摘要:
An object of the present invention is to provide a method of manufacturing a semiconductor wafer in which the manufacturing efficiency of grinding using a double-headed grinding machine is improved, minute surface undulations arising through the grinding are reduced, and the yield of the manufacturing process is improved. By processing a sliced wafer using a double-headed grinding machine, a strained layer and a macroscopic undulation component formed on the wafer surfaces during the slicing are removed, and the degree of flatness of the wafer is improved, and by subsequently carrying out both-surfaces lapping, minute surface undulations that arose during the double-headed grinding are removed.
摘要:
It is desirable if the lengthwise center axis of a cylindrical rotating member such as a photoreceptor drum is aligned exactly with the center axes of the support shafts. However, as it is impossible to eliminate manufacturing errors in components, it is unavoidable for there to be a slight angle of intersection between the center axis of the cylindrical rotating member and the center axes of the support shaft. Consequently, the object of the present invention is to provide a support mechanism for the cylindrical rotating member whereby the cylindrical rotating member exhibits little unevenness of rotation. When lengthwise axis of the cylindrical rotating member forms angle of intersection .alpha. with lengthwise axis of shaft, this angle .alpha. is absorbed by the slight space between shaft and pierced hole of a rotation transmission member, as well as by the gap between the rotation transmission member and bearing of the cylindrical rotating member, so that the center axis of the cylindrical rotating member is fixed in a set position, and the outer circumference of the cylindrical rotating member moves in a predetermined perfectly circular path.
摘要:
By applying radiation beam energy to a contact portion between an end portion 7 of a glass tube 1 and a zinc-mercury alloy drop 6 and the vicinity thereof by means of an optical fiber 5, the alloy drop 6 is directly heated so as to be caused to partly melt at a bottom portion thereof and fixed firmly to an inner wall surface of the end portion 7 of the glass tube without causing variations.
摘要:
A solid image pick-up element has a pixel region, an output region located near the pixel region, and a field portion located remote from the pixel region, all of which are formed at un upper layer of a semiconductor substrate. The pixel region is provided with plural rows of light receiving portions for performing photoelectric conversion with respect to light received thereby. Between the plural rows of the light receiving portions are interposed transfer portions for transferring signals obtained through the photoelectric conversion. The output region is provided with an output portion for outputting the signals transferred from the transfer portions. The semiconductor substrate is covered with three dielectric films, and an opening is formed through two dielectric films at a location above the output portion.