公开(公告)号：US06986682B1

公开(公告)日：2006-01-17

申请号：US11128149

申请日：2005-05-11

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R13/648

CPC classification number: H01R13/658 ,  H01R12/592 ,  H01R12/721 ,  H01R12/79

Abstract: A high speed connector assembly includes a first surface-mount connector (SMC) and a second SMC. The first SMC includes a first flexible printed circuit (FPC) that has conductors that extend from a first FPC edge to a second FPC edge. The first edge includes surface-mount contact structures for surface mounting to a first printed circuit board. The second SMC includes a second FPC that has conductors that extend from a first FPC edge to a second FPC edge. The first edge includes surface-mount contact structures for surface mounting to a second printed circuit board. A set of contact beams is disposed along the second FPC edge. The first and second SMCs are mateable such that the contact beams make electrical contact between conductors in the first FPC and conductors in the second FPC. The FPC of the second SMC flexes to adjust for misalignments between the first and second SMCs.

公开(公告)号：US08911242B2

公开(公告)日：2014-12-16

申请号：US13411813

申请日：2012-03-05

Applicant: Myoungsoo Jeon ,  Attalee Snarr Taylor ,  Craig Warren Hornung

Inventor： Myoungsoo Jeon ,  Attalee Snarr Taylor ,  Craig Warren Hornung

IPC: H01R12/00

CPC classification number: H01R13/2442 ,  H01R12/57 ,  H01R43/0221

Abstract: An electrical component including a substrate having opposite first and second sides and a plurality of vias extending into the substrate from the first side. The substrate has first conductive pads on the first side that are electrically connected to corresponding vias. The electrical component also includes a plurality of electrical contacts that are mounted to the substrate along the first side. Each of the electrical contacts includes a contact heel and a contact beam that extends from the corresponding contact heel and at least partially away from the first side. The contact heels are laser-welded to corresponding first conductive pads.

Abstract translation: 一种电气部件，包括具有相对的第一和第二侧面的基板和从第一侧延伸到基板中的多个通孔。 衬底具有在第一侧上的电连接到相应通孔的第一导电焊盘。 电气部件还包括沿着第一侧安装到基板的多个电触头。 每个电触头包括接触脚跟和从相应的接触脚跟延伸并且至少部分地远离第一侧的接触梁。 接触脚跟被激光焊接到相应的第一导电垫上。

公开(公告)号：US20130330941A1

公开(公告)日：2013-12-12

申请号：US13493632

申请日：2012-06-11

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R12/51 ,  H05K1/11

CPC classification number: H01R13/6594 ,  H01R12/585 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09618 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2203/0207 ,  H05K2203/0242

Abstract: A circuit board including a board substrate having opposite first and second sides. The board substrate has a thickness measured along a z-axis that is perpendicular to the first and second sides. The circuit board also includes plated thru-hole (PTH) vias extending along the z-axis from the first side into the board substrate. The PTH vias are arranged to form multiple signal pairs. The circuit board also includes signal traces that are directly coupled to the PTH vias and extend perpendicular to the z-axis in the board substrate. The signal traces and the PTH vias are configured to transmit differential signals. The circuit board also includes ground columns that extend along the z-axis in the board substrate. The ground columns are distributed relative to the signal pairs to form shield arrays. Each of the shield arrays surrounds one of the signal pairs, wherein the ground columns comprise microvias.

Abstract translation: 一种电路板，包括具有相对的第一和第二侧面的板基板。 板基板具有沿着垂直于第一和第二侧的z轴测量的厚度。 电路板还包括沿着z轴从第一侧延伸到板基板的电镀通孔（PTH）通孔。 PTH通孔被布置成形成多个信号对。 电路板还包括直接耦合到PTH通孔并垂直于板基板中的z轴延伸的信号迹线。 信号迹线和PTH通孔配置为传输差分信号。 电路板还包括沿着板基板中的z轴延伸的接地柱。 接地柱相对于信号对分布以形成屏蔽阵列。 每个屏蔽阵列围绕信号对中的一个，其中接地列包括微孔。

公开(公告)号：US20130231009A1

公开(公告)日：2013-09-05

申请号：US13411813

申请日：2012-03-05

Applicant: Myoungsoo Jeon ,  Attalee Snarr Taylor ,  Craig Warren Hornung

Inventor： Myoungsoo Jeon ,  Attalee Snarr Taylor ,  Craig Warren Hornung

IPC: H01R24/00

CPC classification number: H01R13/2442 ,  H01R12/57 ,  H01R43/0221

Abstract: An electrical component including a substrate having opposite first and second sides and a plurality of vias extending into the substrate from the first side. The substrate has first conductive pads on the first side that are electrically connected to corresponding vias. The electrical component also includes a plurality of electrical contacts that are mounted to the substrate along the first side. Each of the electrical contacts includes a contact heel and a contact beam that extends from the corresponding contact heel and at least partially away from the first side. The contact heels are laser-welded to corresponding first conductive pads.

