公开(公告)号：US20160255725A1

公开(公告)日：2016-09-01

申请号：US15151649

申请日：2016-05-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Koji SATO ,  Seiichi MATSUMOTO

IPC: H05K1/18 ,  H01G4/12 ,  H01L41/187 ,  H01C7/00 ,  H01F27/28 ,  H01L41/083 ,  H01G4/30 ,  H01G4/008

CPC classification number: H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

公开(公告)号：US20160133398A1

公开(公告)日：2016-05-12

申请号：US15001468

申请日：2016-01-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Tetsuya KISUMI ,  Toshiki NAGAMOTO ,  Masato KIMURA ,  Seiji KOGA

IPC: H01G13/00

CPC classification number: H01G13/006 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/306

Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.

公开(公告)号：US20130279073A1

公开(公告)日：2013-10-24

申请号：US13923396

申请日：2013-06-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Koji SATO ,  Seiichi MATSUMOTO

IPC: H01G4/30

CPC classification number: H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract translation: 陶瓷电子部件包括陶瓷元件组件和外部电极。 外部电极设置在陶瓷元件组件上。 外部电极包括下面的电极层和第一个Cu镀膜。 底层电极层设置在陶瓷元件组件上。 第一Cu镀膜设置在下面的电极层上。 底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。 在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。