中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

30 records (took 0.019 seconds)

    Radio IC device
    12.
    发明授权
    Radio IC device 有权
    无线IC设备

    公开(公告)号：US09378452B2

    公开(公告)日：2016-06-28

    申请号：US14078596

    申请日：2013-11-13

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yuya Dokai ,  Tsutomu Ieki

    IPC: G06K19/06 ,  G06K19/077 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q9/26

    CPC classification number: G06K19/07771 ,  G06K19/07745 ,  H01L2924/0002 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q9/26 ,  H01L2924/00

    Abstract: A radio IC device includes a flexible dielectric base, a radiation element that is a metal film or a metal foil wrapped around the dielectric base, and a radio IC element mounted on the radiation element. The radiation element includes, in a portion other than a portion where the radio IC element is disposed, a bonded portion that is bonded to the dielectric element and a non-bonded portion that is not bonded to the dielectric element. The radio IC element is arranged to be directly opposed to the dielectric element with the portion of the radiation element where the radio IC element is disposed not bonded to the dielectric base.

    Abstract translation: 无线IC器件包括柔性电介质基底，作为金属膜的辐射元件或缠绕在电介质基底上的金属箔，以及安装在辐射元件上的无线IC元件。 辐射元件在除了设置无线IC元件的部分以外的部分包括接合到电介质元件的接合部分和未结合到电介质元件的非接合部分。 无线电IC元件被布置成与辐射元件的部分直接相对，其中无线IC元件被设置为未接合到电介质基底。

    Radio IC device and radio communication terminal
    13.
    发明授权
    Radio IC device and radio communication terminal 有权
    无线IC设备和无线通信终端

    公开(公告)号：US09336475B2

    公开(公告)日：2016-05-10

    申请号：US14337547

    申请日：2014-07-22

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Makoto Takeoka ,  Yuya Dokai ,  Hiromi Murayama

    IPC: G06K19/00 ,  G06K19/07 ,  H01Q1/22 ,  H01Q23/00 ,  G06K19/077

    CPC classification number: G06K19/0726 ,  G06K19/07777 ,  H01Q1/2225 ,  H01Q23/00

    Abstract: A radio IC device includes a radio IC element that includes an antenna terminal connected to an antenna element, and a ground terminal connected to a ground conductor provided integrally with the antenna element, and a circuit element that includes an impedance matching circuit connected to the antenna terminal of the radio IC element. The circuit element includes a first inductance element that defines the impedance matching circuit, and a second inductance element that is connected, as a high-frequency cutoff circuit for the radio IC element, to the ground terminal.

    Abstract translation: 无线IC器件包括：无线IC器件，包括连接到天线元件的天线端子和与天线元件一体设置的接地导体连接的接地端子，以及包括与天线连接的阻抗匹配电路的电路元件 终端。 电路元件包括限定阻抗匹配电路的第一电感元件和作为无线电IC元件的高频截止电路连接到接地端子的第二电感元件。

    Transmission line and electronic device
    14.
    发明授权
    Transmission line and electronic device 有权

    公开(公告)号：US11581622B2

    公开(公告)日：2023-02-14

    申请号：US16843952

    申请日：2020-04-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takahiro Baba ,  Yuya Dokai

    IPC: H01P3/08 ,  H05K1/02 ,  H05K1/18

    Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.

    Wireless communication device
    18.
    发明授权
    Wireless communication device 有权
    无线通信设备

    公开(公告)号：US08937576B2

    公开(公告)日：2015-01-20

    申请号：US13782346

    申请日：2013-03-01

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yuya Dokai ,  Tsuyoshi Mukai

    IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q9/28 ,  G06K19/077 ,  H01Q1/20

    CPC classification number: H01Q1/38 ,  G06K19/07786 ,  H01Q1/20 ,  H01Q1/2225 ,  H01Q9/285

    Abstract: A wireless communication device includes a flexible base material film, a flexible antenna conductor that is provided in substantially the entire region of one main surface of the flexible base material film and that includes a first radiation element and a second radiation element facing each other through a slit, an inductor substrate that is connected to the first radiation element and the second radiation element so as to extend across the slit, the inductor substrate including an inductance element, and a wireless IC element that is connected in parallel to the inductance element and that is mounted in the inductor substrate. The wireless IC element is connected to the first radiation element and the second radiation element so as to extend across the slit.