Abstract translation: 一种电气部件，包括具有相对的第一和第二侧面的基板和从第一侧延伸到基板中的多个通孔。 衬底具有在第一侧上的电连接到相应通孔的第一导电焊盘。 电气部件还包括沿着第一侧安装到基板的多个电触头。 每个电触头包括接触脚跟和从相应的接触脚跟延伸并且至少部分地远离第一侧的接触梁。 接触脚跟被激光焊接到相应的第一导电垫上。

公开(公告)号：US08382487B2

公开(公告)日：2013-02-26

申请号：US12973071

申请日：2010-12-20

Applicant: Myoungsoo Jeon ,  Attalee Snarr Taylor ,  Craig Warren Hornung

Inventor： Myoungsoo Jeon ,  Attalee Snarr Taylor ,  Craig Warren Hornung

IPC: H01R12/00

CPC classification number: H01R12/52 ,  H01R12/57

Abstract: A land grid array interconnect has a substrate that has a first surface and a second surface. The substrate has a plurality of vias extending therethrough. The substrate has first pads on the first surface electrically connected to corresponding vias and has second pads on the second surface electrically connected to corresponding vias and corresponding first pads. A contact array is coupled to the first surface of the substrate. The contact array has a metal plate that defines a carrier and a plurality of contacts formed from the metal plate and held by the carrier. The contacts have contact heels and beams extending from corresponding contact heels. The contact heels are soldered to corresponding first pads. The contacts are singulated from the carrier after the contact heels are soldered to the first pads. The carrier is removed from the substrate after the contacts are singulated leaving the individual contacts soldered to corresponding first pads.

Abstract translation: 地面阵列互连具有具有第一表面和第二表面的基底。 衬底具有穿过其中延伸的多个通孔。 衬底在第一表面上具有电连接到对应的通孔的第一焊盘，并且在第二表面上具有电连接到对应的通孔和对应的第一焊盘的第二焊盘。 接触阵列耦合到衬底的第一表面。 接触阵列具有限定载体的金属板和由金属板形成并由载体保持的多个触点。 触点具有从相应的接触脚跟延伸的接触脚跟和梁。 接触脚跟被焊接到相应的第一垫。 在将接触脚跟焊接到第一衬垫之后，将触头从载体上分离出来。 在将触点分开之后，将载体从基板上移除，使各个触点焊接到相应的第一焊盘。

公开(公告)号：US08062070B2

公开(公告)日：2011-11-22

申请号：US12724217

申请日：2010-03-15

Applicant: Myoungsoo Jeon ,  Attalee Snarr Taylor ,  John Joseph Consoli

Inventor： Myoungsoo Jeon ,  Attalee Snarr Taylor ,  John Joseph Consoli

IPC: H01R13/66

CPC classification number: H01R13/6473 ,  H01R12/724 ,  H01R13/518 ,  H01R13/6587 ,  H01R13/6625 ,  H01R13/6633

Abstract: A connector assembly includes a contact module with a lead frame having signal conductors defining separate conductive paths. The contact module also includes a compensation circuit component coupled to the leadframe. The compensation circuit component has a substrate and multiple compensation circuit elements mounted to the substrate, where the substrate is coupled to the leadframe such that the compensation circuit elements are electrically connected to corresponding signal conductors. The contact module also includes a body encasing the signal conductors and the compensation circuit component.

Abstract translation: 连接器组件包括具有引线框架的触点模块，该引线框架具有限定单独的导电路径的信号导 接触模块还包括耦合到引线框架的补偿电路部件。 补偿电路部件具有安装到基板的基板和多个补偿电路元件，其中基板耦合到引线框架，使得补偿电路元件电连接到对应的信号导体。 接触模块还包括封装信号导体和补偿电路部件的主体。

公开(公告)号：US07150652B1

公开(公告)日：2006-12-19

申请号：US11359146

申请日：2006-02-21

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R13/648

CPC classification number: H01R12/725 ,  H01R13/6471 ,  H01R13/6589 ,  H01R13/6658

Abstract: A connector assembly includes a male connector and a female connector. The female connector includes two printed circuit assembly portions (PCAPs). Each PCAP includes a printed circuit having a ground plane and a plurality of conductors. A plurality of contact beams are attached to the conductors so that the PCAP structure resembles a comb. The two PCAPs are disposed in an insulative portion of the female connector such that the two rows of contact beams face one another. The male connector also includes two PCAPs. The PCAPs in the male connector do not have contact beams but rather have exposed conductors. When the male and female connectors are mated, the contact beams on the female connector make contact with the exposed conductors on the PCAPs in the male connector. The structure of the PCAPs in the assembly are microstrip-like and the characteristic impedance through the mated connectors is substantially uniform.

