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公开(公告)号：US09442184B2
公开(公告)日：2016-09-13
申请号：US14186158
申请日：2014-02-21
Applicant: NXP B.V.
Inventor： Cornelis Gehrels , Cicero Silveira Vaucher , Luc Van Dijk
CPC classification number: G01S7/4004 , G01R31/005 , G01S7/40
Abstract: A radar data processing system is disclosed. The system includes a microcontroller and a data receiver-transmitter integrated circuit coupled to the microcontroller. The data receiver-transmitter integrated circuit includes a sensor and a dedicated error indicator pin. The data receiver-transmitter integrated circuit includes an inner safety monitor and the microcontroller includes an outer safety monitor. The inner safety monitor configured to receive and collate sensor data from the plurality of sensors and send, through the dedicated error indicator pin, a function warning signal to the outer safety monitor when the sensor data from the sensor is indicative of a functional irregularity.
Abstract translation: 公开了雷达数据处理系统。 该系统包括耦合到微控制器的微控制器和数据接收器 - 发射器集成电路。 数据接收机 - 发射机集成电路包括一个传感器和一个专用的错误指示器引脚。 数据接收机 - 发射机集成电路包括内部安全监视器，微控制器包括外部安全监视器。 内部安全监视器被配置为当来自传感器的传感器数据指示功能不规则时，从多个传感器接收并整理传感器数据并通过专用误差指示器针向外部安全监视器发送功能警告信号。
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公开(公告)号：US09270341B2
公开(公告)日：2016-02-23
申请号：US14180174
申请日：2014-02-13
Applicant: NXP B.V.
Inventor： Cicero Silveira Vaucher , Raf Lodewijk Jan Roovers
CPC classification number: H04B5/0031 , H02J7/025 , H02J17/00 , H02J50/10 , H02J50/20 , H02J50/80 , H02J50/90 , H02J2007/0001 , H04B5/0037
Abstract: An apparatus for non-galvanic connection between two electrical circuits is described. A base-unit has an RF power source, a data link and an authentication controller. A contactless unit for communication with a base unit has an RF power receiver, a data link and an authentication controller. The base unit and contactless unit can form a non-galvanic connection to replace conventional connectors, for example in a USB wired bus connection.
Abstract translation: 描述了两个电路之间非电流连接的装置。 基站具有RF电源，数据链路和认证控制器。 用于与基本单元通信的非接触单元具有RF功率接收器，数据链路和认证控制器。 基本单元和非接触单元可以形成非电流连接以代替常规连接器，例如在USB有线总线连接中。
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公开(公告)号：US20150108996A1
公开(公告)日：2015-04-23
申请号：US14472179
申请日：2014-08-28
Applicant: NXP B.V.
Inventor： Cicero Silveira Vaucher , Mingda Huang , Antonius de Graauw
IPC: G01R31/02
CPC classification number: G01R31/02 , G01R31/006 , G01R31/048 , G01R31/2822
Abstract: The invention provides a testing circuit for testing a connection between a chip and external circuitry. A current source is used to inject a DC current towards the connection to be tested from the chip side. On-chip ESD protection is provided giving a path between the connection to be tested and a fixed voltage line. A shunt path is also coupled to the connection to be tested on the external circuitry side. It is determined if the current source current flows through the ESD protection circuit, and this can be used to determine whether or not the connection to be tested presents an open circuit for the DC test current.
Abstract translation: 本发明提供一种用于测试芯片和外部电路之间的连接的测试电路。 电流源用于从芯片侧向被测试的连接端注入直流电流。 提供片上ESD保护，提供要测试的连接和固定电压线之间的路径。 分路还耦合到要在外部电路侧进行测试的连接。 确定电流源电流是否流过ESD保护电路，并且这可以用于确定待测试的连接是否对DC测试电流产生开路。
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公开(公告)号：US11810875B2
公开(公告)日：2023-11-07
申请号：US17226376
申请日：2021-04-09
Applicant: NXP B.V.
IPC: H01L23/66 , G01S7/02 , G01S13/931 , H01L23/498 , H03H7/42
CPC classification number: H01L23/66 , G01S7/028 , G01S13/931 , H01L23/49816 , H03H7/42 , H01L2223/6616 , H01L2223/6638 , H01L2223/6677 , H01L2223/6683
Abstract: A packaged integrated circuit (IC) includes an IC die having first and second external contacts and a package substrate. The IC die is attached to the package substrate which includes a balun in a first metal layer. The balun is connected to the first and second external contacts of the IC die and to a first external contact of the package substrate. The first and second external contacts of the IC die communicate a differential signal with the package substrate, and the first external contact of the package substrate communicates a single-ended signal corresponding to the differential signal. Alternatively, the balun is connected to an external contact of the IC die and to first and second external contacts of the package substrate, in which the external contact of the IC die communicates a single-ended signal and the first and second external contacts of the package substrate communicate a differential signal.
