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    SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
    1.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF 审中-公开

    公开(公告)号：US20180070457A1

    公开(公告)日：2018-03-08

    申请号：US15664300

    申请日：2017-07-31

    Applicant: NITTO DENKO CORPORATION

    Inventor： Takatoshi SAKAKURA ,  Tomoaki OKUNO ,  Takahiro TAKANO

    IPC: H05K3/34 ,  H05K1/18 ,  H05K1/02

    CPC classification number: H05K3/34 ,  H05K1/0296 ,  H05K1/18 ,  H05K2201/09209

    Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer disposed at one side in a thickness direction of the metal supporting layer, a conductive pattern including a wire disposed at one side in the thickness direction of the base insulating layer and a terminal exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, a piezoelectric element disposed at the other side in the thickness direction with respect to the terminal and including an element terminal electrically connected to the terminal, and a solder layer disposed between the terminal and the element terminal. The solder layer has a solder composition containing Sn, Ag, and Cu, and the solder layer has a thickness in the thickness direction of 50 μm or less.

    WIRED CIRCUIT BOARD
    2.
    发明申请
    WIRED CIRCUIT BOARD 审中-公开
    有线电路板

    公开(公告)号：US20140048311A1

    公开(公告)日：2014-02-20

    申请号：US13946556

    申请日：2013-07-19

    Applicant: NITTO DENKO CORPORATION

    Inventor： Jun ISHII ,  Takatoshi SAKAKURA

    IPC: H05K1/02

    CPC classification number: H05K1/0298 ,  G11B5/484 ,  H05K1/056 ,  H05K3/28 ,  H05K2203/0594

    Abstract: A wired circuit board includes a first insulating layer, a conductive pattern formed on its surface at one side in a thickness direction, and a second insulating layer formed on the surface of the first insulating layer at the one side in the thickness direction so as to cover the conductive pattern. An outer end surface of the first insulating layer in a perpendicular direction to the thickness direction is formed to be inclined outwardly gradually from the one side toward the other side in the thickness direction. An outer end surface of the second insulating layer in the perpendicular direction has an end edge at the other side in the thickness direction which is located between both end edges of the outer end surface of the first insulating layer in the perpendicular direction which are located at the one side and the other side in the thickness direction.

    Abstract translation: 布线电路板包括：第一绝缘层，在其厚度方向的一侧的表面上形成的导电图案;以及形成在第一绝缘层的厚度方向一侧的表面上的第二绝缘层，以便 覆盖导电图案。 第一绝缘层的与厚度方向垂直的外端面形成为从厚度方向的一侧朝向另一侧向外侧逐渐倾斜。 第二绝缘层的垂直方向的外端面在厚度方向的另一侧具有位于第一绝缘层的垂直方向的外端面的两端缘之间的端缘，位于 一侧和另一侧在厚度方向上。

    METHOD OF PRODUCING SUSPENSION BOARD WITH CIRCUIT
    4.
    发明申请
    METHOD OF PRODUCING SUSPENSION BOARD WITH CIRCUIT 审中-公开
    制造带电路的悬挂板的方法

    公开(公告)号：US20160057867A1

    公开(公告)日：2016-02-25

    申请号：US14753433

    申请日：2015-06-29

    Applicant: NITTO DENKO CORPORATION

    Inventor： Daisuke YAMAUCHI ,  Takatoshi SAKAKURA

    IPC: H05K3/10 ,  H05K3/00 ,  H05K3/46

    CPC classification number: H05K1/056 ,  G11B5/484 ,  H05K3/0082 ,  H05K3/027 ,  H05K3/064 ,  H05K3/44 ,  H05K2201/0969 ,  H05K2203/0323

    Abstract: A method of producing a suspension board with circuit includes the steps of preparing a metal supporting layer; forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer, curing the curable insulating layer to form an insulating layer, subjecting the metal supporting layer exposed from the opening to microwave plasma treatment, and forming a metal conducting portion on the metal supporting layer exposed from the opening.

