利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

23 条记录 (耗时 0.046 秒)

    Method and apparatus to form a reworkable seal on an electronic module
    12.
    发明授权
    Method and apparatus to form a reworkable seal on an electronic module 失效
    在电子模块上形成可再加工密封件的方法和装置

    公开(公告)号：US06955543B2

    公开(公告)日：2005-10-18

    申请号：US10604695

    申请日：2003-08-11

    申请人： Gaetano P. Messina ,  Patrick A. Coico ,  Lewis S. Goldmann ,  Richard F. Indyk ,  Vladimir Jambrih ,  Jeffrey A. Zitz

    发明人： Gaetano P. Messina ,  Patrick A. Coico ,  Lewis S. Goldmann ,  Richard F. Indyk ,  Vladimir Jambrih ,  Jeffrey A. Zitz

    IPC分类号： H01L21/50 ,  H01R12/00

    CPC分类号： H01L21/50

    摘要： A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.

    摘要翻译： 公开了一种在电子模块和盖子之间形成可再加工的压缩密封的系统和方法。 该系统和方法包括具有锥形边缘的电子模块，该锥形边缘被配置在限定电子模块的周边的边缘的至少一部分上，并且帽被配置有用于在其中接收电子模块的开口。 压缩密封件与盖一起设置并且被配置为围绕电子模块上的一个或多个芯片或其它电子部件，以在电子模块和盖之间形成密封。 多个侧装载器可操作地联接到盖并对准以接收电子模块上的锥形边缘。 每个侧装载器构造成接合锥形边缘并且向设置在电子模块和盖之间的压缩密封件提供足够的压缩力。

    Optical sensing method to place flip chips
    13.
    发明授权
    Optical sensing method to place flip chips 有权
    放置倒装芯片的光学感应方法

    公开(公告)号：US06278193B1

    公开(公告)日：2001-08-21

    申请号：US09206157

    申请日：1998-12-07

    申请人： Patrick A. Coico ,  James H. Covell

    发明人： Patrick A. Coico ,  James H. Covell

    IPC分类号： H01L23544

    CPC分类号： H01L24/81 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/81801 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14

    摘要： A method and structure for manufacturing semiconductor devices comprising providing a chip and a substrate, aligning the chip and the substrate, attaching the chip to the substrate and optionally verifying chip/substrate alignment, the aligning comprising providing at least one chip alignment mark on a first side of the chip (wherein the chip alignment mark corresponds to chip pads on a second side of the chip) and aligning the alignment mark with substrate pads on the substrate.

    摘要翻译： 一种用于制造半导体器件的方法和结构，包括提供芯片和衬底，对准芯片和衬底，将芯片连接到衬底并且可选地验证芯片/衬底对准，该对准包括在第一衬底上提供至少一个芯片对准标记 （其中芯片对准标记对应于芯片的第二侧上的芯片焊盘），并将对准标记与衬底上的衬底焊盘对准。

    Directly connected heat exchanger tube section and coolant-cooled structure
    14.
    发明授权
    Directly connected heat exchanger tube section and coolant-cooled structure 有权
    直接连接热交换器管段和冷却剂冷却结构

    公开(公告)号：US08687364B2

    公开(公告)日：2014-04-01

    申请号：US13283933

    申请日：2011-10-28

    申请人： Timothy J. Chainer ,  Patrick A. Coico ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

    发明人： Timothy J. Chainer ,  Patrick A. Coico ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

    IPC分类号： H05K7/20

    CPC分类号： B23P15/26 ,  H05K7/20781 ,  H05K7/20827 ,  Y10T29/4935 ,  Y10T29/49826

    摘要： A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

    摘要翻译： 提供了一种用于电子机架的冷却装置，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。 与电子机架相关联并设置成冷却通过齿条的空气的热交换器包括多个不同的冷却剂承载管部分，每个管部分具有冷却剂入口和冷却剂出口，其中一个耦合 与冷却剂回路流体连通以便于冷却剂流过管段。 冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。 该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

    Compliant leads for area array surface mounted components
    15.
    发明授权
    Compliant leads for area array surface mounted components 失效
    符合区域阵列表面安装元件的导线

