公开(公告)号：US20160022313A1

公开(公告)日：2016-01-28

申请号：US14877198

申请日：2015-10-07

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA

IPC: A61B17/34

CPC classification number: A61B17/3478 ,  A61B17/3417 ,  A61B2017/00305 ,  A61B2017/00309 ,  A61B2017/00314

Abstract: A puncture needle including: an elongated approximately-linear main body; a distal end portion that is located at a distal end of the main body and that has a blade surface formed of a distal end surface which is formed inclined with respect to a longitudinal direction; and a bending portion that is provided between the main body and the distal end portion to connect the main body to the distal end portion and that can be passively bent in response to an external force. The distal end portion functions as a bending-direction control portion for setting a bending direction of the bending portion to a direction in which the blade surface is made to face toward an inner side of a bent shape.

Abstract translation: 一种穿刺针，包括：细长的大致线形的主体; 远端部分位于主体的远端并且具有由相对于纵向方向倾斜地形成的远端表面形成的叶片表面; 以及设置在主体和远端部分之间的弯曲部分，以将主体连接到远端部分并且可以响应于外力被动地弯曲。 前端部作为将弯曲部的弯曲方向设定成朝向弯曲形状的内侧的方向的弯曲方向控制部发挥作用。

公开(公告)号：US20150087088A1

公开(公告)日：2015-03-26

申请号：US14557157

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Takatoshi IGARASHI ,  Kazuhiro YOSHIDA

IPC: H01L25/00 ,  H01L21/78 ,  H01L21/66 ,  H01L27/146

CPC classification number: H01L25/50 ,  H01L21/78 ,  H01L21/786 ,  H01L22/10 ,  H01L22/20 ,  H01L23/3121 ,  H01L27/14618 ,  H01L27/14638 ,  H01L27/14687 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes processes of: cutting an image pickup chip substrate to fabricate a plurality of image pickup chips; bonding the image pickup chips to a glass wafer via a transparent adhesive layer as well as bonding dummy chips to an outer peripheral region of the glass wafer where the image pickup chips are not bonded to fabricate a joined wafer; filling a sealing member between the image pickup chips and the dummy chips; machining the joined wafer to thin a thickness; and cutting the joined wafer.

Abstract translation: 一种图像拾取装置的制造方法，包括以下处理：切割图像拾取芯片基板以制造多个图像拾取芯片; 通过透明粘合剂层将图像拾取芯片接合到玻璃晶片，以及将虚拟芯片接合到不结合图像拾取芯片的玻璃晶片的外周区域以制造接合的晶片; 在图像拾取芯片和虚拟芯片之间填充密封构件; 加工接合的晶片以使厚度变薄; 并切割接合的晶片。

公开(公告)号：US20150087086A1

公开(公告)日：2015-03-26

申请号：US14557021

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA ,  Noriyuki Fujimori ,  Takatoshi IGARASHI

IPC: H01L27/146 ,  H01L21/56 ,  H01L21/768 ,  H01L21/78 ,  H01L21/66

CPC classification number: H01L25/042 ,  H01L21/56 ,  H01L21/76898 ,  H01L21/78 ,  H01L22/10 ,  H01L22/20 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种用于制造图像拾取装置的方法包括：通过切割形成光接收部分和电极焊盘的图像拾取芯片基板来制造多个图像拾取芯片的处理; 通过将图像拾取芯片接合到玻璃晶片来制造接合晶片的工艺; 将多个图像拾取芯片之间的间隙填充到密封构件的处理; 加工接合的晶片以减小厚度的过程; 形成通孔过孔的过程; 形成覆盖图像拾取芯片的绝缘层的工艺; 形成通孔互连的过程; 形成外部连接电极的工艺，每个连接电极连接到每个通孔互连件; 以及切割接合的晶片的过程。

公开(公告)号：US20190175002A1

公开(公告)日：2019-06-13

申请号：US16281184

申请日：2019-02-21

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Kensuke SUGA ,  Kazuhiro YOSHIDA

IPC: A61B1/05 ,  G02B23/24 ,  A61B1/00 ,  A61B1/12 ,  H04N5/225

Abstract: An endoscope includes: an insertion section including a rigid distal end portion in which a first through hole and a second through hole are formed; an image pickup unit inserted in the first through hole, the image pickup unit including a first block and a second block having an area in a direction orthogonal to an optical axis that is smaller than an area of the first block in the direction orthogonal to the optical axis; and a water feeding and air feeding tube having a distal end portion that is inserted in the second through hole, a part of the tube being arranged in an accommodation space in which a space obtained by extending the first block in an optical axis direction and a space obtained by extending the second block in the direction orthogonal to the optical axis are superimposed on each other.

公开(公告)号：US20190079280A1

公开(公告)日：2019-03-14

申请号：US16185087

申请日：2018-11-09

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA ,  Takatoshi IGARASHI ,  Kazuya MAEDA

IPC: G02B23/24 ,  H04N5/225 ,  A61B1/05 ,  A61B1/00 ,  H01L27/146

Abstract: A manufacturing method of the optical unit for endoscope includes: a process of fabricating a bonded wafer by laminating a plurality of optical element wafers, each of the plurality of optical element wafers including a plurality of optical elements; a groove forming process of forming a groove on the bonded wafer along a cutting line for segmentation such that the groove has a bottom surface in the optical element wafer laminated at a lowermost part of the bonded wafer; and a cutting process of cutting the bonded wafer along the cutting line with a cutting margin narrower than a width of the groove and segmenting the bonded wafer, and the manufacturing method further includes a process of disposing a reinforcing member in the groove.

