公开(公告)号：US20190082944A1

公开(公告)日：2019-03-21

申请号：US16181445

申请日：2018-11-06

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI

IPC: A61B1/05 ,  G02B23/24 ,  A61B1/00 ,  A61B1/045 ,  A61B1/06

Abstract: An image pickup unit includes a first element with a first flat glass, a second element with a second flat glass, a first spacer configured to define a distance between the first element and the second element, an image pickup device, and a second spacer configured to define a distance between the second element and the image pickup device, wherein no resin lens is disposed on a light incidence surface of the first flat glass, a resin lens with a negative power is disposed on a surface opposing the light incidence surface, a resin lens with a positive power is disposed on a second flat glass, the image pickup unit has side surfaces covered with a sealing member composed of an inorganic material, a brightness aperture is disposed between the first element and the second element, and an path space is a sealed space.

公开(公告)号：US20180303325A1

公开(公告)日：2018-10-25

申请号：US15958063

申请日：2018-04-20

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI

IPC: A61B1/05 ,  A61B1/00 ,  A61B1/005

CPC classification number: A61B1/051 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/0057 ,  A61B1/04 ,  G02B23/24

Abstract: An endoscope includes an insertion portion that includes a distal end portion and a bending portion configured to change a direction of the distal end portion . The distal end portion includes a casing having a round shape in a cross-section, and an image pickup module that includes an optical module section including a plurality of optical members and an image pickup section, the image pickup module having a rectangular shape in a cross-section, and the image pickup section includes an image pickup device and a semiconductor stack in which a plurality of semiconductor devices is stacked, and entirety of the image pickup module is completely housed inside the casing.

公开(公告)号：US20180049627A1

公开(公告)日：2018-02-22

申请号：US15794039

申请日：2017-10-26

Applicant: OLYMPUS CORPORATION

Inventor： Satoru ADACHI ,  Noriyuki FUJIMORI ,  Takatoshi IGARASHI

IPC: A61B1/05 ,  G02B23/24 ,  G02B23/26 ,  H04N5/30

CPC classification number: A61B1/05 ,  A61B1/00114 ,  A61B1/00188 ,  A61B1/051 ,  G02B23/2407 ,  G02B23/2423 ,  G02B23/2469 ,  G02B23/2484 ,  G02B23/26 ,  G03B17/02 ,  H01L27/14634 ,  H04N5/30 ,  H04N5/379 ,  H04N2005/2255

Abstract: An imaging unit includes: an image sensor configured to generate an image signal by receiving light and performing photoelectric conversion; and a relay member including a plurality of silicon substrates laminated on a back surface side of the image sensor opposite to a light receiving surface of the image sensor, planar type electronic devices being formed on the silicon substrates, and relay the image sensor and a signal cable that transmits the image signal. The relay member includes a multilayer wiring layer laminated on an outermost surface of the silicon substrate, and the multilayer wiring layer includes, on an outermost surface, a material allowing the signal cable to be connected.

公开(公告)号：US20160209637A1

公开(公告)日：2016-07-21

申请号：US15082375

申请日：2016-03-28

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI

IPC: G02B23/24 ,  H04N5/225 ,  H04N5/374 ,  H04N7/18

CPC classification number: G02B23/2484 ,  A61B1/051 ,  G02B23/2423 ,  G02B23/2476 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/374 ,  H04N7/183 ,  H04N2005/2255

Abstract: An imaging module includes: a first chip having a light-receiving unit; a flexible printed board connected to an electrode pad of the first chip via an inner lead extended from one end of the flexible printed board; a second chip having a transmission buffer on the flexible printed board; an image signal cable configured to output an image signal; and a drive signal cable configured to input a drive signal. The first and second chips constitute a CMOS imager. The image signal output from the first chip is amplified by the second chip. The flexible printed board includes two or more regions divided by bending the flexible printed board at a bending part arranged parallel to an optical axis direction of the imaging module. The second chip and the drive signal cable are connected to different regions of the flexible printed board.

Abstract translation: 一种成像模块包括：具有光接收单元的第一芯片; 柔性印刷电路板，其经由从所述柔性印刷电路板的一端延伸的内引线连接到所述第一芯片的电极焊盘; 在柔性印刷电路板上具有发送缓冲器的第二芯片; 图像信号电缆，被配置为输出图像信号; 以及配置为输入驱动信号的驱动信号电缆。 第一和第二芯片构成CMOS成像器。 从第一芯片输出的图像信号被第二芯片放大。 柔性印刷电路板包括通过在与成像模块的光轴方向平行设置的弯曲部弯曲柔性印刷电路板而分割的两个或更多个区域。 第二芯片和驱动信号电缆连接到柔性印刷电路板的不同区域。

公开(公告)号：US20150087088A1

公开(公告)日：2015-03-26

申请号：US14557157

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Takatoshi IGARASHI ,  Kazuhiro YOSHIDA

IPC: H01L25/00 ,  H01L21/78 ,  H01L21/66 ,  H01L27/146

CPC classification number: H01L25/50 ,  H01L21/78 ,  H01L21/786 ,  H01L22/10 ,  H01L22/20 ,  H01L23/3121 ,  H01L27/14618 ,  H01L27/14638 ,  H01L27/14687 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes processes of: cutting an image pickup chip substrate to fabricate a plurality of image pickup chips; bonding the image pickup chips to a glass wafer via a transparent adhesive layer as well as bonding dummy chips to an outer peripheral region of the glass wafer where the image pickup chips are not bonded to fabricate a joined wafer; filling a sealing member between the image pickup chips and the dummy chips; machining the joined wafer to thin a thickness; and cutting the joined wafer.

