公开(公告)号：US20200286873A1

公开(公告)日：2020-09-10

申请号：US16753809

申请日：2018-09-25

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  H01L21/66 ,  H01L21/683

Abstract: A light-emitting component may include an IC chip and an LED chip arranged on a top surface of the IC chip and electrically coupled thereto. The LED chip may be electrically controllable by means of the IC chip. The IC chip may have at least two electrical connecting surface on a bottom surface remote from the LED chip. The light-emitting component is electrically contactable and operable by means of the connecting surfaces.

公开(公告)号：US20200176948A1

公开(公告)日：2020-06-04

申请号：US16615452

申请日：2018-05-18

Applicant: OSRAM OLED GmbH

Inventor： Andreas Wojcik ,  Hubert Halbritter ,  Thomas Schwarz

IPC: H01S5/022 ,  H01S5/028 ,  H01S5/042

Abstract: A semiconductor laser component including a semiconductor chip arranged to emit laser radiation, a cladding that is electrically insulating and covers the semiconductor chip in places, and a bonding layer that electrically conductively connects the semiconductor chip to a first connection point, wherein the semiconductor chip includes a cover surface, a bottom surface, a first front surface, a second front surface, a first side surface and a second side surface, the first front surface is arranged to decouple the laser beam, the cladding covers the semiconductor chip at least in places on the cover surface, the second front surface, the first side surface and the second side surface, and the bonding layer on the cladding extends from the cover surface to the first connection point.

公开(公告)号：US12027817B2

公开(公告)日：2024-07-02

申请号：US17263811

申请日：2019-08-01

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schwarz ,  Jörg Sorg

IPC: H01S5/02326 ,  H01S5/00 ,  H01S5/0232 ,  H01S5/02335 ,  H01S5/0237 ,  H01S5/0238 ,  H01S5/024 ,  H01S5/028

CPC classification number: H01S5/02326 ,  H01S5/0087 ,  H01S5/0232 ,  H01S5/02335 ,  H01S5/0237 ,  H01S5/0238 ,  H01S5/02476 ,  H01S5/028

Abstract: The invention relates to a laser chip located between a first and a second electrically and thermally conductive component, wherein: a first lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the first component; the second lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the second component; the laser chip has a radiation side which is located between the components; the radiation side is arranged set back inwardly at a predefined distance from the first end faces of the components; and a radiation space, which extends from the radiation side of the laser chip to the first end faces of the components is formed between the first lateral surfaces of the two components and adjacent to the radiation side of the laser chip.

公开(公告)号：US11508884B2

公开(公告)日：2022-11-22

申请号：US17181458

申请日：2021-02-22

Applicant: OSRAM OLED GmbH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US11177248B2

公开(公告)日：2021-11-16

申请号：US16753809

申请日：2018-09-25

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L25/16 ,  H01L21/683 ,  H01L21/66 ,  H01L25/075 ,  H01L33/62

Abstract: A light-emitting component may include an IC chip and an LED chip arranged on a top surface of the IC chip and electrically coupled thereto. The LED chip may be electrically controllable by means of the IC chip. The IC chip may have at least two electrical connecting surface on a bottom surface remote from the LED chip. The light-emitting component is electrically contactable and operable by means of the connecting surfaces.

公开(公告)号：US20200350207A1

公开(公告)日：2020-11-05

申请号：US16758659

申请日：2018-10-25

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schwarz ,  Lutz Höppel ,  Thorsten Frank Baumheinrich ,  Jens Richter

IPC: H01L21/78 ,  H01L25/16

Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned. In a step F) separation trenches (6) are introduced between the electronic circuits, which extend from a side of the electronic circuits facing away from the carrier to the sacrificial layer and penetrate the thinned semiconductor substrate. In a step G) the sacrificial layer is removed in the region between the electronic circuits and the carrier.

公开(公告)号：US10686104B2

公开(公告)日：2020-06-16

申请号：US16240584

申请日：2019-01-04

Applicant: OSRAM OLED GMBH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.