公开(公告)号：US11437182B2

公开(公告)日：2022-09-06

申请号：US16175564

申请日：2018-10-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koichi Yamaguchi ,  Koshi Himeda

IPC: H01F27/29 ,  H01F27/32 ,  H01F27/06 ,  H01F41/12 ,  H01F27/02 ,  H01F17/00 ,  H01F41/04

Abstract: An electronic component comprising a coil component having an element body containing ceramic, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil; and a mold resin sealing the coil component. The electronic component further comprises an electrode film in contact with an outer surface of the mold resin; and a connection conductor disposed in the mold resin and electrically connecting the external electrode and the electrode film.

公开(公告)号：US11145607B2

公开(公告)日：2021-10-12

申请号：US16838977

申请日：2020-04-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke Tanaka ,  Fumio Harima ,  Masayuki Aoike ,  Koshi Himeda

IPC: H01L23/58 ,  H01L23/66 ,  H01L23/00

Abstract: A semiconductor chip includes a compound semiconductor substrate having a pair of main surfaces and a side surface therebetween, a circuit on one main surface of the pair of main surfaces, and first metals on the main surface. The first metals are positioned, in plan view of the main surface, closer to an outer edge of the main surface than the circuit, substantially in a ring shape to surround the circuit with gaps between first metals adjacent to each other. The semiconductor chip further includes second metals on the main surface. The second metals are positioned, in plan view of the main surface, between the circuit and the first metals or closer to the outer edge than the first metals. Also, the second metals each are positioned, in plan view of the side surface, such that at least a part thereof overlaps a gap between the first metals.

公开(公告)号：US20200321323A1

公开(公告)日：2020-10-08

申请号：US16907557

申请日：2020-06-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC: H01L25/16 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.