Abstract translation: 一种图像拾取装置的制造方法，包括以下处理：切割图像拾取芯片基板以制造多个图像拾取芯片; 通过透明粘合剂层将图像拾取芯片接合到玻璃晶片，以及将虚拟芯片接合到不结合图像拾取芯片的玻璃晶片的外周区域以制造接合的晶片; 在图像拾取芯片和虚拟芯片之间填充密封构件; 加工接合的晶片以使厚度变薄; 并切割接合的晶片。

公开(公告)号：US20140346322A1

公开(公告)日：2014-11-27

申请号：US14456560

申请日：2014-08-11

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Kazuaki KOJIMA

IPC: H04N5/335 ,  B32B37/14 ,  B32B38/10

CPC classification number: A61B1/0011 ,  A61B1/00096 ,  A61B1/00163 ,  A61B1/051 ,  B32B37/14 ,  B32B38/10 ,  G02B7/02 ,  G02B13/0035 ,  G02B13/006 ,  G02B13/0065 ,  G02B13/007 ,  G02B13/0085 ,  G02B23/243 ,  H01L27/14643 ,  H01L27/14687 ,  H04N5/2254 ,  H04N5/335 ,  Y10T156/1052

Abstract: A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units.

Abstract translation: 一种光学单元的制造方法，其特征在于，具有：形成有多个透镜单元的透镜单元晶片的多个透镜晶片的形成工序; 将包括多个弯曲光学元件的弯曲光学元件晶片接合到透镜单元晶片的第一表面的步骤，使得多个弯曲光学元件分别与多个透镜单元相对并形成光学单元晶片; 以及对于每个透镜单元和弯曲光学元件分离和个体化光学单元晶片并制造多个光学单元的步骤。

公开(公告)号：US20140179999A1

公开(公告)日：2014-06-26

申请号：US14192148

申请日：2014-02-27

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Noriyuki FUJIMORI ,  Yukiharu MAKINO

IPC: A61B1/04 ,  A61B1/06 ,  A61B1/00

CPC classification number: A61B1/041 ,  A61B1/00016 ,  A61B1/00032 ,  A61B1/0661

Abstract: A capsule endoscope includes a capsule type housing and a circuit board on which a plurality of board sections are arranged in a row, the circuit board being housed inside the housing in a bent state. Connection electrodes for electronic component mounting are not formed on a second principal plane of the circuit board.

Abstract translation: 胶囊型内窥镜包括：胶囊型壳体和电路基板，多个基板部分排列成一列，电路板以弯曲状态容纳在壳体内。 用于电子元件安装的连接电极不形成在电路板的第二主平面上。

公开(公告)号：US20180041671A1

公开(公告)日：2018-02-08

申请号：US15785525

申请日：2017-10-17

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H04N5/2253 ,  G02B23/24 ,  G02B23/2484 ,  H01L27/14 ,  H01L27/14618 ,  H01L27/14636 ,  H04N5/225 ,  H04N5/335

Abstract: An image pickup apparatus includes: an image pickup device including: a light receiving section configured to receive light entering from a light receiving surface; and a plurality of convex electrodes disposed on an opposing surface; an optical system configured to condense the light on the light receiving section; and a wiring board including a plurality of bonded terminals on a main surface, the plurality of bonded terminals respectively bonded to the plurality of convex electrodes, wherein the plurality of convex electrodes are not arranged in a light receiving section facing region that faces a region provided with the light receiving section.

公开(公告)号：US20170311785A1

公开(公告)日：2017-11-02

申请号：US15650267

申请日：2017-07-14

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI

IPC: A61B1/05 ,  G02B23/24 ,  A61B1/04

CPC classification number: A61B1/05 ,  A61B1/04 ,  G02B23/243

Abstract: An endoscope includes in a distal end portion of an insertion portion, an image pickup apparatus which includes an image pickup device including a semiconductor substrate in which an image pickup section is formed on a first principal surface, the semiconductor substrate including a bonding terminal on a second principal surface, and a wiring layer that is placed on the first principal surface of the semiconductor substrate and includes a conductor layer stacked via insulating layers, and a cover glass that is bonded in such a manner as to cover an entire side of the first principal surface of the image pickup device, the endoscope including a protection section that covers at least a side surface of the wiring layer of the image pickup device, the protection section including a resin in which blocking particles are dispersed, the blocking particles having lower moisture permeability than moisture permeability of the resin.

公开(公告)号：US20150190040A1

公开(公告)日：2015-07-09

申请号：US14666699

申请日：2015-03-24

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Noriyuki FUJIMORI

IPC: A61B1/05 ,  H01L31/0203 ,  H01L27/146

CPC classification number: A61B1/051 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/13

Abstract: An image pickup apparatus includes a substrate, on a first surface of which a light receiving section and a peripheral circuit section are formed, a multilayer wiring layer stacked on the first surface and including a plurality of metal layers and insulating layers, a translucent cover located on the multilayer wiring layer, and a side surface sealing member which extends from a peripheral section of a surface in the translucent cover to the substrate side while having a frame shape, and protects outer peripheral side surfaces of the multilayer wiring layer.

Abstract translation: 一种图像拾取装置，包括在其第一表面上形成有光接收部分和外围电路部分的基板，堆叠在第一表面上并包括多个金属层和绝缘层的多层布线层，位于 在多层布线层以及从透光性盖的表面的周边部分延伸到基板侧同时具有框架形状的侧表面密封件，并且保护多层布线层的外周侧表面。