    公开(公告)号：US06339534B1

    公开(公告)日：2002-01-15

    申请号：US09434269

    申请日：1999-11-05

    申请人： Patrick A. Coico ,  Luc Guerin

    发明人： Patrick A. Coico ,  Luc Guerin

    IPC分类号： H05K702

    CPC分类号： H05K13/0465 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01R12/57 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2224/0401

    摘要： An area array integrated circuit package having contact pads is provided with compliant rectangular shaped connection leads each attached to a contact pad. The leads are arranged and oriented on the surface of the package around the neutral point of the package such that the flat width dimension of each lead faces the neutral point of the contact array, thereby offering optimal compliance against thermally induced deformation and resulting in improved interconnection reliability.

    摘要翻译： 具有接触焊盘的区域阵列集成电路封装设置有各自附接到接触焊盘的柔性矩形连接引线。 引线被布置和定向在封装的中性点周围的表面上，使得每个引线的平坦宽度尺寸面向接触阵列的中性点，从而提供对热诱导变形的最佳顺应性，并且导致改善的互连 可靠性。

    Electronic module adjustment design and process using shims
    16.
    发明授权
    Electronic module adjustment design and process using shims 有权
    电子模块调整设计和使用垫片的过程

    公开(公告)号：US6049456A

    公开(公告)日：2000-04-11

    申请号：US152904

    申请日：1998-09-14

    申请人： Gaetano P. Messina ,  Armando S. Cammarano ,  Patrick A. Coico ,  Ronald L. Hering ,  Eric B. Hultmark ,  Raed A. Sherif

    发明人： Gaetano P. Messina ,  Armando S. Cammarano ,  Patrick A. Coico ,  Ronald L. Hering ,  Eric B. Hultmark ,  Raed A. Sherif

    IPC分类号： H01L23/40 ,  H05K7/20

    CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/09701

    摘要： A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the module to establish a predetermined dimension between the cover plate and the integrated circuit chips mounted on the substrate for insertion of a thermal paste. The shims may be metal, engineered plastic, or thermally and electrically conductive or nonconductive creep resistant materials able to withstand the stress and load within the module over time. The shim may be a plurality of shims having the same thickness or a plurality of shims having a multiplicity of thicknesses. Most preferably, the shim conforms to the periphery of the cover plate or base plate. A method of determining the proper shim thickness is also described wherein an initial reading of the thickness of the cover plate and base plate of the module is obtained. A second reading of the thickness of the module is obtained after the substrate, mounted with at least one integrated circuit chip, is placed onto the base plate followed by a temporary spacer and the cover plate. One or more shims are selected which are equal to the difference between the initial reading and the second reading. The cover plate is removed and the spacer is replaced with the appropriate shim. The cover plate is then fastened to the base plate. Also described is a kit for fixing the thermal paste gap dimension in electronic modules comprising a base plate, cover plate, and a plurality of shims having a multiplicity of thicknesses.

    摘要翻译： 描述了用于冷却安装在基板上的一个或多个集成电路芯片的热传导模块。 在基板和模块的盖板之间设置至少一个垫片，以在盖板和安装在基板上的用于插入热粘贴的集成电路芯片之间建立预定尺寸。 垫片可以是金属，工程塑料，或导热或非导电的抗蠕变材料，能够经受住模块内的应力和负荷。 垫片可以是具有相同厚度的多个垫片或具有多个厚度的多个垫片。 最优选地，垫片符合盖板或底板的周边。 还描述了确定适当垫片厚度的方法，其中获得了模块的盖板和基板的厚度的初始读数。 在安装有至少一个集成电路芯片的基板被放置在基板上，之后是临时间隔件和盖板之后，获得模块厚度的二读。 选择一个或多个垫片，其等于初始读数和第二读数之间的差。 拆下盖板，并用适当的垫片更换垫片。 然后将盖板固定在基板上。 还描述了一种用于将热糊料间隙尺寸固定在包括基板，盖板和多个厚度的多个垫片的电子模块中的套件。