-
公开(公告)号:US10476133B2
公开(公告)日:2019-11-12
申请号:US15256822
申请日:2016-09-06
发明人: Bunta Okamoto , Isamu Morita , Satoshi Ishino , Jun Sasaki , Yoshihito Otsubo , Keisuke Araki , Norio Sakai
摘要: An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.
-
公开(公告)号:US09865924B2
公开(公告)日:2018-01-09
申请号:US15176456
申请日:2016-06-08
发明人: Teppei Miura , Jun Sasaki , Hiroyuki Kubo , Katsumi Taniguchi , Noboru Kato , Masahiro Ozawa , Satoshi Ishino
IPC分类号: H01Q1/24 , H01Q7/08 , G06K7/10 , H01Q1/22 , H01Q1/38 , H01Q7/00 , H01Q21/29 , H01Q25/00 , H01Q7/06
CPC分类号: H01Q7/08 , G06K7/10316 , G06K7/10336 , H01Q1/2208 , H01Q1/2216 , H01Q1/242 , H01Q1/243 , H01Q1/38 , H01Q7/00 , H01Q7/06 , H01Q21/293 , H01Q25/00
摘要: An antenna device that includes a coil antenna with a coil conductor wound around a winding axis. The device further includes a planar conductor with a surface and an edge end portion, where the surface extends in the direction of the winding axis and the edge end portion is adjacent to a coil opening of the coil conductor. A booster antenna is also provided and includes a looped or spiral coil conductor and is coupled to the planar conductor and/or the coil antenna.
-
公开(公告)号:US09166291B2
公开(公告)日:2015-10-20
申请号:US13761195
申请日:2013-02-07
发明人: Noboru Kato , Jun Sasaki , Satoshi Ishino
摘要: An antenna device includes an antenna coil including a first conductive pattern disposed on a first major surface of a magnetic sheet, a second conductive pattern disposed on a first major surface of a non-magnetic sheet, and an interlayer conductor connecting the first conductive pattern and second conductive pattern. The antenna coil including the first conductive pattern and second conductive pattern defines a spiral or substantially spiral pattern. The antenna device is a resin multilayer structure in which its base body is a laminate of the magnetic layer and non-magnetic layer and the predetermined patterns are disposed inside and outside the laminate.
摘要翻译: 一种天线装置包括:天线线圈,包括设置在磁性片的第一主表面上的第一导电图案,设置在非磁性片的第一主表面上的第二导电图案,以及将第一导电图案和 第二导电图案。 包括第一导电图案和第二导电图案的天线线圈限定螺旋或基本上螺旋状的图案。 天线装置是其基体是磁性层和非磁性层的层压体的树脂多层结构,并且预定图案设置在层压体的内部和外部。
-
公开(公告)号:US09136228B2
公开(公告)日:2015-09-15
申请号:US13689983
申请日:2012-11-30
发明人: Noboru Kato , Jun Sasaki , Kosuke Yamada , Satoshi Ishino
CPC分类号: H01L23/60 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L27/0248 , H01L27/0296 , H01L28/10 , H01L28/20 , H01L2224/0401 , H01L2224/05016 , H01L2224/05655 , H01L2224/06051 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/12032 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00
摘要: An ESD protection device includes a semiconductor substrate including input/output electrodes and a rewiring layer provided on a surface of the semiconductor substrate. An ESD protection circuit is provided on or in an outer layer of the semiconductor substrate, and the input/output electrodes are connected to the ESD protection circuit. The rewiring layer includes interlayer wiring lines, in-plane wiring lines, and post electrodes. First ends of the interlayer wiring lines disposed in the thickness direction are connected to the input/output electrodes disposed on the surface of the semiconductor substrate, and second ends of the interlayer wiring lines are connected to first ends of the in-plane wiring lines routed in plan view. Prismatic post electrodes are provided between second ends of the in-plane wiring lines and terminal electrodes.
摘要翻译: ESD保护器件包括包括输入/输出电极和设置在半导体衬底的表面上的重新布线层的半导体衬底。 ESD保护电路设置在半导体衬底的外层上或其外层,并且输入/输出电极连接到ESD保护电路。 再布线层包括层间布线,面内布线和柱电极。 设置在厚度方向上的层间布线的第一端连接到设置在半导体衬底的表面上的输入/输出电极,层间布线的第二端连接到布线的面内布线的第一端 在平面图。 棱柱形电极设置在面内布线和端子电极的第二端之间。
-
公开(公告)号:US11739446B2
公开(公告)日:2023-08-29
申请号:US17324293
申请日:2021-05-19
发明人: Masamichi Ando , Satoshi Ishino
IPC分类号: D02G3/44 , D02G3/02 , D03D15/50 , D03D15/283 , A01N37/36
摘要: A piezoelectric thread that includes a core thread; and a piezoelectric film wound around the core thread. The piezoelectric thread is constructed to generate a charge by energy imparted from outside of the piezoelectric thread.
