摘要:
A chain type ferroelectric random access memory has a memory cell unit including ferroelectric memory cells electrically connected in series to each other, a plate line connected to an electrode of the memory cell unit, a bit line connected to the other electrode of the memory cell unit via a switching transistor, a sense amplifier which amplifies the voltages of this bit line and its complementary bit line, and a transistor inserted between the switching transistor and the sense amplifier. A value, being the minimum value of the gate voltage in the transistor obtained during elevation of the plate line voltage and comparative amplification, is smaller than a value, being the maximum value of the gate voltage in the transistor obtained during fall of the plate line voltage and comparative amplification. With these features, decrease in the accumulated charge of polarization in the memory cell is reduced and occurrence of disturb is prevented during read/write operations.
摘要:
A chain type ferroelectric random access memory has a memory cell unit comprising ferroelectric memory cells electrically connected in series to each other, a plate line connected to an electrode of the memory cell unit, a bit line connected to the other electrode of the memory cell unit via a switching transistor, a sense amplifier which amplifies the voltages of this bit line and its complementary bit line, and a transistor inserted between the switching transistor and the sense amplifier, and that a value, being the minimum value of the gate voltage in the transistor obtained during elevation of the plate line voltage and comparative amplification, is smaller than a value, being the maximum value of the gate voltage in the transistor obtained during fall of the plate line voltage and comparative amplification. With these features, decrease in the accumulated charge of polarization in the memory cell is reduced and occurrence of disturb is prevented during read/write operations.
摘要:
A ferroelectric memory has a memory cell screening test circuit connected to bit lines through switching transistors. In screening, at least one word line is selected, and data is simultaneously written in all memory cells connected to this word line. Since data is not restored after the rewrite, all FRAM cells can be screened under the same condition. By this circuit, a memory cell having a write failure according to the imprint characteristics inherent to the ferroelectric memory is screened.
摘要:
A variable potential generating circuit includes a resistive potential divider circuit and first and second operational amplifiers. The resistive potential divider circuit includes a switching element and a current-scaling type digital/analog converter circuit connected in series between a power supply node and a ground node. The resistive potential divider circuit has a first node at which a divided potential obtained by resistive division of a variable potential to be output from a variable potential output node appears and a second node to which a virtual potential is applied. The first operational amplifier compares the divided potential of the first node with a reference potential to effect the feedback control for setting the variable output potential equal to the reference potential. The second operational amplifier compares the virtual potential of the second node with the reference potential to effect the feedback control for setting the virtual potential equal to the reference potential.
摘要:
In a nonvolatile semiconductor memory having a two-stage sense read circuit using a level shift circuit and a single-end sense amplifier, relationships of sizes of a main memory cell bit line charge transistor, a main memory cell bit line transfer gate transistor, a main memory cell bit line load transistor, a dummy cell bit line charge transistor, a dummy cell bit line transfer gate transistor, and a dummy cell bit line load transistor are set to simultaneously satisfy conditions for equalizing a bit line and a dummy cell bit line and conditions for equalizing a sense line and a dummy cell sense line. Therefore, the potentials of the bit line and the dummy cell bit line and the potentials of the sense line and the dummy cell sense line can be simultaneously equalized, and a high-speed read operation can be achieved.
摘要:
In a flash memory EEPROM, a memory cell MC is formed in a P-type semiconductor substrate. A peripheral transistor TR is formed in an N-type well. Another peripheral transistor TR is formed in a P-type well. The P-type well is by turn formed an N-type well and electrically insulated from the substrate. The substrate is typically provided with a metal back structure and its substrate voltage is set to predetermined voltages respectively for data erasure, data storage and data retrieval. With such an arrangement, the level of voltage stress with which the device is loaded during data erasure can be remarkably reduced to allow a down-sizing and an enhanced quality to be realized for the device.
摘要:
Disclosed is a semiconductor integrated circuit device, which comprises a booster circuit for boosting a source voltage, a voltage limiter having one end connected to the output terminal of the booster circuit, for limiting the output voltage of the booster circuit to a given value, and a voltage setting circuit, connected to the other end of the voltage limiter, for arbitrarily adjusting a voltage at the other end of the voltage limiter. This design can keep the output voltage of the booster circuit at a constant level and can set that output voltage to an arbitrary voltage.
摘要:
A bias voltage generating circuit supplies a bias voltage to a memory's bit lines. One end of a first transistor is connected to a first power supply. The first transistor conducts in response to a control signal. A second transistor is connected to another end of the first transistor. Another end of the second transistor and a gate of the second transistor are connected to an output node. One end of a third transistor and a gate connected to the output node. One end of a fourth transistor and a gate are connected to a second end of the third transistor. A second end of the fourth transistor is connected to a second power supply. One end of a fifth transistor is connected to the first power supply. The fifth transistor also conducts in response to the control signal. A sixth transistor is connected to a second end of the fifth transistor. A second end of the sixth transistor is connected to the output node and the gate of the sixth transistor is connected to a potential source. A seventh transistor is connected to the output node. A second end of the seventh transistor is connected to a ground potential. The seventh transistor also conducts in response to the control signal. The output node outputs a bias voltage to the bit lines when the control signal is activated, and is grounded through the seventh transistor when the control signal is non-activated.
摘要:
An address detector of a redundancy memory cell is provided including a programming element for storing address data for replacing a defective cell with the redundancy cell. In a test mode, the redundancy cell may be written to regardless of whether or not a memory cell is defective. Thus, the redundancy cell may be tested without programming a programming element that replaces a defective cell with a redundancy cell. The detector further includes a latch for latching the state of the programming element, and a data setting element for setting the latch in a test mode.
摘要:
A memory cell array includes data storing memory cells which are arranged in a matrix form of m rows.times.n columns. The data storing memory cells are selected by means of m word lines and n bit lines. Dummy capacitance cells are arranged on the (n+1)th column of the memory cell array, and are connected to the word lines. The dummy capacitance cells are each formed of a transistor which has the same construction as a field transistor having a gate electrode formed of a polysilicon layer or the data storing memory cell and whose source is set in the electrically floating condition. Array edge memory cells are arranged on the (m+1)th row of the memory cell array, and are connected to n bit lines. The array edge memory cells have no influence on the circuit operation. A dummy memory cell is arranged in an intersecting position of the (m+1)th row and the (n+1)th column. A dummy bit line is connected to the dummy capacitance cells and dummy memory cell, and a dummy word line is connected to the array edge memory cell and dummy memory cell.