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    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US20140127493A1

    公开(公告)日：2014-05-08

    申请号：US14154204

    申请日：2014-01-14

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Koji SATO ,  Seiichi MATSUMOTO

    IPC: H05K1/18 ,  H01F27/28 ,  H01C7/00 ,  H01G4/232 ,  H01L41/083

    CPC classification number: H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

    Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

    Abstract translation: 陶瓷电子部件包括陶瓷元件组件和外部电极。 外部电极设置在陶瓷元件组件上。 外部电极包括下面的电极层和第一个Cu镀膜。 底层电极层设置在陶瓷元件组件上。 第一Cu镀膜设置在下面的电极层上。 底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。 在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。

    CERAMIC ELECTRONIC COMPONENT
    4.
    发明申请
    CERAMIC ELECTRONIC COMPONENT 有权
    陶瓷电子元件

    公开(公告)号：US20140312743A1

    公开(公告)日：2014-10-23

    申请号：US14320770

    申请日：2014-07-01

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Koji SATO ,  Yukio SANADA ,  Yasuhiro NISHISAKA ,  Masaki HIROTA

    IPC: H01C7/00 ,  H01G4/12 ,  H01G4/012 ,  H01C7/13 ,  H01L41/083 ,  H01F17/00

    CPC classification number: H01C7/008 ,  H01C7/13 ,  H01F17/0013 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083

    Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0≦t1 ≦(⅖)t0 is satisfied, where to is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.

    Abstract translation: 陶瓷电子部件包括陶瓷基体，第一和第二内部电极以及第一和第二外部电极。 第一外部电极设置在纵向方向上的第一主表面的第一端部处。 第二外部电极设置在第一主表面的纵向方向的第二端部处。 第一外部电极和第二外部电极的一部分在厚度方向上与第一和第二内部电极在厚度方向上彼此相对的区域相对。 满足条件（1/10）t0＆nlE; t1＆nlE;（⅖）t0，其中，第一外部电极和第二外部电极中的每一个的厚度为哪里，并且t1是其中第一和第二外部电极 电极嵌入第一主表面。

    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    6.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US20130279073A1

    公开(公告)日：2013-10-24

    申请号：US13923396

    申请日：2013-06-21

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Koji SATO ,  Seiichi MATSUMOTO

    IPC: H01G4/30

    CPC classification number: H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

    Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

    Abstract translation: 陶瓷电子部件包括陶瓷元件组件和外部电极。 外部电极设置在陶瓷元件组件上。 外部电极包括下面的电极层和第一个Cu镀膜。 底层电极层设置在陶瓷元件组件上。 第一Cu镀膜设置在下面的电极层上。 底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。 在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。

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