Abstract:
A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
Abstract:
A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
Abstract:
A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0≦t1 ≦(⅖)t0 is satisfied, where to is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.
Abstract:
A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal.
Abstract:
A VOC removal apparatus that includes: a VOC adsorption rotor including a cellular structure, the cellular structure being made of metal and supporting an adsorbent to adsorb a VOC, wherein the VOC adsorption rotor has: an adsorption zone through which a process gas is passed for adsorption of a VOC contained in the process gas, a desorption zone in which the VOC adsorbed in the adsorption zone is desorbed, and a cooling zone in which the cellular structure is cooled; a pair of electrodes each respectively disposed at opposed outer side portions of the VOC adsorption rotor in a direction in which a rotational axis of the VOC adsorption rotor extends, the pair of electrodes being positioned in contact with the VOC adsorption rotor in the desorption zone; and a voltage application device constructed to apply a voltage to the pair of electrodes.
Abstract:
A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
Abstract:
A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.
Abstract:
A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer.
Abstract:
A VOC removal method that includes: adsorbing a VOC contained in a process gas by passing the process gas through an adsorption zone of a VOC adsorption rotor that includes a cellular structure supporting an adsorbent to adsorb a VOC, wherein the cellular structure is made of metal; desorbing the VOC adsorbed in the adsorption zone by heating the cellular structure by passing current through the cellular structure in a desorption zone of the VOC adsorption rotor and passing a gaseous substance through the desorption zone of the VOC adsorption rotor; and cooling the cellular structure heated in the desorption zone in a cooling zone of the VOC adsorption rotor.
Abstract:
A VOC adsorption rotor capable of desorbing an adsorbed VOC with high energy efficiency. The VOC adsorption rotor includes a cellular structure constructed to support an adsorbent to adsorb a VOC. The cellular structure is made of metal.