公开(公告)号：US20200051943A1

公开(公告)日：2020-02-13

申请号：US16533982

申请日：2019-08-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Katsunari NAKAZAWA ,  Takanori UEJIMA ,  Motoji TSUDA ,  Yuji TAKEMATSU ,  Dai NAKAGAWA ,  Tetsuro HARADA ,  Masahide TAKEBE ,  Naoya MATSUMOTO ,  Yoshiaki SUKEMORI ,  Mitsunori SAMATA ,  Yutaka SASAKI ,  Yuuki FUKUDA

IPC: H01L23/00 ,  H01L23/538 ,  H03F3/21 ,  H01L25/16 ,  H01L23/66 ,  H01L23/367 ,  H03F1/30

Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.

公开(公告)号：US20200051942A1

公开(公告)日：2020-02-13

申请号：US16512790

申请日：2019-07-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Katsunari NAKAZAWA ,  Takanori UEJIMA ,  Motoji TSUDA ,  Yuji TAKEMATSU ,  Dai NAKAGAWA ,  Tetsuro HARADA ,  Masahide TAKEBE ,  Naoya MATSUMOTO ,  Yoshiaki SUKEMORI ,  Mitsunori SAMATA ,  Yutaka SASAKI ,  Yuki FUKUDA

IPC: H01L23/00 ,  H03F3/213 ,  H01L23/538 ,  H01L23/66 ,  H03F3/21 ,  H03F1/30 ,  H04B1/04

Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.

公开(公告)号：US20180167049A1

公开(公告)日：2018-06-14

申请号：US15849930

申请日：2017-12-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tetsuro HARADA

IPC: H03H7/40 ,  H03H7/46

CPC classification number: H03H7/40 ,  H03H7/465 ,  H03H2007/386 ,  H04B1/0057 ,  H04B1/50

Abstract: A demultiplexing circuit (10) includes a band switch (20) and a first communication band phase adjustment circuit (30). The band switch (20) includes a shared terminal (P20) connected to a shared connection end (110), a first selection target terminal (P21) connected to a second signal end (122), and a second selection target terminal (P22) connected to a third signal end (123). In the band switch (20), the first selection target terminal (P21) and the second selection target terminal (P22) are selectively connected to the shared terminal (P20) in response to the communication band to be transmitted. The first communication band phase adjustment circuit (30) is connected between a first signal end (121) and a predetermined position in a transmission path where the shared connection end (110) and the shared terminal (P20) are connected.

公开(公告)号：US20150271916A1

公开(公告)日：2015-09-24

申请号：US14731527

申请日：2015-06-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tetsuro HARADA

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H03H7/0115 ,  H03H7/38 ,  H03H2001/0085 ,  H05K1/115 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/0195 ,  H05K2201/10053 ,  H05K2201/10098

Abstract: A radio-frequency circuit module includes a multilayer body and a surface-mount component mounted on a front surface of the multilayer body. The surface-mount component includes variable capacitance elements integrated therein. Inductors including conductor patterns are provided in the multilayer body. On a back surface of the multilayer body, a first external connection terminal and a second external connection terminal are sandwiched between ground connection terminals. Ground via-conductors connected to ground connection terminals extend to the front surface of the multilayer body. The ground via-conductors are connected to each other in a layer near the front surface by a ground connection conductor which extends in a direction perpendicular or substantially perpendicular to the extending direction.

Abstract translation: 射频电路模块包括多层体和安装在多层体前表面上的表面安装部件。 表面贴装元件包括集成在其中的可变电容元件。 包括导体图案的电感器设置在多层体中。 在多层体的背面，第一外部连接端子和第二外部连接端子夹在接地连接端子之间。 连接到接地连接端子的接地导体导体延伸到多层体的前表面。 接地通路导体通过接地连接导体在靠近前表面的层中彼此连接，接地连接导体在垂直于或基本垂直于延伸方向的方向上延伸。