公开(公告)号：US20150206819A1

公开(公告)日：2015-07-23

申请号：US14422294

申请日：2013-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Ichiryu ,  Seiichi Nakatani ,  Yoshihisa Yamashita

IPC: H01L23/34 ,  H01L23/50 ,  H01L23/28 ,  H01L21/56 ,  H01L21/768

CPC classification number: H01L23/34 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76877 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/50 ,  H01L24/19 ,  H01L24/96 ,  H01L33/52 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There is provided a method for manufacturing an electronic component package. The method comprises the steps: (i) forming a package precursor in which an electronic component is embedded in a sealing resin layer such that an electrode of the electronic component is exposed at a surface of the sealing resin layer; (ii) disposing a metal foil having a through-hole on the surface of the sealing resin layer such that the through-hole of the metal foil is positioned in an opposed relation to the electrode of the electronic component; and (iii) forming a metal plating layer on the metal foil, wherein the formation of the metal plating layer in the step (iii) is performed by a dry plating process and a subsequent wet plating process, whereby the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated with each other.

Abstract translation: 提供一种电子部件封装的制造方法。 该方法包括以下步骤：（i）形成封装前体，其中将电子部件嵌入到密封树脂层中，使得电子部件的电极在密封树脂层的表面露出; （ii）在密封树脂层的表面上设置具有通孔的金属箔，使得金属箔的通孔与电子部件的电极相对置; 和（iii）在金属箔上形成金属镀层，其中在步骤（iii）中形成金属镀层通过干式电镀工艺和随后的湿式电镀工艺进行，由此填充通孔 金属镀层和金属箔和金属镀层彼此一体化。