公开(公告)号：US20150059162A1

公开(公告)日：2015-03-05

申请号：US14477178

申请日：2014-09-04

Applicant: Nitto Denko Corporation

Inventor： Terukazu IHARA ,  Kouji ICHINOSE

IPC: G01R31/28 ,  H05K3/40 ,  H05K3/10 ,  G01R27/08 ,  G01R1/073

CPC classification number: H05K3/4038 ,  G01R31/2805 ,  G01R31/2813 ,  G11B5/455 ,  G11B5/484 ,  H05K1/0268 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4685 ,  H05K2201/09381 ,  H05K2201/0939 ,  Y10T29/49004

Abstract: First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.

Abstract translation: 第一和第二测量探针分别与第一和第二电极焊盘接触，第三和第四测量探针分别与第一和第二电极焊盘接触。 A电流在包括第一和第二电极焊盘的电流路径和通过第一和第二测量探针的多条线路中流动。 测量当前路径中的电流值，并测量第三和第四测量探针之间的电压值。 基于电流的测量值和电压的测量值检查第一和第二电极焊盘之间的电导率。

公开(公告)号：US20150181695A1

公开(公告)日：2015-06-25

申请号：US14565552

申请日：2014-12-10

Applicant: Nitto Denko Corporation

Inventor： Kouji ICHINOSE ,  Terukazu IHARA

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/40 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/0268 ,  G01R31/2818 ,  H05K1/056 ,  H05K3/0097 ,  Y10T29/49165

Abstract: A plurality of suspension boards are integrally supported by a support frame. A plurality of inspection substrates are provided to correspond to the plurality of suspension boards. In each suspension board, lines are formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the line are electrically connected by a via in the base insulating layer. In each inspection substrate, a conductor layer is formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the conductor layer are electrically connected by a via in the base insulating layer.

Abstract translation: 多个悬挂板由支撑框架一体地支撑。 提供多个检查基板以对应于多个悬挂板。 在每个悬挂板中，在导电支撑基板上形成有夹在其间的基底绝缘层的线。 支撑基板和线通过基底绝缘层中的通孔电连接。 在每个检查基板中，导电层形成在导电性支撑基板上，其间夹有基极绝缘层。 支撑基板和导体层通过基底绝缘层中的通孔电连接。

公开(公告)号：US20230089044A1

公开(公告)日：2023-03-23

申请号：US17913745

申请日：2021-03-26

Applicant: NITTO DENKO CORPORATION

Inventor： Naoto KONEGAWA ,  Seiki TERAJI ,  Kouji ICHINOSE

IPC: G02B6/38

Abstract: Provided is an optical connector that includes a ferrule and an optical fiber as a plastic optical fiber. The ferrule has a leading end face and a through hole for holding a fiber, the through hole having an opening end in the leading end face. The optical fiber has a leading end. The leading end of the optical fiber is inserted in the through hole and located at a retraction position retracted from the leading end face.

公开(公告)号：US20140353007A1

公开(公告)日：2014-12-04

申请号：US14283612

申请日：2014-05-21

Applicant: NITTO DENKO CORPORATION

Inventor： Kouji ICHINOSE ,  Jun ISHII ,  Yoshito FUJIMURA

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K1/118 ,  H05K1/0271 ,  H05K1/05 ,  H05K3/0082 ,  H05K3/32 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/2009 ,  H05K2203/0285 ,  H05K2203/308

Abstract: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction.

Abstract translation: 布线电路板包括金属支撑层，第一绝缘层，导电图案和第二绝缘层。 第一和第二绝缘层包括露出导电图案的两个表面的第一和第二开口。 导电图案的另一侧的表面在厚度方向上通过第一开口露出并被构造为第一端子部分，并且其厚度方向的一侧的表面通过第二开口露出， 作为第二终端部分。 金属支撑层包括第三开口，其暴露第一绝缘层的第一端子部分和覆盖导电图案的覆盖部分，该第一绝缘层覆盖连接到第一端子部分的导电图案，以及加强部分，位于覆盖物的另一侧的表面上 部分厚度方向。