公开(公告)号：US11000184B2

公开(公告)日：2021-05-11

申请号：US16656788

申请日：2019-10-18

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Takahiro Shimohata ,  Takuro Suyama

IPC: A61B1/005 ,  A61B1/05 ,  A61B1/00 ,  G06T7/00 ,  G02B23/24 ,  H01L27/146 ,  H04N5/225 ,  A61B1/06

Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.

公开(公告)号：US10734355B2

公开(公告)日：2020-08-04

申请号：US15851900

申请日：2017-12-22

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama

IPC: H01L25/065 ,  H01L23/12 ,  A61B1/05 ,  H01L23/13 ,  H01L23/14 ,  H01L21/3065 ,  H01L21/48 ,  H01L21/52 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L25/10 ,  H01L25/00 ,  H01L23/538

Abstract: An electronic circuit board includes: electronic components; a silicon board that is plate shaped, includes a wiring pattern provided on at least one of a surface and a reverse surface thereof, and includes recessed portions where the electronic components are individually mounted; and a supporting board that is layered over the reverse surface of the silicon board, and includes a wiring pattern provided on at least one of a surface and a reverse surface thereof. Side faces of the recessed portions are perpendicular to the surface of the silicon board, the wiring pattern is connected to at least one of the electronic components mounted in the recessed portions, via at least one of a via and a bottom surface electrode provided in of the at least one of the recessed portions, and the recessed portions penetrate through the silicon board.

公开(公告)号：US20200054202A1

公开(公告)日：2020-02-20

申请号：US16662882

申请日：2019-10-24

Applicant: Olympus Corporation

Inventor： Ken Yamamoto ,  Takuro Suyama

IPC: A61B1/05 ,  H04N5/225 ,  A61B1/00

Abstract: An endoscope system includes an endoscope having an insertion portion. The endoscope is attached to the proximal end of the insertion portion. An image capturing module is attached to the distal-end portion of an insertion portion. The image capturing module includes a wiring board having a principal surface including first electrodes and second electrodes disposed thereon. An image capturing element includes respective photodetection and reverse surfaces. The reverse surface includes external electrodes and is connected to the first electrodes on the wiring board. A prism having an entrance surface to which light is applied, a reflection surface, and an exit surface in which the exit surface being bonded to the photodetection surface of the image capturing element. A support member is used to support the prism. A layered element including a plurality of elements is layered together and having an upper surface, a lower surface with element electrodes disposed thereon.

公开(公告)号：US20230029662A1

公开(公告)日：2023-02-02

申请号：US17957305

申请日：2022-09-30

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama

IPC: A61B1/00 ,  A61B1/05

Abstract: An imaging module includes an imager having an optical member on a light receiving surface, an electronic component having a front surface facing the same direction as the one to which an incidence surface of the optical member faces, a resin portion that has a first surface flush with the incidence surface of the optical member and the front surface of the electronic component, and a second surface that is a surface on a side opposite to the first surface while having the imager and the electronic component being embedded therein such that the incidence surface and the front surface are exposed to the first surface, an external connection terminal provided on the second surface, and a through wiring that extends through the resin portion to connect at least one of the imager and the electronic component with the external connection terminal.

公开(公告)号：US11540707B2

公开(公告)日：2023-01-03

申请号：US16662362

申请日：2019-10-24

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama ,  Takatoshi Igarashi

IPC: A61B1/05 ,  A61B1/00 ,  H01L23/00 ,  H01L27/146

Abstract: An endoscope includes an image pickup module, and the image pickup module includes: an image pickup device an external electrode being disposed on a back surface of the image pickup device; a wiring element provided with a through-hole passing through a first main surface and a second main surface, a first electrode on the first main surface being bonded with the external electrode; a signal cable bonded with a second electrode on the second main surface of the wiring element; and a first resin that seals a first bump bonding the first electrode and the external electrode and a second bump bonding the second electrode and the signal cable, and fills the through-hole.

公开(公告)号：US11287641B2

公开(公告)日：2022-03-29

申请号：US17128304

申请日：2020-12-21

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama

IPC: G02B23/24 ,  A61B1/00 ,  A61B1/04 ,  H01L27/146 ,  H04N5/225 ,  H04N5/38

Abstract: An image pickup apparatus includes an image pickup member and a laminated optical member that is fixed in frame-shaped fixed areas around respective optical path areas. The fixed areas include a first area and a second area. A width of the first area is greater than a width of the second area. In the laminated optical member, an optical surface central axis deviates from an optical axis toward the first area. In the image pickup member, an image pickup surface central axis that is a central axis of a first main surface deviates from the optical axis.

公开(公告)号：US11134829B2

公开(公告)日：2021-10-05

申请号：US16118865

申请日：2018-08-31

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama

IPC: A61B1/00 ,  A61B1/04 ,  A61B1/05 ,  H01L23/498 ,  H01L23/00 ,  H01L27/146

Abstract: An image pickup apparatus includes an image pickup device including a wiring connecting a first electrode on a light receiving surface and a second electrode on a rear surface, a first wiring board including a distal end surface, from which a flying lead protrudes, arranged to oppose the rear surface of the image pickup device, a second wiring board including a second main surface to which an upper surface of the first wiring board is made to adhere and including a distal end surface arranged to oppose the rear surface, in which the flying lead is bent and bonded to the second electrode, and a sealing member sealing a bonding section between the second electrode and the flying lead and an adhesion member that makes the distal end surface of the second wiring board and the rear surface adhere to each other are composed of integral curable resin.

公开(公告)号：US10660511B2

公开(公告)日：2020-05-26

申请号：US16416522

申请日：2019-05-20

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama ,  Takatoshi Igarashi ,  Kensuke Suga ,  Yoshiro Nishimura

IPC: A61B1/04 ,  A61B1/05 ,  H01L23/00 ,  A61B1/00 ,  A61B1/045 ,  H01L23/31 ,  H04N5/225 ,  G02B23/24 ,  H01L27/146 ,  H01L23/48 ,  H01L23/538 ,  H04N5/369 ,  H01L21/768

Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.

公开(公告)号：US10381393B2

公开(公告)日：2019-08-13

申请号：US15241741

申请日：2016-08-19

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama ,  Takahiro Shimohata

IPC: H01L27/146 ,  H01L31/0203 ,  H01L31/02 ,  H04N5/335 ,  H05K1/02 ,  H04N5/225 ,  H05K3/00 ,  H05K3/36

Abstract: An image pickup apparatus is an image pickup apparatus including: an image pickup device including a plurality of electrode pads provided in a row on an outer peripheral portion of a light-receiving surface on which a light-receiving section is formed, the plurality of electrode pads being connected to the light-receiving section; and a wiring board including a plurality of inner leads connected to respective electrode pads, wherein each of the inner leads includes a distal end portion, a bent portion and a rear end portion, the distal end portion is connected to the corresponding electrode pad, the bent portion includes a first bent portion having a recess shape relative to the light-receiving surface and a second bent portion having a protruding shape relative to the light-receiving surface, and the rear end portion is disposed in parallel with a side face of the image pickup device.