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14 条记录 (耗时 0.023 秒)

    WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
    2.
    发明申请
    WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF 有权
    有线电路板及其制造方法

    公开(公告)号：US20130319748A1

    公开(公告)日：2013-12-05

    申请号：US13889839

    申请日：2013-05-08

    申请人： NITTO DENKO CORPORATION

    发明人： Jun ISHII ,  Saori KANEZAKI

    IPC分类号： H05K1/02 ,  H05K3/42

    CPC分类号： H05K1/0298 ,  G11B5/484 ,  G11B5/4873 ,  H05K1/053 ,  H05K1/111 ,  H05K3/321 ,  H05K3/42 ,  H05K2201/09745 ,  H05K2201/10083 ,  Y02P70/611

    摘要： A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side terminal portion when projected in the thickness direction, and used to be connected to an electronic element via a conductive adhesive, and a conductive portion filling the opening to provide electrical conduction between the one-side terminal portion and the other-side terminal portion.

    摘要翻译： 布线电路板包括：绝缘层，形成有沿着布线电路板的厚度方向延伸穿过的开口;导电层，形成在绝缘层的厚度方向的一个表面上，并且包括单面端子部， 形成在绝缘层的厚度方向的另一个表面上的另一侧端子部分，当沿着厚度方向突出时设置成与开口和单侧端子部分重叠，并且用于连接到电子元件 通过导电粘合剂和填充该开口的导电部分，以在一侧端子部分和另一侧端子部分之间提供导电。

    WIRED CIRCUIT BOARD
    4.
    发明申请
    WIRED CIRCUIT BOARD 有权
    有线电路板

    公开(公告)号：US20130133939A1

    公开(公告)日：2013-05-30

    申请号：US13681961

    申请日：2012-11-20

    申请人： Nitto Denko Corporation

    发明人： Jun ISHII

    IPC分类号： H05K1/11

    CPC分类号： H05K1/115 ,  G11B5/484 ,  G11B5/486 ,  G11B5/4873 ,  H05K1/056 ,  H05K1/118 ,  H05K3/40 ,  H05K2201/0394 ,  H05K2201/09554

    摘要： A wired circuit board includes an insulating layer formed with a first opening and a second opening, a conductive layer formed on the insulating layer and including a terminal overlapping the first opening, and a wire having a part thereof overlapping the second opening and continued to the terminal, a metal pedestal portion formed under the insulating layer and disposed around the first opening so as to overlap the second opening and support an electronic element, and a conductive portion filling the second opening to provide electrical conduction between the wire and the metal pedestal portion.

    摘要翻译： 布线电路板包括形成有第一开口和第二开口的绝缘层，形成在绝缘层上并包括与第一开口重叠的端子的导电层，以及具有与第二开口重叠的部分的导线， 端子，金属基座部分，形成在所述绝缘层下方并且设置在所述第一开口周围以与所述第二开口重叠并且支撑电子元件;以及导电部分，其填充所述第二开口以在所述电线和所述金属基座部分之间提供导电 。

    SUSPENSION BOARD WITH CIRCUIT
    6.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT 有权
    悬挂板与电路

    公开(公告)号：US20140153373A1

    公开(公告)日：2014-06-05

    申请号：US14087465

    申请日：2013-11-22

    申请人： NITTO DENKO CORPORATION

    发明人： Yoshito FUJIMURA ,  Jun ISHII ,  Terukazu IHARA

    IPC分类号： G11B13/04

    CPC分类号： G11B5/4826 ,  G11B5/486 ,  G11B5/6088 ,  G11B2005/0021

    摘要： A suspension board with circuit is for mounting thereon a slider/light source unit provided with a slider on which a magnetic head is mounted, and a light source device including a main body, and a light source provided to protrude from the main body. The suspension board with circuit includes a receiving portion formed therein to be capable of receiving the light source, and a guide surface for guiding the light source to the receiving portion when the slider/light source unit is mounted.

    摘要翻译： 具有电路的悬挂板用于在其上安装设置有安装有磁头的滑块的滑块/光源单元，以及包括主体和设置成从主体突出的光源的光源装置。 具有电路的悬挂板包括形成在其中以能够接收光源的接收部分和用于当安装滑块/光源单元时将光源引导到接收部分的引导表面。

    METHOD OF PRODUCING A SUSPENSION BOARD WITH CIRCUIT
    9.
    发明申请
    METHOD OF PRODUCING A SUSPENSION BOARD WITH CIRCUIT 有权
    制造具有电路的悬挂板的方法

    公开(公告)号：US20130299451A1

    公开(公告)日：2013-11-14

    申请号：US13948488

    申请日：2013-07-23

    申请人： Nitto Denko Corporation

    发明人： Jun ISHII

    IPC分类号： G11B5/84

    CPC分类号： G11B5/8404 ,  G11B5/48 ,  G11B5/484 ,  G11B5/486

    摘要： A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer and having a terminal portion connected to connecting terminals of a magnetic head mounted on a slider. A slider mounting region where the slider is disposed is defined, and a plurality of the terminal portions are spaced apart from each other in the slider mounting region, and in the metal supporting board, an opening which opens so as to expose the insulating layer where the terminal portions are disposed is formed at the slider mounting region.

    摘要翻译： 具有电路的悬挂板包括金属支撑板，形成在金属支撑板上的绝缘层和形成在绝缘层上的导电图案，并且具有连接到安装在滑块上的磁头的连接端子的端子部分。 限定了滑块设置的滑块安装区域，并且多个端子部分在滑块安装区域中彼此间隔开，并且在金属支撑板中，开口以露出绝缘层， 端子部分设置在滑块安装区域。

    SEALING SHEET, METHOD FOR MANUFACTURING SEALING SHEET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE
    10.
    发明申请
    SEALING SHEET, METHOD FOR MANUFACTURING SEALING SHEET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE 审中-公开
    密封片，制造密封片的方法和制造电子元器件包装的方法

    公开(公告)号：US20160060450A1

    公开(公告)日：2016-03-03

    申请号：US14779859

    申请日：2014-03-17

    申请人： NITTO DENKO CORPORATION

    发明人： Eiji Toyoda ,  Yusaku SHIMIZU ,  Jun ISHII

    IPC分类号： C08L65/02 ,  H03H9/64

    摘要： Provided are a sealing sheet having excellent flexibility and capable of producing an electronic component package which is highly reliable even if an object to be sealed has a hollow structure, a method for manufacturing the sealing sheet, and a method for manufacturing the electronic component package. The present invention is a sealing sheet containing dispersed domains of an elastomer, the domains having a maximum diameter of 20 μm or less.

    摘要翻译： 提供一种具有优异的柔性并能够制造即使被密封物体具有中空结构也是高可靠性的电子部件封装的密封片，密封片的制造方法和电子部件封装的制造方法。 本发明是一种包含弹性体的分散畴的密封片，该畴的最大直径为20μm以下。