公开(公告)号：US11508700B2

公开(公告)日：2022-11-22

申请号：US16856239

申请日：2020-04-23

Applicant: Meta Platforms Technologies, LLC

Inventor： Rajendra D. Pendse

IPC: H01L33/00 ,  H01L29/20 ,  H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: Disclosed herein are display devices having a left projector and a right projector. According to certain embodiments, a display device includes a first display package having a first LED die, a second LED die, a third LED die, and a first backplane die that is electrically connected to the first LED die, the second LED die, and the third LED die. Each of the first LED die, the second LED die, and the third LED die is symmetric about a first plane that is parallel to an emission direction of the first LED die and perpendicular to a longitudinal direction of the first LED die. The first backplane die is symmetric about a second plane that is parallel to the emission direction of the first LED die and parallel to the longitudinal direction of the first LED die.

公开(公告)号：US11942589B2

公开(公告)日：2024-03-26

申请号：US17742809

申请日：2022-05-12

Applicant: Meta Platforms Technologies, LLC

Inventor： Rajendra D. Pendse

IPC: H01L33/64 ,  G02B27/01 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/644 ,  G02B27/017 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642

Abstract: Disclosed herein is an LED device that includes a display package and a plurality of LED dies arranged on a top surface of the display package. The display package includes a molding compound, a backplane die, and at least one spacer structure, with the backplane die and the at least one spacer structure being embedded within the molding compound. In some embodiments, the plurality of LED dies includes a first die containing red LEDs, a second die containing green LEDs, and a third die containing blue LEDs. The backplane die includes driver circuits configured to drive LEDs in the plurality of LED dies, for example, LEDs of the first die, the second die, and the third die. The at least one spacer structure has a higher thermal conductivity than the molding compound and is configured to dissipate heat generated by the LEDs in the plurality of LED dies.

公开(公告)号：US11842989B2

公开(公告)日：2023-12-12

申请号：US17193855

申请日：2021-03-05

Applicant: Meta Platforms Technologies, LLC

Inventor： Rajendra D. Pendse

IPC: H01L25/16 ,  H01L33/00 ,  G06F1/16 ,  H01L21/683 ,  H01L25/075 ,  H01L33/52 ,  H01L33/62 ,  G02B27/01

CPC classification number: H01L25/167 ,  G06F1/163 ,  H01L21/6835 ,  H01L25/0753 ,  H01L33/0062 ,  H01L33/0095 ,  H01L33/52 ,  H01L33/62 ,  G02B27/0172 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2933/005 ,  H01L2933/0066

Abstract: In some examples, an article comprises a semiconductor including at least one integrated circuit and an inorganic semiconductor layer bonded to a first surface of the semiconductor. The inorganic semiconductor layer comprises a μLED array, and the first surface of the semiconductor extends beyond a first edge of the inorganic semiconductor layer. The first edge of the inorganic semiconductor layer is oriented substantially perpendicular to the first surface of the semiconductor.

公开(公告)号：US20230094261A1

公开(公告)日：2023-03-30

申请号：US18062409

申请日：2022-12-06

Applicant: Meta Platforms Technologies, LLC

Inventor： Rajendra D. Pendse

IPC: G02B27/01 ,  G06T19/00 ,  H01L27/11

Abstract: Three-dimensional integrated circuit component(s) are described including a System-on-a-Chip (SoC) die and a separate static random-access memory (SRAM) subcomponent in a vertically stacked arrangement. Such stacked SoC/SRAM integrated circuit components may form part of a system to render artificial reality images.