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Patent Agency Ranking
公开(公告)号：US20220328432A1
公开(公告)日：2022-10-13
申请号：US17226376
申请日：2021-04-09
Applicant: NXP B.V.
IPC: H01L23/66 , H01L23/498 , H03H7/42 , G01S7/02 , G01S13/931
Abstract: A packaged integrated circuit (IC) includes an IC die having first and second external contacts and a package substrate. The IC die is attached to the package substrate which includes a balun in a first metal layer. The balun is connected to the first and second external contacts of the IC die and to a first external contact of the package substrate. The first and second external contacts of the IC die communicate a differential signal with the package substrate, and the first external contact of the package substrate communicates a single-ended signal corresponding to the differential signal. Alternatively, the balun is connected to an external contact of the IC die and to first and second external contacts of the package substrate, in which the external contact of the IC die communicates a single-ended signal and the first and second external contacts of the package substrate communicate a differential signal.
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16.发明申请公开(公告)号：US20220065986A1
公开(公告)日：2022-03-03
申请号：US17011261
申请日：2020-09-03
Applicant: NXP B.V.
Inventor： Cicero Silveira Vaucher
Abstract: A frequency modulated continuous wave (FMCW) radar system includes an antenna array having C antennas where (C=A+B−1), a first integrated circuit (IC) device including A first sensor inputs, and a second IC device including B second sensor inputs. The first sensor inputs are coupled to a first A of the antennas, and the second sensor inputs are coupled to a last B of the antennas such that a common one of the first sensor inputs and a common one of the second sensor inputs are both coupled to a common antenna. Each IC device receives reflected signals on each sensor input, and mixes the reflected signals to associated baseband signals based upon a local oscillator (LO) signal. Each LO signal has a different phase shift. The LO signals are based upon a common LO signal.
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公开(公告)号：US10435030B2
公开(公告)日：2019-10-08
申请号：US14508687
申请日：2014-10-07
Applicant: NXP B.V.
Inventor： Cicero Silveira Vaucher , Luc van Dijk
IPC: B60W50/04 , G01R31/00 , B60W50/02 , B60W50/00 , B60W50/029
Abstract: A function monitor for a system, such as an advanced driver assistance system, comprising a first function monitor element and a second function monitor element, said first function monitor element configured to receive and collate sensor data from a plurality of sensors associated with the system and send a function warning signal to said second function monitor element when said sensor data from one or more of the plurality of sensors is indicative of a functional irregularity.
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公开(公告)号：US09435842B2
公开(公告)日：2016-09-06
申请号：US14472179
申请日：2014-08-28
Applicant: NXP B.V.
Inventor： Cicero Silveira Vaucher , Mingda Huang , Antonius de Graauw
CPC classification number: G01R31/02 , G01R31/006 , G01R31/048 , G01R31/2822
Abstract: The invention provides a testing circuit for testing a connection between a chip and external circuitry. A current source is used to inject a DC current towards the connection to be tested from the chip side. On-chip ESD protection is provided giving a path between the connection to be tested and a fixed voltage line. A shunt path is also coupled to the connection to be tested on the external circuitry side. It is determined if the current source current flows through the ESD protection circuit, and this can be used to determine whether or not the connection to be tested presents an open circuit for the DC test current.
Abstract translation: 本发明提供一种用于测试芯片和外部电路之间的连接的测试电路。 电流源用于从芯片侧向被测试的连接端注入直流电流。 提供片上ESD保护，提供要测试的连接和固定电压线之间的路径。 分路还耦合到要在外部电路侧进行测试的连接。 确定电流源电流是否流过ESD保护电路，并且这可以用于确定待测试的连接是否对DC测试电流产生开路。
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公开(公告)号：US20150142386A1
公开(公告)日：2015-05-21
申请号：US14508687
申请日：2014-10-07
Applicant: NXP B.V.
Inventor： Cicero Silveira Vaucher , Luc van Dijk
CPC classification number: B60W50/04 , B60W50/0225 , B60W2050/0016 , B60W2050/0215 , B60W2050/0295 , G01R31/005
Abstract: A function monitor for a system, such as an advanced driver assistance system, comprising a first function monitor element and a second function monitor element, said first function monitor element configured to receive and collate sensor data from a plurality of sensors associated with the system and send a function warning signal to said second function monitor element when said sensor data from one or more of the plurality of sensors is indicative of a functional irregularity.
Abstract translation: 一种用于诸如高级驾驶员辅助系统的系统的功能监视器，包括第一功能监视元件和第二功能监控元件，所述第一功能监控元件被配置为从与所述系统相关联的多个传感器接收和整理传感器数据，以及 当来自所述多个传感器中的一个或多个传感器的所述传感器数据指示功能不规则时，向所述第二功能监视元件发送功能警告信号。
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