公开(公告)号：US20200227805A1

公开(公告)日：2020-07-16

申请号：US16711116

申请日：2019-12-11

Applicant: Microfabrica Inc.

Inventor： Elliott R. Brown ,  John D. Evans ,  Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Morton Grosser

IPC: H01P3/06 ,  C25D1/00 ,  C25D5/02 ,  C25D5/10

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

公开(公告)号：US10416192B2

公开(公告)日：2019-09-17

申请号：US14927350

申请日：2015-10-29

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R1/067 ,  G01R31/00

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

公开(公告)号：US20190227099A1

公开(公告)日：2019-07-25

申请号：US16373500

申请日：2019-04-02

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R1/067

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

公开(公告)号：US09620834B2

公开(公告)日：2017-04-11

申请号：US14194592

申请日：2014-02-28

Applicant: Microfabrica Inc.

Inventor： Elliott R. Brown ,  John D. Evans ,  Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Morton Grosser

IPC: H01P3/00 ,  H01P1/202 ,  G01P15/08 ,  G01P15/125 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  C25D1/00 ,  H05K3/46

CPC classification number: H01P1/202 ,  B33Y10/00 ,  B33Y70/00 ,  B81B2201/042 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H01P11/007 ,  H05K3/4647 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

公开(公告)号：US20160109481A1

公开(公告)日：2016-04-21

申请号：US14927350

申请日：2015-10-29

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R1/067 ,  G01R31/28

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及悬臂式探针结构的各种设计。 一些实施例涉及制造这种探针或悬臂结构的方法。 在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗 能力和/或类似物。