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公开(公告)号：US10964657B2
公开(公告)日：2021-03-30
申请号：US16512790
申请日：2019-07-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Katsunari Nakazawa , Takanori Uejima , Motoji Tsuda , Yuji Takematsu , Dai Nakagawa , Tetsuro Harada , Masahide Takebe , Naoya Matsumoto , Yoshiaki Sukemori , Mitsunori Samata , Yutaka Sasaki , Yuki Fukuda
Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.
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公开(公告)号：US12095489B2
公开(公告)日：2024-09-17
申请号：US18159193
申请日：2023-01-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda , Hayato Nakamura
CPC classification number: H04B1/0475 , H03F3/245 , H03F2200/165 , H03F2200/451 , H04B2001/0425
Abstract: A high-frequency circuit includes a power amplifier for a communication band A, and a power amplifier for a communication band B. Transmission in the communication band A, transmission in the communication band B, and reception in the communication band C can be simultaneously used. A frequency range of intermodulation distortion generated between a second harmonic wave of a transmission signal of the communication band A and a fundamental wave of a transmission signal of the communication band B, overlaps with at least part of a reception band of the communication band C. The power amplifier includes amplifying elements and an output trans including coils. One end of the coil is connected with an output of the amplifying element, the other end of the coil is connected with an output of the amplifying element, and one end of the coil is connected with an output terminal of the power amplifier.
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公开(公告)号：US11631659B2
公开(公告)日：2023-04-18
申请号：US16780087
申请日：2020-02-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda , Takanori Uejima , Yuji Takematsu , Katsunari Nakazawa , Masahide Takebe , Shou Matsumoto , Naoya Matsumoto , Yutaka Sasaki , Yuuki Fukuda
IPC: H01L25/16 , H01L23/00 , H01L23/31 , H01L23/552 , H01L23/498 , H01L23/66 , H01Q1/24 , H01Q1/02
Abstract: A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.
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公开(公告)号：US11483019B2
公开(公告)日：2022-10-25
申请号：US17351867
申请日：2021-06-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda , Yukiya Yamaguchi , Sho Matsumoto , Hiroyuki Kani , Atsushi Horita , Morio Takeuchi , Yusuke Naniwa , Jin Yokoyama
Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.
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公开(公告)号：US11251817B2
公开(公告)日：2022-02-15
申请号：US17110321
申请日：2020-12-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Morio Takeuchi , Motoji Tsuda
IPC: H04B1/04
Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a radio frequency transmission signal that has been input through a transmission input terminal; a low noise amplifier configured to amplify a radio frequency reception signal; a switch disposed on the second principal surface and connected between the transmission input terminal and the power amplifier; and an inductor of a matching circuit connected to an input terminal of the low noise amplifier. In the radio frequency module, at least one of the low noise amplifier or the inductor is disposed on the first principal surface.
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Patent Agency Ranking
公开(公告)号：US10998924B2
公开(公告)日：2021-05-04
申请号：US16984512
申请日：2020-08-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda , Takayuki Nakamura , Daerok Oh
IPC: H04B1/18 , H04B1/00 , H04B1/12 , H04B7/0413
Abstract: A high-frequency front end module includes a primary antenna and a secondary antenna, a first multiplexer and a second multiplexer, and a switch circuit, in which the first multiplexer has a transmission filter of a band A and a reception filter of the band A, and does not have a transmission filter of a band B, the second multiplexer has a transmission filter of the band B and a reception filter of the band B, and does not have a transmission filter of the band A, and the switch circuit exclusively switches connection between the primary antenna and the first multiplexer and connection between the primary antenna and the second multiplexer, and exclusively switches connection between the secondary antenna and the first multiplexer and connection between the secondary antenna and the second multiplexer.
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公开(公告)号：US10707830B2
公开(公告)日：2020-07-07
申请号：US15376816
申请日：2016-12-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Taku Kikuchi , Seiji Kai , Motoji Tsuda , Mitsuyoshi Hira
Abstract: An elastic wave device includes a piezoelectric substrate, functional electrodes on the piezoelectric substrate, a support layer on the piezoelectric substrate with a frame shape surrounding the functional electrodes, a cover member on the support layer to seal an opening of the support layer, the cover member including a first main surface facing the support layer, and a second main surface opposite to the first main surface. Recesses are located in the cover member and are open to the second main surface. Via holes extend through the support layer and to bottom surfaces of the recesses of the cover member, the via holes each including an opening that is open to the bottom surface. The area of the opening of each of the via holes is not more than the area of the bottom surface of the corresponding recess of the cover member. First via conductor portions are provided in the via holes and second via conductor portions are provided in the recesses of the cover member.
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公开(公告)号：US09654081B2
公开(公告)日：2017-05-16
申请号：US14994642
申请日：2016-01-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda
CPC classification number: H03H9/1092 , H01L41/0533 , H03H3/08 , H03H9/02913 , H03H9/1071 , H03H9/1078 , H03H9/54 , H03H9/64 , H05K9/0007
Abstract: In an electronic component, a functional circuit, signal wiring electrically connected to the functional circuit, and ground wiring electrically connected to the functional circuit and electrically connected to a ground potential are located on one surface of a circuit substrate, a frame member is provided to secure a region between itself and an outer peripheral edge of a first main surface of the circuit substrate and so as to surround the functional circuit, the ground wiring extends from inside to outside the frame member, and a shield member extends from a second main surface of the circuit substrate to a region on the first main surface via the side surfaces, the shield member being electrically connected to the ground wiring in the region outside the frame member.
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公开(公告)号：US12047106B2
公开(公告)日：2024-07-23
申请号：US17646941
申请日：2022-01-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda , Yukiya Yamaguchi
CPC classification number: H04B1/38 , H04B1/04 , H04B1/1607 , H04B1/18 , H04B2001/0408
Abstract: A radio-frequency module (1) includes a module substrate (70) having major surfaces (701 and 702) opposite to each other, external connection terminals (90a and 90b) disposed on the major surface (702), a power amplifier (11) having major surfaces (111 and 112) opposite to each other and being disposed on the major surface (702) such that the major surface (111) is a mounting surface on the module substrate (70), a bonding wire (45) coupled to the major surface (112), and a heat dissipation electrode (91) disposed apart from the power amplifier (11) on the major surface (112) side with respect to the power amplifier (11) and coupled to the bonding wire (45).
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公开(公告)号：US11863215B2
公开(公告)日：2024-01-02
申请号：US18170021
申请日：2023-02-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda , Takayuki Nakamura , Daerok Oh
IPC: H04B7/0413 , H04B1/00 , H04B1/12 , H04B1/18
CPC classification number: H04B1/0064 , H04B1/0078 , H04B1/126 , H04B1/18 , H04B7/0413
Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.
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