-
公开(公告)号:US11421350B2
公开(公告)日:2022-08-23
申请号:US16617545
申请日:2018-05-23
发明人: Shunsuke Kanematsu , Ryo Todo , Yuhei Ono , Tomoyoshi Yamamoto , Masamichi Ando , Satoshi Ishino
摘要: An antibacterial electric charge generation yarn meets requirements (a) to (e) mentioned below simultaneously and suppresses proliferation of bacteria by electric charge generated upon deformation of the yarn: (a) a main component of the yarn is polylactic acid; (b) the yarn is twisted; (c) the yarn has a double torque of 50 T/50 cm or less; (d) the yarn has a single fiber fineness of 0.05 to 5 dtex; and (e) the number of filaments in the yarn is 10 to 400.
-
公开(公告)号:US10601254B2
公开(公告)日:2020-03-24
申请号:US16179014
申请日:2018-11-02
发明人: Noboru Kato , Ikuhei Kimura , Kimikazu Iwasaki , Satoshi Ishino
IPC分类号: H02J50/12 , G06K19/077
摘要: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.
-
公开(公告)号:US10413992B2
公开(公告)日:2019-09-17
申请号:US15183105
申请日:2016-06-15
摘要: A first structural material is bonded to a second structural material with a joining material provided with a mixed layer of a raw-material component for forming an intermetallic compound layer and a resin component that softens and flows during heat treatment interposed therebetween to form bonded structural materials. When the bonded structural materials are heat-treated, the first structural material is joined to the second structural material with an intermetallic compound layer, and the resin component exudes and covers the lateral circumferential (exposed) portion of the intermetallic compound layer with a resin film.
-
公开(公告)号:US20180369951A1
公开(公告)日:2018-12-27
申请号:US16120522
申请日:2018-09-04
IPC分类号: B23K20/02 , C22C1/04 , B22F1/00 , B22F7/06 , B23P6/00 , B23K35/30 , B23K35/02 , B23K35/00 , B23K20/233 , B23K20/227 , B23K20/16 , B23K3/06 , B23K1/00 , B23K103/04 , B23K101/06 , B23K101/10 , B23K101/18
摘要: A repair method that includes covering a damaged part of a member to be repaired with a repair material, and heating the repair material to a predetermined temperature to form an alloy layer. At least the surface of the member to be repaired is a first metal such as Cu. The repair material includes a second metal such as Sn. By the heating, the surface of the member to be repaired is integrally joined with a layer of an intermetallic compound and an alloy having a melting point higher than a melting point of either of the first metal or the second metal.
-
公开(公告)号:US09583809B2
公开(公告)日:2017-02-28
申请号:US14509285
申请日:2014-10-08
发明人: Noboru Kato , Satoshi Ishino , Jun Sasaki
CPC分类号: H01P3/003 , H01P3/026 , H01P3/08 , H01P3/082 , H01P3/085 , H01P5/028 , H05K1/0225 , H05K1/0251 , H05K2201/09245 , H05K2201/09336 , H05K2201/09636 , H05K2201/097
摘要: A high-frequency signal line includes a body with a first layer level and a second layer level; a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion; a first ground conductor including a first ground portion provided at the first layer level; a second ground conductor including a second ground portion provided at the second layer level; and a second interlayer connection connecting the first ground portion and the second ground portion. A distance between the first interlayer connection and the second interlayer connection is not less than a maximum distance between the first line portion and the first ground portion and is not less than a maximum distance between the second line portion and the second ground portion.
摘要翻译: 高频信号线包括具有第一层级和第二层级的主体; 信号线,包括设置在第一层级的第一线部分,设置在第二层级的第二线部分和连接第一线部分和第二线部分的第一层间连接; 第一接地导体,包括设置在第一层级的第一接地部分; 第二接地导体,包括设置在第二层级的第二接地部分; 以及连接所述第一接地部和所述第二接地部的第二层间连接。 第一层间连接和第二层间连接之间的距离不小于第一线部分和第一接地部分之间的最大距离,并且不小于第二线路部分和第二接地部分之间的最大距离。
-
-
-
-
-
-
-
-
-