公开(公告)号：US20150021640A1

公开(公告)日：2015-01-22

申请号：US14315437

申请日：2014-06-26

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA ,  Satoshi OKADA

IPC: H01L33/60 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L24/45 ,  H01L24/48 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light-emitting device includes a lead frame, a white resist, a light-emitting element, and a wire. The white resist is provided on the lead frame to be in contact with the lead frame. The white resist has an opening to expose the lead frame. The light-emitting element is disposed on the white resist and includes a transparent substrate and a semiconductor layer. The transparent substrate is bonded to the white resist via a bonding member. The semiconductor layer is provided on the transparent substrate. The wire connects the light-emitting element and the lead frame at the opening.

Abstract translation: 发光装置包括引线框，白色抗蚀剂，发光元件和导线。 白色抗蚀剂设置在引线框架上以与引线框架接触。 白色抗蚀剂具有露出引线框的开口。 发光元件设置在白色抗蚀剂上，并且包括透明基板和半导体层。 透明基板经由接合部件与白色抗蚀剂接合。 半导体层设置在透明基板上。 导线在开口处连接发光元件和引线框架。

公开(公告)号：US20130343067A1

公开(公告)日：2013-12-26

申请号：US14011702

申请日：2013-08-27

Applicant: Nichia Corporation

Inventor： Satoshi OKADA

IPC: F21V21/00

CPC classification number: F21V21/00 ,  H01L24/73 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a package and a light emitting element. The package includes a resin portion and at least one lead frame arranged in the resin portion. The at least one lead frame has at least one protrusion which is surrounded by the resin portion and which has an upper surface exposed from the resin portion. The light emitting element is mounted on the upper surface of the at least one protrusion and is electrically connected to the at least one lead frame. At least a half area of the upper surface is covered with the light emitting element.

Abstract translation: 发光器件包括封装和发光元件。 该包装包括树脂部分和布置在树脂部分中的至少一个引线框架。 所述至少一个引线框架具有至少一个由所述树脂部分包围并且具有从所述树脂部分露出的上表面的突起。 发光元件安装在至少一个突起的上表面上并与至少一个引线框电连接。 上表面的至少一半区域被发光元件覆盖。

公开(公告)号：US20140203305A1

公开(公告)日：2014-07-24

申请号：US14158260

申请日：2014-01-17

Applicant: NICHIA CORPORATION

Inventor： Yusuke KAWANO ,  Satoshi OKADA

IPC: H01L33/58 ,  H01L33/50

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: The light emitting device is provided with a substrate, semiconductor light emitting elements mounted on the substrate, a mold frame that surrounds the periphery of the light emitting elements on the substrate, and resin layers that fill the inside of the mold frame. The mold frame includes a first mold frame, and a second mold frame formed on top of the first mold frame. The resin layers include a first resin layer that embeds the light emitting elements in resin and is formed with a height approximately equal to the height of the top of the first mold frame, and a second resin layer on top of the first resin layer that is formed with a height approximately equal to the height of the top of the second mold frame. At least one of the resin layers (which are the first resin layer and the second resin layer) includes wavelength-shifting material to change the wavelength of light emitted from the semiconductor light emitting elements.

Abstract translation: 发光装置设置有基板，安装在基板上的半导体发光元件，围绕基板上的发光元件的周围的模框和填充模框内部的树脂层。 模具框架包括第一模具框架和形成在第一模具框架的顶部上的第二模具框架。 树脂层包括第一树脂层，其将发光元件嵌入树脂中并且形成有高度大致等于第一模架的顶部的高度，第二树脂层位于第一树脂层的顶部 形成为高度大致等于第二模架的顶部的高度。 至少一个树脂层（它们是第一树脂层和第二树脂层）包括改变从半导体发光元件发射的光的波长的波长迁移材料。