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    Interconnect layer contact and method for improved packaged integrated circuit reliability
    11.
    发明授权
    Interconnect layer contact and method for improved packaged integrated circuit reliability 有权

    公开(公告)号：US10892290B2

    公开(公告)日：2021-01-12

    申请号：US15937742

    申请日：2018-03-27

    Applicant: OmniVision Technologies, Inc.

    Inventor： Yin Qian ,  Chia-Chun Miao ,  Ming Zhang ,  Dyson H. Tai

    IPC: H01L27/146 ,  H01L23/48 ,  H01L23/522 ,  H01L23/00 ,  H01L21/768 ,  H01L23/528 ,  H01L23/532 ,  H01L21/288 ,  H01L21/3213

    Abstract: Packaged photosensor ICs are made by fabricating an integrated circuit (IC) with multiple bondpads; forming vias from IC backside through semiconductor to expose a first layer metal; depositing conductive metal plugs in the vias; depositing interconnect metal; depositing solder-mask dielectric over the interconnect metal and openings therethrough; forming solder bumps on interconnect metal at the openings in the solder-mask dielectric; and bonding the solder bumps to conductors of a package. The photosensor IC has a substrate; multiple metal layers separated by dielectric layers formed on a first surface of the substrate into which transistors are formed; multiple bondpad structures formed of at least a first metal layer of the metal layers; vias with metal plugs formed through a dielectric over a second surface of the semiconductor substrate, interconnect metal on the dielectric forming connection shapes, and shapes of the interconnect layer coupled to each conductive plug and to solder bumps.

    Chip Scale Package for An Image Sensor
    13.
    发明申请
    Chip Scale Package for An Image Sensor 审中-公开

    公开(公告)号：US20190140005A1

    公开(公告)日：2019-05-09

    申请号：US15806522

    申请日：2017-11-08

    Applicant: OmniVision Technologies, Inc.

    Inventor： Yin Qian ,  Chen-Wei Lu ,  Jin Li ,  Chia-Chun Miao ,  Ming Zhang ,  Dyson Tai

    IPC: H01L27/146

    Abstract: A chip scale package (CSP) structure for an image sensor comprises an image sensor chip, wherein the image sensor chip comprises a semiconductor substrate having a top surface to receive light, a plurality of color filters disposed over the top surface, and a plurality of micro lenses disposed on the plurality of color filters. A low refractive index material is disposed over the image sensor chip, wherein the low refractive index material covers the plurality of micro lenses, and wherein a refractive index of the low refractive index material is lower than a refractive index of the plurality of micro lenses. A cover glass is disposed directly on the low refractive index material, wherein no air gap is between the cover glass and the low refractive index material, and between the low refractive index material and the image sensor chip. Therefore, the cover glass is fully supported by the low refractive index material without any dams.

    Edge reflection reduction
    14.
    发明授权
    Edge reflection reduction 有权

    公开(公告)号：US10211243B2

    公开(公告)日：2019-02-19

    申请号：US15945541

    申请日：2018-04-04

    Applicant: OmniVision Technologies, Inc.

    Inventor： Chia-Chun Miao ,  Yin Qian ,  Chao-Hung Lin ,  Chen-Wei Lu ,  Dyson H. Tai ,  Ming Zhang ,  Jin Li

    IPC: H01L31/0203 ,  H01L27/146

    Abstract: A method of image sensor package fabrication includes providing an image sensor, including a pixel array disposed in a semiconductor material, and a first transparent shield adhered to the semiconductor material. The pixel array is disposed between the semiconductor material and the first transparent shield. A light blocking layer is deposited and disposed between lateral edges of the pixel array and lateral edges of the first transparent shield, and a second transparent shield is placed on the image sensor package, where the light blocking layer is disposed between the first transparent shield and the second transparent shield.

    Flip-chip sample imaging devices with self-aligning lid
    18.
    发明授权
    Flip-chip sample imaging devices with self-aligning lid 有权

    公开(公告)号：US11195864B2

    公开(公告)日：2021-12-07

    申请号：US16290832

    申请日：2019-03-01

    Applicant: OmniVision Technologies, Inc.

    Inventor： Ming Zhang ,  Yin Qian ,  Chia-Chun Miao ,  Dyson H. Tai

    IPC: H01L27/146

    Abstract: A flip-chip sample imaging device with self-aligning lid includes an image sensor chip, a fan-out substrate, and a lid. The image sensor chip includes (a) a pixel array sensitive to light incident on a first side of the image sensor chip and (b) first electrical contacts disposed on the first side and electrically connected to the pixel array. The fan-out substrate is disposed on the first side, is electrically connected to the first electrical contacts, forms an aperture over the pixel array to partly define a sample chamber over the pixel array, and forms a first surface facing away from the first side. The lid is disposed on the first surface of the fan-out substrate, facing away from the first side, to further define the chamber. The lid includes an inner portion protruding into the aperture to align the lid relative to the fan-out substrate.

    System and method for protecting a liquid crystal display by controlling ion migration
    19.
    发明授权
    System and method for protecting a liquid crystal display by controlling ion migration 有权

    公开(公告)号：US10429699B2

    公开(公告)日：2019-10-01

    申请号：US15428307

    申请日：2017-02-09

    Applicant: OmniVision Technologies, Inc.

    Inventor： Christopher Morgan Walker ,  Libo Weng ,  Oray Orkun Cellek ,  Ming Zhang ,  Yin Qian ,  Dyson Hsin-Chih Tai ,  Regis Fan

    IPC: G02F1/1337 ,  G02F1/1333 ,  G02F1/1362 ,  G09G3/36

    Abstract: A liquid crystal display includes a display area and a border area at least partially surrounding the display area, where the display area displays images for viewing and the border area displays display-protection images, which are used to control ion migration in the liquid crystal layer. In a more particular embodiment, the border area displays a series of checkerboard pattern(s), where the checkerboard patterns can alternate between initial and inverted values. The display-protection images protect the liquid crystal display from migrating ions accumulating in particular regions of the pixel array and causing permanent defects in the display area. A liquid crystal display that includes a liquid crystal alignment layer having a plurality of liquid crystal alignment directions is also disclosed. The customized liquid crystal alignment director(s) over the border area promote ion migration away from the display area.

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