    Abstract translation: 具有电路的悬挂板的制造方法包括准备金属支撑层的工序; 在所述金属支撑层上形成可固化绝缘层，使用光敏固化绝缘组合物，使得在所述可固化绝缘层中形成开口，固化所述可固化绝缘层以形成绝缘层，使从所述开口露出的所述金属支撑层经受微波 等离子体处理，并且在从开口露出的金属支撑层上形成金属导电部分。

    PRODUCING METHOD OF SUSPENSION BOARD WITH CIRCUIT ASSEMBLY
    5.
    发明申请
    PRODUCING METHOD OF SUSPENSION BOARD WITH CIRCUIT ASSEMBLY 审中-公开

    公开(公告)号：US20180288883A1

    公开(公告)日：2018-10-04

    申请号：US15928599

    申请日：2018-03-22

    Applicant: NITTO DENKO CORPORATION

    Inventor： Takatoshi SAKAKURA ,  Hitoki KANAGAWA

    IPC: H05K3/34

    Abstract: A method for producing a suspension board with circuit assembly includes a preparing step of preparing a plurality of board assemblies each of which includes a plurality of suspension boards with circuit including a first terminal, a supporting portion collectively supporting the plurality of suspension boards with circuit, and a plurality of connecting portions connecting each of the suspension boards with circuit to the supporting portion; an assembly disposing step of disposing the plurality of board assemblies on a carrier board; a solder disposing step of disposing a first solder on the first terminal; an element disposing step of disposing an electronic element so as to be in contact with the first solder; and a reflow step of heating the first solder to be dissolved and connecting the electronic element to the first terminal. The solder disposing step, the element disposing step, and the reflow step are continuously performed.

    SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
    6.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF 审中-公开

    公开(公告)号：US20170294200A1

    公开(公告)日：2017-10-12

    申请号：US15630221

    申请日：2017-06-22

    Applicant: NITTO DENKO CORPORATION

    Inventor： Takatoshi SAKAKURA

    IPC: G11B5/48 ,  H05K3/46 ,  H05K1/05 ,  H05K1/11

    CPC classification number: G11B5/4853 ,  G11B5/483 ,  G11B5/486 ,  G11B5/4873 ,  H05K1/056 ,  H05K1/11 ,  H05K1/183 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/10083

    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on one side of the metal supporting board in a thickness direction thereof, a conductive layer, and an insulating cover layer formed on the one side of the insulating base layer to cover the conductive layer. Either one of the insulating base layer and the insulating cover layer includes an opening extending therethrough in the thickness direction. The conductive layer includes a wire formed on the one side of the insulating base layer, and a connection terminal electrically connected to the wire and exposed from the opening to be capable of electrical connection to an electronic element. The suspension board with circuit further includes a protective layer for protecting the connection terminal exposed from the opening.

    WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF, AND WIRED CIRCUIT BOARD ASSEMBLY AND PRODUCING METHOD THEREOF
    10.
    发明申请
    WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF, AND WIRED CIRCUIT BOARD ASSEMBLY AND PRODUCING METHOD THEREOF 审中-公开
    有线电路板及其制造方法及有线电路板组件及其制造方法

    公开(公告)号：US20160135296A1

    公开(公告)日：2016-05-12

    申请号：US14936122

    申请日：2015-11-09

    Applicant: NITTO DENKO CORPORATION

    Inventor： Takahiro TAKANO ,  Hitoki KANAGAWA ,  Takatoshi SAKAKURA

    IPC: H05K1/11 ,  B23K1/00 ,  H05K3/40

    CPC classification number: B23K1/0016 ,  B23K1/0056 ,  B23K1/008 ,  B23K3/02 ,  B23K2101/40 ,  H05K1/056 ,  H05K3/3415 ,  H05K3/3494 ,  H05K3/4092 ,  H05K2203/1572 ,  Y02P70/613

    Abstract: A method for producing a wired circuit board, including an insulating layer having a first through portion passing through in a thickness direction thereof and a first terminal portion having a second through portion overlapped with the first through portion when projected in the thickness direction, includes the steps of providing a first bonding material at one surface in the thickness direction of the first terminal portion and allowing the first bonding material to flow from the one surface in the thickness direction of the first terminal portion toward the other surface in the thickness direction thereof into the second through portion by allowing the first bonding material to flow.

    Abstract translation: 一种布线电路板的制造方法，其特征在于，包括具有厚度方向通过的第一贯通部的绝缘层和在厚度方向突出时具有与所述第一贯通部重叠的第二贯通部的第一端子部， 在第一端子部的厚度方向的一个表面设置第一接合材料的步骤，使第一接合材料从第一端子部的厚度方向的一个面朝向厚度方向的另一个表面流向 通过允许第一粘合材料流动的第二通过部分。

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