摘要:
A positive photosensitive resin composition contains 50 to 95 parts by weight of a resin (a) composed of a high molecular compound (A) having a molecular weight of 300 to 30,000 and an iodine value of 50 to 500 and containing carbon-carbon double bonds and a group represented by the formula (I) ##STR1## wherein R.sub.1 denotes a hydrogen atom, a halogen atom or an alkyl group having 1 to 3 carbon atoms and X denotes a hydrogen atom or a bond, on the proviso that if X denotes the bond, a carbon atom linked to R.sub.1 and a carbon atom linked to a hydrogen atom together form a portion of a main chain of the high molecular compound (A), and a group represented by the formula (II) ##STR2## wherein R.sub.1 and X denote the same as above, and R.sub.2 denotes an alkyl, cycloalkyl or aryl group, and 5 to 50 parts by weight of a compound (b) containing quinone diazide groups.
摘要:
A positive type photosensitive resin composition contains (a) a quinone diazido phenolic resin represented by the formula: ##STR1## wherein R.sup.1 is an alkyl group having 1 to 4 carbon atoms, R.sup.2 is a bivalent hydrocarbon residue having 5 to 16 carbon atoms provided that groups bound to R.sup.2 do not bind with the same carbon atom of R.sup.2, D.sup.1, D.sup.2 and D.sup.3 and are the same or different groups and each represent a hydrogen atom or a quinone diazido unit represented by ##STR2## provided that a molar ratio of the hydrogen atom to the quinone diazido unit is 0 to 10, m is a number of 0 to 10, n is a number of 1 or 2, and l.sub.1, l.sub.2 and l.sub.3 are the same or different numbers and each represent a number of 1 to 3; and (b) an alkali-soluble resin.
摘要:
A resin composition for forming a durable protection coating contains (A) an alkali-soluble resin which is a polymer of a conjugated diene and has a monoamidated succinic acid group represented by the following formula (I) of: ##STR1## wherein R.sup.1 and R.sup.2 each stand for a hydrogen atom, a halogen atom or an organic residue having 1 to 3 carbon atoms; and R.sup.3 stands for an organic residue having 1 to 16 carbon atoms; (B) a pre-polymer having a photosensitive ethylenic double bond; and (C) a photopolymerization initiator. The mixing ratio by weight of the alkali-soluble resin (A) to the pre-polymer (B) ranges from 1:4 to 4:1. A process for preparing the durable protection coating contains applying the resin composition on a substrate, and exposing the resin composition to ultraviolet ray through a circuit pattern mask to cure the resin composition followed by development and after-curing to form the protection coating.