公开(公告)号：US09184206B1

公开(公告)日：2015-11-10

申请号：US14270309

申请日：2014-05-05

Applicant: OmniVision Technologies, Inc.

Inventor： Wei Zheng ,  Dyson Hsin-Chih Tai ,  Vincent Venezia

IPC: H01L21/00 ,  H01L27/146 ,  H01L21/762 ,  H01L21/768

CPC classification number: H01L21/762 ,  H01L21/76224 ,  H01L21/76829 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14603 ,  H01L27/14621 ,  H01L27/14636 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing a backside illuminated color image sensor includes (a) modifying the frontside of an image sensor wafer, having pixel arrays, to produce electrical connections to the pixel arrays, wherein the electrical connections extend depth-wise into the image sensor wafer from the frontside, and (b) modifying the backside of the image sensor wafer to expose the electrical connections.

Abstract translation: 一种用于制造背面照明彩色图像传感器的方法包括：（a）修改具有像素阵列的图像传感器晶片的前侧以产生与像素阵列的电连接，其中电连接从图像传感器晶片向深度方向延伸到图像传感器晶片中 （b）修改图像传感器晶片的背面以暴露电连接。

公开(公告)号：US20130033629A1

公开(公告)日：2013-02-07

申请号：US13650056

申请日：2012-10-11

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Wei Zheng ,  Hsin-Chih Tai ,  Yin Qian ,  Hongjun Li ,  Howard E. Rhodes

IPC: H04N5/335 ,  H04N5/225

CPC classification number: H04N5/361 ,  H01L27/1461 ,  H01L27/14634 ,  H01L27/1464 ,  H04N5/3745

Abstract: An imaging system capable of black level calibration includes an imaging pixel array, at least one black reference pixel, and peripheral circuitry. The imaging pixel array includes a plurality of active pixels each coupled to capture image data. The black reference pixel is coupled to generate a black reference signal for calibrating the image data. Light transmitting layers are disposed on a first side of a pixel array die including the imaging system and cover at least the imaging pixel array and the black reference pixel. A light shielding layer is disposed on the first side of the pixel array die and covers a portion of the light transmitting layers and the black reference pixel without covering the imaging pixel array.

Abstract translation: 能够进行黑电平校准的成像系统包括成像像素阵列，至少一个黑色参考像素和外围电路。 成像像素阵列包括多个有源像素，每个有源像素被耦合以捕获图像数据。 黑参考像素被耦合以产生用于校准图像数据的黑参考信号。 光透射层设置在包括成像系统的像素阵列管芯的第一侧，并且至少覆盖成像像素阵列和黑色参考像素。 遮光层设置在像素阵列管芯的第一侧上，并且覆盖透光层和黑色参考像素的一部分而不覆盖成像像素阵列。