公开(公告)号：US10321081B2

公开(公告)日：2019-06-11

申请号：US15873240

申请日：2018-01-17

Applicant: OLYMPUS CORPORATION

Inventor： Nobuyuki Watanabe ,  Toru Kondo ,  Kosei Tamiya

IPC: H04N5/3745 ,  H04N5/378 ,  H01L27/146 ,  H04N5/345

Abstract: A solid-state imaging device includes n first photoelectric conversion elements configured to photoelectrically convert incident light, n first reading circuits configured to output corresponding first pixel signals, m second photoelectric conversion elements configured to photoelectrically convert incident light, m second reading circuits configured to sequentially output corresponding second pixel signals, and a reading control circuit, wherein each of the second reading circuits includes a detection circuit configured to output an event signal when a change in a second charge signal is detected and a pixel signal generation circuit configured to add address information to an event signal, and the reading control circuit causes the first pixel signal to be output by determining a reading region corresponding to address information, and n and m are natural numbers greater than or equal to 2.

公开(公告)号：US10312282B2

公开(公告)日：2019-06-04

申请号：US15788026

申请日：2017-10-19

Applicant: OLYMPUS CORPORATION

Inventor： Toru Kondo

IPC: H01L31/00 ,  H01L27/146 ,  H01L23/60 ,  H01L23/00 ,  H01L27/02

Abstract: A solid-state imaging device includes a first substrate, a second substrate, an electrode portion, a first substrate connecting portion, an electrostatic protection circuit, and a second substrate connecting portion. A photoelectric conversion element is disposed on the first substrate. A part of the peripheral circuit is arranged on the second substrate. The electrode portion has a connection surface. The first substrate connecting portion electrically connects the electrode portion and the second substrate. The electrostatic protection circuit is connected to a circuit between the first substrate connecting portion and the peripheral circuit. The second substrate connecting portion electrically connects the peripheral circuit and the photoelectric conversion element. The electrostatic protection circuit is disposed at a position such that the electrostatic protection circuit does not overlap any of the first substrate connecting portion and the second substrate connecting portion.

公开(公告)号：US20160344958A1

公开(公告)日：2016-11-24

申请号：US15226418

申请日：2016-08-02

Applicant: OLYMPUS CORPORATION

Inventor： Toru Kondo ,  Nobuyuki Watanabe

IPC: H04N5/361 ,  H04N5/232 ,  H04N5/378

CPC classification number: H04N5/361 ,  H04N5/23212 ,  H04N5/235 ,  H04N5/345 ,  H04N5/378

Abstract: A solid-state imaging device includes a plurality of pixels in which photoelectric conversion units that generate signal charges are arranged in a matrix, a plurality of first charge accumulation circuits that hold the signal charges and output the signal charges as a first pixel signal, a plurality of charge transfer circuits that transfer the signal charges to the first charge accumulation circuit, and a plurality of second charge accumulation circuits that hold signal charges based on the signal charges generated by the photoelectric conversion units and output the signal charges as a second pixel signal in which the number of pixels is reduced to a predetermined number, and the charge transfer circuit transfers the signal charges in the same exposure period to the second charge accumulation circuit when transferring the signal charges of the same exposure to the first charge accumulation circuit.

Abstract translation: 固态成像装置包括多个像素，其中产生信号电荷的光电转换单元以矩阵形式排列;多个第一电荷累积电路，其将信号充电并输出信号电荷作为第一像素信号， 多个电荷转移电路，其将信号电荷传送到第一电荷累积电路;以及多个第二电荷累积电路，其基于由光电转换单元生成的信号电荷来保持信号电荷，并输出信号电荷作为第二像素信号 其中像素数减少到预定数量，并且当将相同曝光的信号电荷转移到第一电荷累积电路时，电荷转移电路将相同曝光周期中的信号电荷传送到第二电荷累积电路。

公开(公告)号：US09153616B2

公开(公告)日：2015-10-06

申请号：US13727256

申请日：2012-12-26

Applicant: OLYMPUS CORPORATION

Inventor： Toru Kondo

IPC: H04N5/374 ,  H01L27/146 ,  H04N5/335

CPC classification number: H01L27/14634 ,  H01L27/14636 ,  H04N5/374

Abstract: In the solid-state imaging device, first and second substrates are electrically connected to each other via connectors electrically connecting the first and second substrates. A photoelectric conversion element is disposed in the first substrate. A read circuit is disposed in the second substrate and reads a signal generated by the photoelectric conversion element and transmitted via the connector. In a signal processing circuit including elements or circuits performing signal processing on the read signal, some of the elements or circuits are disposed in the first substrate, the remaining elements or circuits are disposed in the second substrate, and the elements or circuits disposed in the first and second substrates are electrically connected to each other via the connector.