Abstract translation: 连接器组件包括阳连接器和阴连接器。 阴连接器包括两个印刷电路组件部分（PCAP）。 每个PCAP包括具有接地平面和多个导体的印刷电路。 多个接触梁附接到导体，使得PCAP结构类似于梳子。 两个PCAP设置在阴连接器的绝缘部分中，使得两排接触梁彼此面对。 公连接器还包括两个PCAP。 阳连接器中的PCAP不具有接触梁，而是具有暴露的导体。 当母连接器和母连接器配合时，母连接器上的接触梁与阳连接器中PCAP上的裸露导体接触。 组件中的PCAP的结构是微带状的，并且通过配合的连接器的特征阻抗基本上是均匀的。

公开(公告)号：US08715006B2

公开(公告)日：2014-05-06

申请号：US13493632

申请日：2012-06-11

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R13/648

CPC classification number: H01R13/6594 ,  H01R12/585 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09618 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2203/0207 ,  H05K2203/0242

Abstract: A circuit board including a board substrate having opposite first and second sides. The board substrate has a thickness measured along a z-axis that is perpendicular to the first and second sides. The circuit board also includes plated thru-hole (PTH) vias extending along the z-axis from the first side into the board substrate. The PTH vias are arranged to form multiple signal pairs. The circuit board also includes signal traces that are directly coupled to the PTH vias and extend perpendicular to the z-axis in the board substrate. The signal traces and the PTH vias are configured to transmit differential signals. The circuit board also includes ground columns that extend along the z-axis in the board substrate. The ground columns are distributed relative to the signal pairs to form shield arrays. Each of the shield arrays surrounds one of the signal pairs, wherein the ground columns comprise microvias.

Abstract translation: 一种电路板，包括具有相对的第一和第二侧面的板基板。 板基板具有沿着垂直于第一和第二侧的z轴测量的厚度。 电路板还包括沿着z轴从第一侧延伸到板基板的电镀通孔（PTH）通孔。 PTH通孔被布置成形成多个信号对。 电路板还包括直接耦合到PTH通孔并垂直于板基板中的z轴延伸的信号迹线。 信号迹线和PTH通孔配置为传输差分信号。 电路板还包括沿着板基板中的z轴延伸的接地柱。 接地柱相对于信号对分布以形成屏蔽阵列。 每个屏蔽阵列围绕信号对中的一个，其中接地列包括微孔。

公开(公告)号：US20130224999A1

公开(公告)日：2013-08-29

申请号：US13408641

申请日：2012-02-29

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R13/648

CPC classification number: H01R13/6599 ,  H01R13/6463 ,  H01R13/6477 ,  H01R13/6587 ,  H01R23/7073

Abstract: An electrical connector including a connector housing having a mating face that is configured to engage a mating connector. The electrical connector also includes a contact module that is held by the connector housing and that includes differential pairs of signal conductors. The contact module also includes dielectric ribs that encase corresponding signal conductors. The dielectric ribs are spaced apart from one another. The contact module also includes guard conductors that extend between and couple to adjacent dielectric ribs. The contact module also includes a conductive layer that is disposed on the dielectric ribs and the guard conductors. The conductive layer is electrically coupled to the guard conductors.

Abstract translation: 一种电连接器，包括连接器壳体，所述连接器壳体具有配置为接合配合连接器的配合面。 电连接器还包括由连接器壳体保持并且包括差分信号导体对的接触模块。 接触模块还包括包围对应的信号导体的电介质肋。 电介质肋彼此间隔开。 接触模块还包括在相邻的介质肋之间延伸并耦合到相邻介质肋的保护导体。 接触模块还包括设置在电介质肋和保护导体上的导电层。 导电层电连接到保护导体。

公开(公告)号：US20120083140A1

公开(公告)日：2012-04-05

申请号：US12896654

申请日：2010-10-01

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R12/70 ,  H01R13/40

CPC classification number: H01R12/724 ,  H01R13/15 ,  H01R13/6473 ,  H01R13/6586

Abstract: An electrical connector includes a housing and a contact held by the housing. The contact has a mating interface configured for mating with a mating contact of a mating connector. The contact has a planar side extending to a tip. An interface contact is separately provided from, and coupled to, the mating interface of the contact. The interface contact has a base coupled to the side of the contact proximate to the tip. The interface contact has a spring beam extending from the base away from the side of the contact. The spring beam is configured to engage the mating contact of the mating connector to make an electrical connection between the contact and the mating contact.

Abstract translation: 电连接器包括壳体和由壳体保持的触点。 接触件具有被配置为与配合连接器的配合触头配合的配合接口。 触点具有延伸到尖端的平面侧。 界面接触件单独提供并联接到接触件的配合接口。 界面接触件具有联接到靠近尖端的接触侧的基部。 界面接触件具有从基部远离触点的侧面延伸的弹簧梁。 弹簧梁被配置为接合配合连接器的配合触头以在接触件和配合触头之间形成电连接。