公开(公告)号：US20190015129A1

公开(公告)日：2019-01-17

申请号：US16131703

申请日：2018-09-14

Applicant: OLYMPUS CORPORATION

Inventor： Takamitsu SAKAMOTO ,  Chie ONUMA ,  Ken FUJISAKI ,  Kiichiro SAWADA ,  Kazuhiro YOSHIDA ,  Satoshi TAKEKOSHI ,  Sohei UEDA ,  Yasuo TANIGAMI

IPC: A61B17/32 ,  A61B17/16 ,  A61B1/317 ,  A61B1/00 ,  A61B1/06 ,  A61B1/04

Abstract: An arthroscopical surgical method including administering a fluorescent chemical agent into a joint, which is a treatment target, allowing the fluorescent chemical agent to be adsorbed by a degenerated region that has degenerated from a normal region in a cartilage inside the joint, which is the treatment target, displaying and observing an emission of fluorescence from the degenerated region, which has adsorbed the fluorescent chemical agent, by infrared excitation light on a display through an arthroscope, and allowing a surgeon to recognize the degenerated region in the cartilage inside the joint, which is the treatment target.

公开(公告)号：US20170311790A1

公开(公告)日：2017-11-02

申请号：US15652390

申请日：2017-07-18

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA

IPC: A61B1/233 ,  A61B1/00 ,  A61B1/015

CPC classification number: A61B1/233 ,  A61B1/00 ,  A61B1/00006 ,  A61B1/00045 ,  A61B1/00154 ,  A61B1/015

Abstract: Provided is an insertion aid for assisting in insertion of an insertion member having a rigid distal end part into a paranasal sinus or an opening leading to the paranasal sinus. The insertion aid includes a guiding portion having an elongated and curved one end part and configured to guide an insertion route of the insertion member, a guided portion configured to hold the insertion member and movable along the guiding portion, and a support portion supporting the other end part of the guiding portion.

公开(公告)号：US20170273708A1

公开(公告)日：2017-09-28

申请号：US15082519

申请日：2016-03-28

Applicant: OLYMPUS CORPORATION

Inventor： Takamitsu SAKAMOTO ,  Chie ONUMA ,  Kiichiro SAWADA ,  Ken FUJISAKI ,  Kazuhiro YOSHIDA ,  Satoshi TAKEKOSHI ,  Sohei UEDA ,  Yasuo TANIGAMI

IPC: A61B17/32 ,  A61B17/06

CPC classification number: A61B17/320068 ,  A61B17/06166 ,  A61B2017/320072 ,  A61B2017/320084

Abstract: In an arthroendoscopical surgical method, a resection target area, and a freshening treatment area which becomes repair surfaces with bleeding, are identified, and a resection line and a freshening line are drawn on a tear site in a meniscus, which is emphasized by fluorescence with use of a fluorescent medicine under excitation light. Using an ultrasonic treatment tool and an arthroscope, the resection target area is resected by a probe which generates ultrasonic vibrations, based on the resection line and freshening line under visible-light illumination. Thus, an inclined resection surface is formed, and planar repair surfaces with bleeding are joined and repaird.

公开(公告)号：US20160007839A1

公开(公告)日：2016-01-14

申请号：US14862574

申请日：2015-09-23

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA

IPC: A61B1/06 ,  A61B1/00 ,  A61B1/07 ,  A61B5/042 ,  A61B1/313 ,  A61B1/04 ,  A61B5/00

CPC classification number: A61B1/0676 ,  A61B1/00009 ,  A61B1/00045 ,  A61B1/00055 ,  A61B1/04 ,  A61B1/06 ,  A61B1/07 ,  A61B1/3137 ,  A61B5/0086 ,  A61B5/042 ,  A61B5/066 ,  A61B5/6851 ,  A61B5/6852 ,  A61B5/7285 ,  A61B2017/00243 ,  A61B2090/364 ,  A61B2090/3945

Abstract: Provided is an endoscope system including a light source device that outputs signal light that penetrates tissue within a living body; a narrow medical instrument that is inserted into a blood vessel and whose distal end has an emission window from which the signal light supplied from the light source device is emitted; an endoscope that is inserted into the living body and has an imager, which obtains an optical image by acquiring an image of the living body, and a detector, which detects the signal light emitted from the emission window; and an image processor that generates a composite image by combining the optical image with a marker that indicates a position of the signal light.

Abstract translation: 本发明提供一种内窥镜系统，其具备：输出穿过生物体内的组织的信号光的光源装置; 狭窄的医疗器械插入到血管中，其远端具有从该光源装置供给的信号光从该发射窗口发射的发射窗口; 插入到生物体中并具有通过获取生物体的图像获得光学图像的成像器的内窥镜和检测从发射窗口发出的信号光的检测器; 以及图像处理器，其通过将光学图像与指示信号光的位置的标记组合来生成合成图像。

公开(公告)号：US20150085169A1

公开(公告)日：2015-03-26

申请号：US14557271

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Noriyuki FUJIMORI ,  Kazuhiro YOSHIDA

IPC: H04N5/335 ,  H04N5/225

CPC classification number: H01L27/14698 ,  H01L23/3121 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/335 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种图像拾取装置的制造方法，其特征在于，包括以下步骤：切割摄像芯片基板，在每个所述光接收部分周围形成电极焊盘，制作摄像芯片; 将作为无缺陷产品确定的图像拾取芯片接合到玻璃晶片以制造接合晶片的工艺; 在接合晶片上的图像拾取芯片之间填充密封构件的过程; 一种加工工艺，其包括使连接的晶片的厚度变薄以使加工表面变平且形成通孔互连，每个连接到每个电极焊盘; 形成多个外部连接电极的过程，每个外部连接电极通过每个通孔互连连接到每个电极焊盘; 以及切割接合的晶片的过程。