公开(公告)号：US20140203305A1

公开(公告)日：2014-07-24

申请号：US14158260

申请日：2014-01-17

Applicant: NICHIA CORPORATION

Inventor： Yusuke KAWANO ,  Satoshi OKADA

IPC: H01L33/58 ,  H01L33/50

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: The light emitting device is provided with a substrate, semiconductor light emitting elements mounted on the substrate, a mold frame that surrounds the periphery of the light emitting elements on the substrate, and resin layers that fill the inside of the mold frame. The mold frame includes a first mold frame, and a second mold frame formed on top of the first mold frame. The resin layers include a first resin layer that embeds the light emitting elements in resin and is formed with a height approximately equal to the height of the top of the first mold frame, and a second resin layer on top of the first resin layer that is formed with a height approximately equal to the height of the top of the second mold frame. At least one of the resin layers (which are the first resin layer and the second resin layer) includes wavelength-shifting material to change the wavelength of light emitted from the semiconductor light emitting elements.

Abstract translation: 发光装置设置有基板，安装在基板上的半导体发光元件，围绕基板上的发光元件的周围的模框和填充模框内部的树脂层。 模具框架包括第一模具框架和形成在第一模具框架的顶部上的第二模具框架。 树脂层包括第一树脂层，其将发光元件嵌入树脂中并且形成有高度大致等于第一模架的顶部的高度，第二树脂层位于第一树脂层的顶部 形成为高度大致等于第二模架的顶部的高度。 至少一个树脂层（它们是第一树脂层和第二树脂层）包括改变从半导体发光元件发射的光的波长的波长迁移材料。

公开(公告)号：US20210066565A1

公开(公告)日：2021-03-04

申请号：US17006866

申请日：2020-08-30

Applicant: NICHIA CORPORATION

Inventor： Yusuke KAWANO

IPC: H01L33/62 ,  H01L33/10 ,  H01L27/15 ,  H01L33/48

Abstract: A light-emitting device includes light-emitting elements connected through a wiring pattern, at least one wire electrically connecting a portion of the wiring pattern to another portion of the wiring pattern, and a reflective member covering a region of the mounting board except for the wiring pattern. The wiring pattern includes wire connection regions at such a distance from each other as to allow the wire to connect the connection regions to each other. The connection regions being used to connect the light-emitting elements in series and/or in parallel by the wire in any one pattern of a plurality of connection patterns with different numbers of series and parallel connections. A plurality of rows of light-emitting elements each constituted of part of the light-emitting elements are disposed on the wiring pattern. The wiring pattern includes an extending portion provided outside of the rows and not provided between the rows.

公开(公告)号：US20170207203A1

公开(公告)日：2017-07-20

申请号：US15408032

申请日：2017-01-17

Applicant: NICHIA CORPORATION

Inventor： Yusuke KAWANO

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/62

Abstract: A light emitting device including a supporting body; first wirings formed on a surface of the supporting body; second wirings formed on the surface of the supporting body; a plurality of first light emitting elements, which are flip-chip mounted on respective ones of the first wirings and are electrically connected to each other by the first wirings; and a second light emitting element electrically connected to at least one of the second wirings. The second light emitting element is disposed on at least one of the first wirings at a location between at least two of the electrically-connected first light emitting elements, without being electrically connected to said at least one of the first wirings.