摘要:
The current paths of column selection transistors are inserted between a pair of input nodes, on the one hand, of a sense amplifier constituted by a current-mirror type differential amplifier, and column lines, on the other hand. The current paths of transistors for clamping column potential are inserted between the input nodes of the sense amplifier, on the one hand, and a power source, on the other. The gates of the transistors for clamping column potential are supplied with a bias potential lower than the potential of the power source. When data is read out from selected memory cells, the potential of the input nodes of the sense amplifier is clamped to a value lower than the potential Vcc of the power source by the transistors for clamping column potential. The storage data in the selected memory cells is input directly to the input nodes of the sense amplifier through the current paths of the column selection transistors.
摘要:
This invention provides a non-volatile semiconductor memory having a first node and a second node, the second node having a ground potential. The invention includes a plurality of non-volatile memory cells each having a drain and a threshold potential, the cells, for storing data written into the cells at a predetermined normal writing voltage. A plurality of bit lines, each memory cell being connected to one of the bit lines, transfer data to and from the memory cells. A circuit connected to the bit lines simultaneously tests the memory cells of all the bit lines at the normal writing voltage to detect changes in the threshold potential.
摘要:
A nonvolatile semiconductor memory device includes a power voltage select circuit that is comprised of first and second power source nodes, an output node, first and second depletion type MOS transistors connected in series between the first power source node and the output node, a third MOS transistor connected between an interconnection point between the first and second depletion type MOS transistors and the second power source node, and a fourth MOS transistor connected between the second power source node and the output node.
摘要:
Each memory cell in an EPROM includes two memory cell transistors which share a common floating gate and have two separated drains, one of which is connected to a read bit line and the other of which is connected to write bit line. In this EPROM, the read memory cell transistor of the read bit line has a lower hot electron injection rate than the hot electron injection rate of the write memory cell transistor of the write bit line. A bit line voltage booster is connected to the read bit line.
摘要:
A voltage converter circuit has an input terminal for receiving an input binary signal and a gate for generating an output binary signal corresponding to the input binary signal. An output signal from the gate is supplied to a first input terminal of an inverter through a transistor and further to a second input terminal of the inverter directly, so as to immediately stabilize the output signal from the voltage converter circuit. The inverter inverts the input signal to a higher-voltage binary signal. When a voltage level of the higher-voltage binary signal reaches a given voltage level while the voltage level of the higher-voltage binary signal changes, a feedback circuit is operated to set the input signal supplied to the first input terminal of the inverter at a higher voltage.
摘要:
In a flash memory EEPROM, a memory cell MC is formed in a P-type semiconductor substrate. A peripheral transistor TR is formed in an N-type well. Another peripheral transistor TR is formed in a P-type well. The P-type well is by turn formed an N-type well and electrically insulated from the substrate. The substrate is typically provided with a metal back structure and its substrate voltage is set to predetermined voltages respectively for data erasure, data storage and data retrieval. With such an arrangement, the level of voltage stress with which the device is loaded during data erasure can be remarkably reduced to allow a down-sizing and an enhanced quality to be realized for the device.
摘要:
In a flash memory EEPROM, a memory cell MC is formed in a P-type semiconductor substrate. A peripheral transistor TR is formed in an N-type well. Another peripheral transistor TR is formed in a P-type well. The P-type well is by turn formed an N-type well and electrically insulated from the substrate. The substrate is typically provided with a metal back structure and its substrate voltage is set to predetermined voltages respectively for data erasure, data storage and data retrieval. With such an arrangement, the level of voltage stress with which the device is loaded during data erasure can be remarkably reduced to allow a down-sizing and an enhanced quality to be realized for the device.
摘要:
A ferroelectric memory device includes a plate line driving circuit, dummy plate line driving circuit, constant voltage generator and variable voltage generating circuit. The plate line driving circuit pulse-drives a plate line associated with a memory cell selected at the time of data readout. The dummy plate line driving circuit pulse-drives a dummy plate line associated with a dummy cell connected to a reference bit line which makes a complementary pair with a bit line connected to the selected memory cell. The constant voltage generator generates a voltage which does not depend on an external power supply voltage and the temperature and is kept substantially constant and applies the voltage to the plate line driving circuit as a power supply voltage. The variable voltage generating circuit generates a plurality of substantially constant voltages which do not depend on an external power supply voltage and the temperature and applies a voltage selected from the plurality of voltage levels according to the high level or low level of the bit line to the dummy plate line driving circuit as a power supply voltage.
摘要:
A nonvolatile semiconductor memory device is provided in which a negative voltage is applied to a gate electrode of a memory cell transistor during an erase mode. The memory device includes a row decoder circuit having an N-channel transistor connected to a word line. The N-channel transistor is provided on a P-type well region of a semiconductor substrate. A negative voltage is applied to the P-type well region during the erase mode, while ground potential is applied thereto during other modes.
摘要:
A nonvolatile semiconductor memory device is provided in which a negative voltage is applied to a gate electrode of a memory cell transistor during an erase mode. The memory device includes a row decoder circuit having an N-channel transistor connected to a word line. The N-channel transistor is provided on a P-type well region of a semiconductor substrate. A negative voltage is applied to the P-type well region during the erase mode, while ground potential is applied thereto during other modes.