Abstract translation: 在固态成像装置中，第一和第二基板通过电连接第一和第二基板的连接器彼此电连接。 光电转换元件设置在第一基板中。 读取电路设置在第二基板中，并读取由光电转换元件产生的信号并通过连接器传输。 在包括对读取信号执行信号处理的元件或电路的信号处理电路中，一些元件或电路设置在第一基板中，其余元件或电路设置在第二基板中，并且设置在第二基板中的元件或电路 第一和第二基板经由连接器彼此电连接。

公开(公告)号：US20130126710A1

公开(公告)日：2013-05-23

申请号：US13677952

申请日：2012-11-15

Applicant: Olympus Corporation

Inventor： Toru Kondo

IPC: H01L27/146

CPC classification number: H01L27/14609 ,  H01L27/14634 ,  H01L27/14636 ,  H04N5/369

Abstract: A solid-state imaging device and an imaging device are capable of transferring a control signal to pixels formed in each chip of the solid-state imaging device, in which the plurality of chips are connected to each other, without an increase in a circuit size of the solid-state imaging device or an increase in the number of connectors between the chips. The solid-state imaging device, in which first and second substrates are electrically connected to each other via the connectors, includes a pixel unit in which a plurality of pixels each including a photoelectric conversion element disposed in the first substrate and a reading circuit disposed in the second substrate are arrayed two-dimensionally, and a read control circuit that controls reading of a signal from the pixels. The read control circuit includes a pulse generation unit and a logical unit.

Abstract translation: 固态成像装置和成像装置能够将控制信号传送到固态成像装置的每个芯片中形成的像素，其中多个芯片彼此连接，而不增加电路尺寸 的固态成像装置或芯片之间的连接器数量的增加。 其中第一和第二基板经由连接器彼此电连接的固态成像装置包括像素单元，其中包括设置在第一基板中的光电转换元件和设置在第一基板中的读取电路的多个像素 第二基板二维排列，以及读取控制电路，其控制来自像素的信号的读取。 读取控制电路包括脉冲产生单元和逻辑单元。

公开(公告)号：US20180226441A1

公开(公告)日：2018-08-09

申请号：US15944258

申请日：2018-04-03

Applicant: OLYMPUS CORPORATION

Inventor： Toru Kondo

IPC: H01L27/146 ,  H04N5/378 ,  H04N5/374

CPC classification number: H01L27/14612 ,  H01L27/146 ,  H01L27/14605 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14643 ,  H04N5/374 ,  H04N5/378 ,  H04N5/379

Abstract: A solid-state imaging device includes a first semiconductor substrate including a pixel array unit, a second semiconductor substrate stacked on a surface of a side opposite to a side on which light is incident in the first semiconductor substrate and on which a pixel control circuit and a reading circuit are arranged, and a plurality of connection electrodes configured to electrically connect pixel control signal lines between the first semiconductor substrate and the second semiconductor substrate, wherein the connection electrodes electrically connect pixel control signal lines within a pixel immediate region which overlaps a region where the pixel array unit is arranged in the first semiconductor substrate, and the pixel control circuit is arranged along an edge of the pixels in either one of a row direction and a column direction arranged in the pixel array unit in the pixel immediate region.

公开(公告)号：US20180167575A1

公开(公告)日：2018-06-14

申请号：US15873240

申请日：2018-01-17

Applicant: OLYMPUS CORPORATION

Inventor： Nobuyuki Watanabe ,  Toru Kondo ,  Kosei Tamiya

IPC: H04N5/3745 ,  H04N5/378

CPC classification number: H04N5/3745 ,  H01L27/146 ,  H04N5/3454 ,  H04N5/37452 ,  H04N5/378

Abstract: A solid-state imaging device includes n first photoelectric conversion elements configured to photoelectrically convert incident light, n first reading circuits configured to output corresponding first pixel signals, m second photoelectric conversion elements configured to photoelectrically convert incident light, m second reading circuits configured to sequentially output corresponding second pixel signals, and a reading control circuit, wherein each of the second reading circuits includes a detection circuit configured to output an event signal when a change in a second charge signal is detected and a pixel signal generation circuit configured to add address information to an event signal, and the reading control circuit causes the first pixel signal to be output by determining a reading region corresponding to address information, and n and m are natural numbers greater than or equal to 2.

