类号： F23D11/10

    CPC分类号： B05B17/0615 ,  F04B17/003 ,  F04B43/046 ,  F23D14/48 ,  F23D2900/14482

    摘要： A synthetic jet actuator includes a first plate, a second plate spaced apart from the first plate and arranged parallelly thereto, and a housing positioned about the first and second plates and defining a chamber, the housing having a pair of orifices formed therein in opposing sides of the housing such that the chamber is in fluid communication with an external environment. The synthetic jet actuator also includes a mounting mechanism configured to mount the first and second plates within the housing in a suspended arrangement and an actuator element coupled to at least one of the first and second plates to selectively cause deflection thereof, thereby changing a volume within the chamber so that a series of fluid vortices are generated and projected to the external environment out from the pair of orifices of the housing.

    摘要翻译： 合成射流致动器包括第一板，与第一板间隔开并平行设置的第二板和围绕第一板和第二板定位并限定室的壳体，壳体具有在相对侧形成的一对孔口 使得室与外部环境流体连通。 合成射流致动器还包括安装机构，该安装机构构造成将悬挂布置中的第一和第二板安装在壳体内，以及联接到第一和第二板中的至少一个的致动器元件，以选择性地引起其偏转，从而改变 从而使得一系列流体旋涡产生并从外壳的一对孔口投射到外部环境。

    Cooling systems employing fluidic jets, methods for their use and methods for cooling
    18.
    发明授权
    Cooling systems employing fluidic jets, methods for their use and methods for cooling 有权
    采用流体喷射的冷却系统，其使用方法和冷却方法

    公开(公告)号：US08051905B2

    公开(公告)日：2011-11-08

    申请号：US11464563

    申请日：2006-08-15

    申请人： Mehmet Arik ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz

    发明人： Mehmet Arik ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz

    IPC分类号： F28F13/02 ,  F28F13/08 ,  F28F13/10 ,  F28F13/12 ,  H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

    摘要： In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.

    摘要翻译： 在一个实施例中，公开了一种冷却系统。 冷却系统包括：用于接收冷却介质的冷却通道，设置在冷却通道附近的基板以及设置在基板内并与冷却通道流体连通的流体射流。 冷却通道用于与要冷却的部件进行热连通。 冷却通道的高度小于或等于约3mm，宽度小于或等于2mm。 流体射流包括由阱和膜限定的空腔。 在一个实施例中，一种冷却电气部件的方法包括：使冷却介质通过冷却通道，将冷却介质拉入一个或多个流体喷射器，将冷却介质从一个或多个流体喷射器排出到冷却通道 并且从电气部件去除热能。

    METHOD AND APPARATUS FOR IMPROVED COOLING OF A HEAT SINK USING A SYNTHETIC JET
    19.
    发明申请
    METHOD AND APPARATUS FOR IMPROVED COOLING OF A HEAT SINK USING A SYNTHETIC JET 审中-公开
    使用合成喷嘴改善散热的方法和装置

    公开(公告)号：US20110174462A1

    公开(公告)日：2011-07-21

    申请号：US13074700

    申请日：2011-03-29

    申请人： Mehmet Arik ,  Yogen Vishwas Utturkar

    发明人： Mehmet Arik ,  Yogen Vishwas Utturkar

    IPC分类号： F28F13/00 ,  B21D53/02

    CPC分类号： F28F3/022 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A system for cooling a device includes a heat sink comprising a substrate having a plurality of fins arranged thereon, a fan positioned to direct an ambient fluid in a first direction across the heat sink, and a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets. The first synthetic jet assembly is configured to direct the ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction.

    摘要翻译： 一种用于冷却装置的系统包括：散热器，其包括其上布置有多个翅片的基板，定位成沿着第一方向引导环境流体穿过散热器的风扇;以及第一合成射流组件， 孔口合成射流和多个单孔合成射流。 第一合成喷射器组件被构造成引导围绕散热器的第二方向的环境流体，其中第二方向大致垂直于第一方向。