公开(公告)号：US20140353007A1

公开(公告)日：2014-12-04

申请号：US14283612

申请日：2014-05-21

Applicant: NITTO DENKO CORPORATION

Inventor： Kouji ICHINOSE ,  Jun ISHII ,  Yoshito FUJIMURA

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K1/118 ,  H05K1/0271 ,  H05K1/05 ,  H05K3/0082 ,  H05K3/32 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/2009 ,  H05K2203/0285 ,  H05K2203/308

Abstract: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction.

Abstract translation: 布线电路板包括金属支撑层，第一绝缘层，导电图案和第二绝缘层。 第一和第二绝缘层包括露出导电图案的两个表面的第一和第二开口。 导电图案的另一侧的表面在厚度方向上通过第一开口露出并被构造为第一端子部分，并且其厚度方向的一侧的表面通过第二开口露出， 作为第二终端部分。 金属支撑层包括第三开口，其暴露第一绝缘层的第一端子部分和覆盖导电图案的覆盖部分，该第一绝缘层覆盖连接到第一端子部分的导电图案，以及加强部分，位于覆盖物的另一侧的表面上 部分厚度方向。

公开(公告)号：US20140101934A1

公开(公告)日：2014-04-17

申请号：US14141705

申请日：2013-12-27

Applicant: Nitto Denko Corporation

Inventor： Jun ISHII ,  Terukazu IHARA ,  Naohiro TERADA

IPC: H05K3/46

CPC classification number: H05K3/4644 ,  G11B5/486 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09781 ,  Y10T29/49124

Abstract: A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

Abstract translation: 在至少一个具有一端侧的电路的悬架板和具有电路的悬挂板组装片的支撑框架之间的区域中设置虚拟轨迹部分。 在虚拟轨迹部分的支撑基板上形成基底绝缘层。 在基底绝缘层上形成多个导体迹线，在基底绝缘层上形成盖绝缘层，以覆盖每个导体迹线。 虚拟轨迹部分中的基底绝缘层和覆盖绝缘层中的至少一个具有凹槽。

公开(公告)号：US20140048311A1

公开(公告)日：2014-02-20

申请号：US13946556

申请日：2013-07-19

Applicant: NITTO DENKO CORPORATION

Inventor： Jun ISHII ,  Takatoshi SAKAKURA

IPC: H05K1/02

CPC classification number: H05K1/0298 ,  G11B5/484 ,  H05K1/056 ,  H05K3/28 ,  H05K2203/0594

Abstract: A wired circuit board includes a first insulating layer, a conductive pattern formed on its surface at one side in a thickness direction, and a second insulating layer formed on the surface of the first insulating layer at the one side in the thickness direction so as to cover the conductive pattern. An outer end surface of the first insulating layer in a perpendicular direction to the thickness direction is formed to be inclined outwardly gradually from the one side toward the other side in the thickness direction. An outer end surface of the second insulating layer in the perpendicular direction has an end edge at the other side in the thickness direction which is located between both end edges of the outer end surface of the first insulating layer in the perpendicular direction which are located at the one side and the other side in the thickness direction.

Abstract translation: 布线电路板包括：第一绝缘层，在其厚度方向的一侧的表面上形成的导电图案;以及形成在第一绝缘层的厚度方向一侧的表面上的第二绝缘层，以便 覆盖导电图案。 第一绝缘层的与厚度方向垂直的外端面形成为从厚度方向的一侧朝向另一侧向外侧逐渐倾斜。 第二绝缘层的垂直方向的外端面在厚度方向的另一侧具有位于第一绝缘层的垂直方向的外端面的两端缘之间的端缘，位于 一侧和另一侧在厚度方向上。

公开(公告)号：US20130215726A1

公开(公告)日：2013-08-22

申请号：US13771636

申请日：2013-02-20

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshito FUJIMURA ,  Tetsuya OHSAWA ,  Jun ISHII

IPC: G11B21/16

CPC classification number: G11B21/16 ,  G11B5/4826 ,  G11B5/4833 ,  G11B5/4853

Abstract: A suspension board with circuit for mounting a slider unit including an electron device, the electron device being mounted so as to form, when projected in the thickness direction with respect to the slider provided with a magnetic head, an overlapping portion that overlaps with the slider, and a protruding portion that protrudes from the slider. The suspension board with circuit is formed with a first opening penetrating in the thickness direction and accommodates the overlapping portion, and a second opening that communicates with the first opening and accommodates the protruding portion.

Abstract translation: 一种悬挂板，具有用于安装包括电子器件的滑块单元的电路，当相对于设置有磁头的滑块在厚度方向上突出时，安装电子装置形成与滑块重叠的重叠部分 ，以及从滑块突出的突出部。 具有电路的悬挂板形成有沿厚度方向贯穿的第一开口并容纳重叠部分，以及与第一开口连通并容纳突出部分的第二开口。