公开(公告)号：US09906746B2

公开(公告)日：2018-02-27

申请号：US15333700

申请日：2016-10-25

Applicant: OLYMPUS CORPORATION

Inventor： Toru Kondo

IPC: H04N5/232 ,  H01L27/146 ,  H04N5/3745 ,  H04N5/378

CPC classification number: H04N5/3745 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H04N5/23241 ,  H04N5/23245 ,  H04N5/23254 ,  H04N5/378

Abstract: A solid-state image pickup device includes: a first substrate which has a pixel part divided into a plurality of groups obtained by dividing a plurality of pixels arranged in a two-dimensional matrix into groups corresponding to each of a plurality of predetermined rows; and a second substrate including a pixel load current source corresponding to a vertical signal line to which the plurality of pixels disposed in the same column within the groups are connected, a column circuit that performs a predetermined process on a pixel signal which is output from the pixel to a corresponding vertical signal line, and a pixel for correction that outputs a pixel signal for correction for correcting the corresponding column circuit to the vertical signal line to which the corresponding column circuit is connected, for each column of the pixels belonging to the group.

公开(公告)号：US09819885B2

公开(公告)日：2017-11-14

申请号：US15226449

申请日：2016-08-02

Applicant: OLYMPUS CORPORATION

Inventor： Eiji Furukawa ,  Toru Kondo

IPC: H04N5/3745 ,  H04N5/347 ,  H03M1/12 ,  H03M1/56 ,  H04N5/378 ,  H04N9/04 ,  H04N5/355

CPC classification number: H04N5/37455 ,  H03M1/123 ,  H03M1/56 ,  H04N5/347 ,  H04N5/3559 ,  H04N5/37452 ,  H04N5/37457 ,  H04N5/378 ,  H04N9/045 ,  H04N2209/045

Abstract: A solid-state imaging device includes a pixel signal processing unit including a plurality of pixels; a plurality of first charge storage circuits which are configured to hold the first signal charges generated by the photoelectric conversion units and output first signal voltages as first pixel signals; and a plurality of second charge storage circuits which are configured to hold second signal charges and output second signal voltages, and a differential analog/digital conversion unit includes: a plurality of first differential calculation units; a plurality of first analog/digital conversion units which are configured to perform analog/digital conversion to the first differential pixel signals and output digital values indicating magnitudes of the first differential pixel signals; and a plurality of second analog/digital conversion units which are configured to perform analog/digital conversion to the second pixel signal and output digital values indicating magnitudes of the second pixel signals.

公开(公告)号：US20170041565A1

公开(公告)日：2017-02-09

申请号：US15333700

申请日：2016-10-25

Applicant: OLYMPUS CORPORATION

Inventor： Toru Kondo

IPC: H04N5/3745 ,  H04N5/378 ,  H04N5/232 ,  H01L27/146

CPC classification number: H04N5/3745 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H04N5/23241 ,  H04N5/23245 ,  H04N5/23254 ,  H04N5/378

Abstract: A solid-state image pickup device includes: a first substrate which has a pixel part divided into a plurality of groups obtained by dividing a plurality of pixels arranged in a two-dimensional matrix into groups corresponding to each of a plurality of predetermined rows; and a second substrate including a pixel load current source corresponding to a vertical signal line to which the plurality of pixels disposed in the same column within the groups are connected, a column circuit that performs a predetermined process on a pixel signal which is output from the pixel to a corresponding vertical signal line, and a pixel for correction that outputs a pixel signal for correction for correcting the corresponding column circuit to the vertical signal line to which the corresponding column circuit is connected, for each column of the pixels belonging to the group.

Abstract translation: 一种固态图像拾取装置，包括：第一衬底，其具有被划分为多个组的像素部分，所述多个组通过将以二维矩阵排列的多个像素分成与多个预定行中的每一个对应的组; 以及第二基板，其包括与设置在所述组内的同一列中的所述多个像素连接的垂直信号线相对应的像素负载电流源，对从所述组中输出的像素信号执行预定处理的列电路， 像素到对应的垂直信号线，以及用于校正的像素，其针对属于该组的像素的每列输出用于校正相应列电路的像素信号到与其相关联的列电路相连的垂直信号线 。