    Abstract translation: 无线通信装置包括柔性基材薄膜，柔性天线导体，其设置在柔性基材薄膜的一个主表面的基本上整个区域中，并且包括第一辐射元件和第二辐射元件 狭缝，连接到第一辐射元件和第二辐射元件以跨越狭缝延伸的电感器基板，电感器基板包括电感元件，以及与电感元件并联连接的无线IC元件，并且 安装在电感器基板中。 无线IC元件连接到第一辐射元件和第二辐射元件，以便跨越狭缝延伸。

    Wireless integrated circuit device and method of manufacturing the same
    19.
    发明授权
    Wireless integrated circuit device and method of manufacturing the same 有权
    无线集成电路装置及其制造方法

    公开(公告)号：US08905296B2

    公开(公告)日：2014-12-09

    申请号：US13961995

    申请日：2013-08-08

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Tsuyoshi Mukai ,  Yuya Dokai

    IPC: G06F17/00 ,  G06K19/07 ,  H01Q9/16 ,  G06K19/077 ,  H01L21/52

    CPC classification number: G06K19/073 ,  G06K19/0723 ,  G06K19/0775 ,  G06K19/07754 ,  G06K19/07786 ,  H01L21/52 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/44 ,  H01Q9/16 ,  H01Q9/285

    Abstract: A wireless IC device includes a base material sheet having a long-side direction and a short-side direction, an antenna element provided on a surface of the base material sheet and that includes two radiation portions extending in the long side direction with a predetermined gap therebetween and two connection portions located in a gap through which the two radiation portions oppose each other, a wireless IC element connected to the two connection portions via a conductive bonding material, and a resist layer that covers the two radiation portions and does not cover the two connection portions and at least areas adjacent to the connection portions in the short-side direction.

    Abstract translation: 一种无线IC器件包括具有长边方向和短边方向的基材片，天线元件设置在基材片的表面上，并且包括沿长边方向延伸的两个辐射部分，其具有预定的间隙 以及位于两个辐射部分彼此相对的间隙中的两个连接部分，经由导电接合材料连接到两个连接部分的无线IC元件和覆盖两个辐射部分并且不覆盖该两个辐射部分的抗蚀剂层 两个连接部分和至少在短边方向上与连接部分相邻的区域。

    Wireless IC device
    20.
    发明授权
    Wireless IC device 有权
    无线IC设备

    公开(公告)号：US08720789B2

    公开(公告)日：2014-05-13

    申请号：US14011823

    申请日：2013-08-28

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yuya Dokai

    IPC: G06K19/06 ,  G06K7/08 ,  G06K19/077 ,  G06Q20/34

    CPC classification number: G06K19/07749 ,  G06K19/0701 ,  G06K19/07767 ,  G06K19/07777 ,  G06K19/07783 ,  G06K19/07786 ,  G06Q20/341 ,  H01Q1/2225 ,  H01Q1/36

    Abstract: A wireless IC device includes a wireless IC element, a power supply circuit substrate including a laminate of a plurality of base layers and a power supply circuit connected to the wireless IC element, and a radiating element connected to the power supply circuit. The power supply circuit includes a first coil element connected in series with the wireless IC element, and a second coil element connected in parallel with the wireless IC element. The first coil element and the second coil element are wound and arranged such that winding axes of the first and second coil elements coincide or substantially coincide with each other and directions of magnetic fields generated in the respective first and second coil elements are opposite to each other.

    Abstract translation: 无线IC器件包括无线IC元件，包括多个基底层的叠层的电源电路基板和连接到无线IC元件的电源电路以及连接到电源电路的辐射元件。 电源电路包括与无线IC元件串联连接的第一线圈元件和与无线IC元件并联连接的第二线圈元件。 第一线圈元件和第二线圈元件被卷绕并布置成使得第一和第二线圈元件的绕轴彼此重合或基本一致，并且在相应的第一和第二线圈元件中产生的磁场的方向彼此相反 。

Patent Agency Ranking